• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.373-376
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• 2008

New glass compositions for lead free, low temperature sealing glass frit was examined in $ZnO-V_2O_5-P_2O_5$ glass system which can be used sealing material for PDP to be made of soda lime glass substrates. Among many glass compositions, KFS-C glass showed low glass transition point (Tg) and good fluidity and adhesion characteristics when it was tested by flow button method at low temperature of $420^{\circ}C$. Its Tg was $317^{\circ}C$ and thermal expansion coefficient (CTE) was $70{\times}10^{-7}/K$. The glass frit was mixed with an organic vehicle to make a paste and it was dispensed and sealed with soda lime glass substrates at $420^{\circ}C$ for 10min. Sealed glass panels also showed good adhesion strength even sealed at low temperature of $420^{\circ}C$.

• Journal of the Korean Ceramic Society
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• v.48 no.2
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• pp.121-126
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• 2011

The study investigates the effects of a body that influences the nucleation and growth of crystal by experiment the application of zinc crystalline glaze to five of the most favorably used kinds of bodies sold in the market. As a result, in all bodies used in the test, willemite crystal is appeared on the surface and in the case of white porcelain, super white and white porcelain sculpture clay, beautiful crystals is developed. The reason that crystal does not grow and trickle down by sticking to the body in celadon clay and Sanchung clay is the large surface tension of glaze by ingredient CaO which is more often present compared to other bodies. In glaze, the ingredients $Al_2O_3$ and RO greatly influences the surface tension, and adhesion of the glaze and the body is completed by the glaze's power to stick, which is determined by the reaction of both the glaze and the body. However, in the case of Sanchung clay, the CaO in body reacts to the glaze, and glaze, on Sanchung clay, has tendency to run more compared with other bodies. It is supposed that this mechanism influences the growth of willemite crystal and the glaze's adhesion to the body.

• Proceedings of the Korea Concrete Institute Conference
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• 2005.11a
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• pp.803-806
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• 2005

The effect of coating method and binder content on the tensile adhesion strength, water absorption and cl- penetration depth of polymer-modified pastes using redispersible polymer powders and ceramic powder are examined. As a result, the tensile adhesion strength of the polymer-modified pastes tend to increase with increasing binder content and: number of coating. The water absorption and cl- penetration depth of the polymer-modified pastes tend to decrease with increasing binder content and number of coating.

• Journal of the Korean Ceramic Society
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• v.41 no.6
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• pp.430-434
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• 2004

The values of fracture energy and mechanical flexural strength of Fiber Reinforced Cement (FRC) with polypropylene (PP) fiber modified by Ion Assisted Reaction (JAR), by which functional groups were grafted on the surface of PP fiber, was improved about 2 times as those of fracture energy and flexural strength of cement reinforced by untreated PP fiber. PP fiber was irradiated in O$_2$ environment by Ar$\^$+/ ion. The contact angle of PP treated by IAR decreased largely when compared with untreated PP. From this result, we expected that surface energy and interfacial adhesion force of treated PP fiber increased. The strain hardening occurred in the strain-stress curve of FRC including PP treated by IAR when compared with that of FRC with untreated PP. These enhanced mechanical properties might be due to strong interaction between hydrophilic group on modified PP fiber and hydroxyl group in cement matrix. This hydrophilic group on surface modified PP fiber was confirmed by XPS analysis. We clearly observed hydration products that were fixed at modified PP fiber due to the strong adhesion force of interface in cement reinforced modified PP by SEM (Scanning Electron Microscopy) study.

• Journal of the Korean Society for Precision Engineering
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• v.30 no.12
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• pp.1253-1258
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• 2013

Ceramic particles as polishing abrasives are often used in a magnetic abrasive polishing process because they have strong wear resistance. Non-ferromagnetic ceramic abrasives should be mixed with ferromagnetic iron particles for controlling the mixture within a magnetic brush during the polishing process. This study describes the application of the ceramic particles for the magnetic abrasive polishing. The distribution of the magnetic abrasives attached on a tool varies with magnetic flux density and tool rotational speed. From the correlation between abrasive adhesion ratio in the tool and surface roughness produced on a workpiece, practical polishing conditions can be determined. A step-over for polishing a large sized workpiece is able to be selected by a S curve, and an ultrasonic vibration assisted MAP produces a better surface roughness and increases a polishing efficiency.

• Journal of the Korean Ceramic Society
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• v.40 no.10
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• pp.931-935
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• 2003

A complex-shaped part was successfully fabricated by Laminate Object Manufacturing (LOM) technique using silicon nitride tape with aligned silicon nitride whisker seeds. The ceramic tape was cut using a commercial cutting plotter according to the cross section drafts generated by slicing a 3-D model, and then the tapes were stacked sequentially. In order to improve adhesion between the tapes, stacking was performed under vacuum. After binder burnout, the part was encapsulated using latex emulsion and was cold isostaically pressed under 250 ㎫. It was sintered to 98.5% TD at 2148 K for 4 h under 2 ㎫ nitrogen pressure.

• Journal of the Korean Ceramic Society
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• v.41 no.10 s.269
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• pp.728-734
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• 2004

The effect of microstructure of WC-Co substrates which have different WC grain sizes from submicron to 5 $\mu$m on the diamond-substrate adhesion strength was investigated. The substrates were pre-treated by two methods : chemical etching with Murakami's solution and subsequently with $H_2SO_4$, and thermal heat-treatment. The adhesion strength was estimated by degree of peeling after Rockwell indentation. Diamond films of 20 $\mu$m thickness deposited on the heat-treated substrates showed an excellent adhesion strength at the load of 100 kg, which ascribed to the large and elongated WC grains. However, the cutting edge of insert was deformed after heat treatment and the surface morphology of heat treated substrate strongly affected on the surface roughness of the deposited diamond films. On the contrary, the diamond film of 10 $\mu$m in thickness on the chemically etched substrates of average WC grain size over 2 $\mu$m showed good adhesion strength enough not to peel-off under a load of 60 kg. Especially, the substrate of average WC grain size over 5 $\mu$m exhibited much improved reliability of adhesion comparing with the substrate of average grain size under 2 $\mu$m. No substrate deformation was observed in this case after the chemical etching, which is more advantageous and more practical in terms of precious machining than the heat treatment case.

• Korean Journal of Materials Research
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• v.23 no.3
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• pp.206-210
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• 2013

In the segmented-in-series solid-oxide fuel cells (SIS-SOFCs), fabrication techniques which use decalcomania paper have many advantages, i.e., an increased active area of the electrode; better interfacial adhesion property between the anode, electrolyte and cathode; and improved layer thickness uniformity. In this work, a cell-stack was fabricated on porous ceramic flattened tube supports using decalcomania paper, which consists of an anode, electrolyte, and a cathode. The anode layer was $40{\mu}m$ thick, and was porous. The electrolyte layers exhibited a uniform thickness of about $20{\mu}m$ with a dense structure. Interfacial adhesion was improved due to the dense structure. The cathode layers was $30{\mu}m$ thick with porous structure, good adhesion to the electrolyte. The ohmic resistance levels at 800, 750 and $700^{\circ}C$ were measured, showing values of 1.49, 1.58 and $1.65{\Omega}{\cdot}cm^2$, respectively. The polarization resistances at 800, 750 and $700^{\circ}C$ were measured to be 1.63, 2.61 and $4.17cm^2$, respectively. These lower resistance values originated from the excellent interfacial adhesion between the anode, electrolyte and cathode. In a two-cell-stack SOFC, open-circuit voltages(OCVs) of 1.915, 1.942 and 1.957 V and maximum power densities(MPD) of 289.9, 276.1 and $220.4mW/cm^2$ were measured at 800, 750 and $700^{\circ}C$, respectively. The proposed fabrication technique using decalcomania paper was shown to be feasible for the easy fabrication of segmented-in-series flattened tube SOFCs.

• The Journal of Advanced Prosthodontics
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• v.5 no.3
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• pp.341-350
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• 2013

PURPOSE. To evaluate adherence of human gingival fibroblasts (HGFs) to transmucosal abutment of dental implant with different surface conditions with time and to investigate the roles of focal adhesion linker proteins (FALPs) involved in HGFs adhesion to abutment surfaces. MATERIALS AND METHODS. Morphologies of cultured HGFs on titanium and ceramic discs with different surface were observed by scanning electron microscopy. Biocompatibility and focal adhesion were evaluated by ultrasonic wave application and cell viability assay. FALPs expression levels were assessed by RT-PCR and western blot. RESULTS. There seemed to be little difference in biocompatibility and adhesion strength of HGFs depending on the surface conditions and materials. In all experimental groups, the number of cells remaining on the disc surface after ultrasonic wave application increased more than 2 times at 3 days after seeding compared to 1-day cultured cells and this continued until 7 days of culture. FALPs expression levels, especially of vinculin and paxillin, also increased in 5-day cultured cells compared to 1-day cultured fibroblasts on the disc surface. CONCLUSION. These results might suggest that the strength of adhesion of fibroblasts to transmucosal abutment surfaces increases with time and it seemed to be related to expressions of FALPs.

• Journal of the Korean Ceramic Society
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• v.29 no.11
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• pp.863-869
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• 1992

A SOG(spin glass) solution with excellent wetting to Si wafers was prepared by acid-hydrolysis of Si(OEt)4 and Me2Si(OEt)2. The solution was spin coated on Si wafers, and effects of heat treatment of the film were characterized by TG/DTA, FTIR and Ellipsometry. Silica film was obtained by heat treatment at $600^{\circ}C$ within one hour, but heat treatment at 80$0^{\circ}C$ caused interfacial oxidation of the silicon substrate. Unexpectedly silica films with much better adhesion were obtained by curing at $600^{\circ}C$ for over 30 min. than those obtained by thermal oxidation.