• Title/Summary/Keyword: Cell interconnection

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Optical Noise Reduction using a Solar Cell in a Wireless Optical Interconnection (무선광 연결에서 솔라 셀을 이용한 잡음광 소거)

  • 이성호
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.14 no.4
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    • pp.336-342
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    • 2003
  • In this paper, a new differential detector is introduced, in which a solar cell is used to reduce the low frequency interference from environmental optical noise. The solar cell also supplies electrical power to the detector circuit using the optical noise power. The DC voltage from the solar cell is used as a power supply to the detector, and the AC voltage is used to reduce the optical noise in a photodiode with the differential detection method. The signal to noise ratio was improved by about 20 dB.

Solid Oxide Fuel Cells Designs, Materials, and Applications

  • Singhal Subhash C.
    • Journal of the Korean Ceramic Society
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    • v.42 no.12 s.283
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    • pp.777-786
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    • 2005
  • The Solid Oxide Fuel Cell (SOFC) is an electrochemical device to convert chemical energy of a fuel into electricity at temperatures from about 600 to $1000^{\circ}C$. The SOFC offers certain advantages over lower temperature fuel cells, notably its ability to use CO as a fuel rather than being poisoned by it, and high grade exhaust heat for combined heat and power, or combined cycle gas turbine applications. This paper reviews the operating principle, materials for different cell and stack components, cell designs, and applications of SOFCs. Among all designs of Solid Oxide Fuel Cells (SOFCs), the most progress has been achieved with the tubular design. However, the electrical resistance of tubular SOFCs is high, and specific power output $(W/cm^2)$ and volumetric power density $(W/cm^3)$ low. Planar SOFCs, in contrast, are capable of achieving very high power densities.

The comparison of maximum output power of PV module by solar cell breakage (PV 모듈에서 셀의 파손에 따른 전기적 출력 특성 비교)

  • Lee, Jin-Seob;Kang, Gi-Hwan;Park, Chi-Hong;Yu, Gwon-Jong;Ahn, Hyung-Gun;Han, Deuk-Young
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2007.06a
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    • pp.9-10
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    • 2007
  • In this paper, we investigated the effect of solar cell breakage on maximum output power of PV module. The test result using artificial light source didn't give any change in output power in case of crack near electrical ribbon. Also, there was a reduction in output power in case of increasing of crack area far from electrical ribbon. But, this experiment is under artificial light source test method. So, when such a PV module is outdoor for a long time, there would be problems on electrical output power and durability because of thermal aging phenomenon of solar cell breakage.

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CHARACTERISTICS OF LOW-TEMPERATURE PROCESSED DYE-SENSITIZED SOLAR CELL BY ELECTROCHEMICAL IMPEDANCE AND PHOTOCURRENT-PHOTOVOLTAGE TRANSIENT SPECTROSCOPY

  • Li, Yuelong;Lee, Doh-Kwon;Kim, Kyung-Kon;Ko, Min-Jae
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.02a
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    • pp.381-381
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    • 2011
  • In this study, a TiO2 colloidal sol was synthesized by sol-gel process, which was used as a "glue" agent to enhance interconnection of TiO2 particles in low temperature process for plastic dye sensitized solar cell. The crystalline phase of this TiO2 glue is pure anatase with average particles size of 5 nm, which was characterized by powder X-ray diffraction and high revolution-TEM. The viscous alcoholic paste without any organic binder was prepared from the mixture of commercial P25 powder and glue. Paste composition and sintering process parameters were optimized for high photovoltaic performance based on low temperature process. The electrochemical impedance spectroscopy and photocurrent-photovoltage transient spectroscopy were also employed to investigate the mechanism of electron transport in this binder free TiO2 film system.

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Power Control and Ground Fault Simulations for a Distribution System with a Fuel Cell Power Plant

  • Hwang, Jin-Kwon;Choi, Tae-Il
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.24 no.7
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    • pp.9-19
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    • 2010
  • Fuel cell (FC) distributed generation (DG) is gradually becoming more attractive to mainstream electricity users as capacity improves and costs decrease. New technologies including inverters are becoming available to provide a uniform standard interconnection of DGs with an electric power system. Some of the operating conflicts and the effect of DG on power quality are addressed and investigated through simulations on a real distribution network with an FC power plant. The results of these simulations have proved load tracking capability following the real and reactive power change of the load and have shown the flow of overcurrent from an FC power plant during the ground fault of a distribution line.

The Research on Performance of PCB type of Solar cell BusBar Formed by Layer Structure (적층구조로 형성된 PCB형 태양전지용 BusBar의 성능에 관한 연구)

  • Jeon, Taeg-Jong;Cho, Nam-Cheol;Lee, Chae-Moon
    • 한국태양에너지학회:학술대회논문집
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    • 2012.03a
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    • pp.102-107
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    • 2012
  • The purpose of thesis is to improve output of solar cell module by enhancing transmission efficiency. To improve transmission efficiency, transmission interconnection ribbon which is used to connect solar cells and busbar which contacts with it has been improved. To secure reliability, comparison research on output of solar cell modules has been conducted by manufacturing PCB module formed by laminated metal with the same output. The result of this research is based on a output efficiency test of modules by comparing electric conductivity of soldering busbar and laminated PCV type of busbar.

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A Study on the Optimization of CP Based Low-temperature Tabbing Process for Fabrication of Thin c-Si Solar Cell Module (박형 태양전지모듈 제작을 위한 저온 CP 공정 최적화에 관한 연구)

  • Jin, Ga-Eon;Song, Hyung-Jun;Go, Seok-Whan;Ju, Young-Chul;Song, Hee-eun;Chang, Hyo-Sik;Kang, Gi-Hwan
    • Journal of the Korean Solar Energy Society
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    • v.37 no.2
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    • pp.77-85
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    • 2017
  • Thin crystalline silicon (C-Si) solar cell is expected to be a low price energy source by decreasing the consumption of Si. However, thin c-Si solar cell entails the bowing and crack issues in high temperature manufacturing process. Thus, the conventional tabbing process, based on high temperature soldering (> $250^{\circ}C$), has difficulties for applying to thin c-Si solar cell modules. In this paper, a conductive paste (CP) based interconnection process has been proposed to fabricate thin c-Si solar cell modules with high production yield, instead of existing soldering materials. To optimize the process condition for CP based interconnection, we compared the performance and stability of modules fabricated under various lamination temperature (120, 150, and $175^{\circ}C$). The power from CP based module is similar to that with conventional tabbing process, as modules are fabricated. However, the output of CP based module laminated at $120^{\circ}C$ decreases significantly (14.1% for Damp heat and 6.1% for thermal cycle) in harsh condition, while the output drops only in 3% in the samples process at $150^{\circ}C$, $175^{\circ}C$. The peel test indicates that the unstable performance of sample laminated at $120^{\circ}C$ is attributed to weak adhesion strength (1.7 N) between cell and ribbon compared to other cases (2.7 N). As a result, optimized lamination temperature for CP based module process is $150^{\circ}C$, considering stability and energy consumption during the fabrication.

Soft-switching Current Source Inverter for Interconnection of Solar Cell with Power System (태양전지의 개통연계를 위한 소프트스위칭 전류원 인버터)

  • Choy, Young-Do;Park, Sang-Ho;Kim, Hee-Joong;Han, Byung-Moon
    • Proceedings of the KIEE Conference
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    • 2000.11b
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    • pp.345-347
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    • 2000
  • This paper proses a soft-switching current-source inverter with a switched-capacitor module. The system operation was analyzed by a theoretical approach with equivalent circuits and verified by a computer simulation and experiment. The proposed system could be effectively applied for the power converter of photovoltaic power generation interconnected with the power system.

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Effects of PCB Patterns on EMI Measurement in TEM Cell and Proposal of PCB Design Guidelines (TEM 셀에서 PCB 패턴이 EMI 측정에 미치는 영향 및 PCB 설계 가이드라인 제시)

  • Choi, Minkyoung;Shin, Youngsan;Lee, Seongsoo
    • Journal of IKEEE
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    • v.21 no.3
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    • pp.272-275
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    • 2017
  • Recently, semiconductor integration density enormously increases and its interconnection width is significantly narrowed, which leads to EMI (electromagnetic interference) problems on chip level. Chip manufacturer exploits TEM cell (transverse electromagnetic cell) to measure EMI on chip level, which requires PCB (printed circuit board) for measurement purpose. However, it is often neglected to consider that PCB patterns and other factors can affect on EMI measurement. In this paper, several test patterns are designed for different PCB design variables, and effects of PCB patterns on EMI measurement in TEM cell are analyzed. Based on these analyses, PCB design guidelines are also proposed to minimize the effects on EMI measurements.

Cu Metallization for Giga Level Devices Using Electrodeposition (전해 도금을 이용한 기가급 소자용 구리배선 공정)

  • Kim, Soo-Kil;Kang, Min-Cheol;Koo, Hyo-Chol;Cho, Sung-Ki;Kim, Jae-Jeong;Yeo, Jong-Kee
    • Journal of the Korean Electrochemical Society
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    • v.10 no.2
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    • pp.94-103
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    • 2007
  • The transition of interconnection metal from aluminum alloy to copper has been introduced to meet the requirements of high speed, ultra-large scale integration, and high reliability of the semiconductor device. Since copper, which has low electrical resistivity and high resistance to degradation, has different electrical and material characteristics compared to aluminum alloy, new related materials and processes are needed to successfully fabricate the copper interconnection. In this review, some important factors of multilevel copper damascene process have been surveyed such as diffusion barrier, seed layer, organic additives for bottom-up electro/electroless deposition, chemical mechanical polishing, and capping layer to introduce the related issues and recent research trends on them.