• The Transactions of The Korean Institute of Electrical Engineers
• /
• v.56 no.6
• /
• pp.1165-1169
• /
• 2007

In this study, a novel sensor system for measuring the temperature inside an oral cavity is proposed. With this aim, a small size of thermistor was used for resolving the cavity's temperature with the resolution of $0.1^{\circ}C$. To evaluate effectiveness of our sensor system, the temperature and its output voltage characteristic, and the specifications of response are investigated. It turned out to be that our sensor system has a linear property in terms of temperature variations for a healthy subject's body temperature range and has a good response time within 3 seconds. Also, in order to investigate the medical application, our sensor system is sought to measure the real temperature variations of a subject's oral cavity and ark shell especially for 'before' and 'after' exercise mode.

• ETRI Journal
• /
• v.38 no.4
• /
• pp.685-694
• /
• 2016

A surface micromachined piezoresistive pressure sensor with a novel internal substrate vacuum cavity was developed. The proposed internal substrate vacuum cavity is formed by selectively etching the silicon substrate under the sensing diaphragm. For the proposed cavity, a new fabrication process including a cavity side-wall formation, dry isotropic cavity etching, and cavity vacuum sealing was developed that is fully CMOS-compatible, low in cost, and reliable. The sensitivity of the fabricated pressure sensors is 2.80 mV/V/bar and 3.46 mV/V/bar for a rectangular and circular diaphragm, respectively, and the linearity is 0.39% and 0.16% for these two diaphragms. The temperature coefficient of the resistances of the polysilicon piezoresistor is 0.003% to 0.005% per degree of Celsius according to the sensor design. The temperature coefficient of the offset voltage at 1 atm is 0.0019 mV and 0.0051 mV per degree of Celsius for a rectangular and circular diaphragm, respectively. The measurement results demonstrate the feasibility of the proposed pressure sensor as a highly sensitive circuit-integrated pressure sensor.

• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 2005.09a
• /
• pp.132-140
• /
• 2005

It is well known that the family-mold has an advantage to reduce the cost for production and mold. However, defects are frequently occurred by over packing the smaller volume cavity during molding, especially whorl the family-mold has a volumetric difference between two cavities. In this study, we confirmed the cavity-filling imbalance by the temperature and the pressure sensors, and developed a variable-runner system for the cavity-filling balance. We carried out experiments fur balancing the cavity filling in the family-mold with the variable-runner system, and confirmed a balanced cavity-filing through analyzing the temperature and pressure change in each cavity as the cross-sectional area of the runner changed. We also examined the influence of the injection-speed to the balancing-capability of the variable-runner system in the experiment.

• Transactions of Materials Processing
• /
• v.15 no.1 s.82
• /
• pp.47-56
• /
• 2006

It is well known that the family-mold has an advantage to reduce the cost for production and mold. However, defects are frequently occurred by over packing the smaller volume cavity during molding, especially when the family-mold has a volumetric difference between two cavities. In this study, the cavity-filling imbalance was confirmed by the temperature and the pressure sensors, and a variable-runner system was developed for balancing the cavity-filling. Experiments of balancing the cavity filling was carried out in the family-mold with the variable-runner system, and balancing the cavity-filling was confirmed by changing the cross-sectional area of a runner in the variable-runner system with the temperature and pressure sensors. The influence of the injection speed to the balancing-capability of the variable-runner system was also examined in the experiment.

• Journal of the Korean Institute of Telematics and Electronics D
• /
• v.35D no.5
• /
• pp.63-68
• /
• 1998

The absolute pressure sensor using SDB wafer has been fabricated. the structure of the sensor consists of two wheatstone bridges and a diaphragm. One of the two wheatstone bridges is located on the edge of diaphragm, and the other is located on the center of diaphragm. The diaphragm cavity is sealted in vacuum (~10$^{5}$ Torr) to reduce the effect of temperature due to the vapor in the cavity on the sensitivity of pressure sensor. This is the minor method of temperature compensation method. In this experiment the main compensation method is to use the difference of the two bridge offset voltages. The drift of offset voltage with temperature is reduced by using this method so that temperature charcteristics is improved. In this method the temperature effect in the range of 22~100.deg. C was compensated over 80%.

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.16 no.6
• /
• pp.81-86
• /
• 2017

The high-pressure resin transfer molding (HP-RTM) process has a very effective for the mass production of carbon fiber reinforced plastic (CFRP) for light weight in the automotive industry. In developing robust equipment, new process and fast cure matrix systems reduces significantly the cycle time less than 5 minutes in recent years. This paper describes the cavity pressure, temperature and molding characteristics of the HP-RTM process. The HP-RTM mold was equipped with two cavity pressure sensors and three temperature sensors. The cavity pressure characteristics of the HP-RTM injection, pressurization, and curing processes were studied. This experiment was conducted with selected process parameters such as mold cap size, maximum press force, and injection volume. Consequently, this monitoring method provides correlations between the selected process parameters and final forming characteristics in this work.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2005.06a
• /
• pp.1416-1419
• /
• 2005

Design and manufacturing of plastic injection mold with cavity pressure/temperature sensors were performed in the present study for tensile test specimen. Standards of mold-base and tensile test specimen were used to design an injection molding system. Cavity pressure and temperature sensors were placed on the side of fixed platen of injection mold machine to prevent them from external impact damage. Injection molding experiments with variations of injection speed and melt temperature were performed and polycarbonate tensile specimens were prepared for the tensile test. It was shown that injection molding processing parameters can have effect on the mechanical properties of the plastic injection molded part.

• Journal of the Korean Society for Precision Engineering
• /
• v.24 no.11
• /
• pp.84-90
• /
• 2007

In this study, design and manufacturing of plastic injection mold with cavity pressure/temperature sensors were performed fur tensile test specimen. International standard system for plastic tensile specimen was applied to design an injection molding system. Cavity pressure and temperature sensors were placed on the side of fixed platen of the injection mold to prevent them from external impact damage. Injection molding experiments with variations of injection speed and melt temperature were performed and then tensile test of the manufactured polycarbonate specimens was also performed. It was shown that injection molding processing parameters can have effect on the mechanical properties of the plastic injection molded part.

• Journal of Sensor Science and Technology
• /
• v.12 no.5
• /
• pp.199-204
• /
• 2003

This paper describes on the fabrication and characteristics of a ceramic thin-film pressure sensor based on Ta-N strain-gauges for harsh environment applications. The Ta-N thin-film strain-gauges are sputter-deposited onto a micromachined Si diaphragms with buried cavity for overpressure protectors. The proposed device takes advantages of the good mechanical properties of single-crystalline Si as diaphragms fabricated by SDB and electrochemical etch-stop technology, and in order to extend the operating temperature range, it incorporates relatively the high resistance, stability and gauge factor of Ta-N thin-films. The fabricated pressure sensor presents a low temperature coefficient of resistance, high-sensitivity, low non-linearity and excellent temperature stability. The sensitivity is $1.097-1.21\;mV/V{\codt}kgf/cm^2$ in the temperature range of $25-200^{\circ}C$ and the maximum non-linearity is 0.43%FS.

• Proceedings of the KSME Conference
• /
• 2008.11a
• /
• pp.1951-1956
• /
• 2008

Various MEMS accelerometers are used in engineering applications including automobiles, mobile phones, military systems, and electronic devices. Among them, the thermal accelerometer employing the temperature difference induced by the convective flow inside the micro cavity has been a topic of interest. As the convective sensor does not utilize a solid proof mass, it is compact, lightweight, inexpensive to manufacture, sensitive and highly endurable to mechanical shock. However, the complexity of the convective flow and various design constraints make optimization of a device a crucial step before fabrication. In this work, optimization of a 2-axis thermal convective MEMS accelerometer is conducted based on 3-dimensional numerical simulation. Parametric studies are performed by varying the several design variables such as the heater shape/size, the cavity size and types of the gas medium and the position of temperature probes in the sensor. The results of optimal design are presented.