• Title/Summary/Keyword: CPU 쿨러

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CFD Analysis of CPU Water Cooler Jacket (CPU 수냉식 쿨러 자켓의 유동해석)

  • Lee Jong-sun;Park Dong-Seuk
    • Proceedings of the KAIS Fall Conference
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    • 2005.05a
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    • pp.75-78
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    • 2005
  • 본 논문은 CPU의 수냉식 쿨러 자켓에 대하여 CFD(computational fluid dynamics) 해석을 수행하여 내부면적이 큰 쿨러 자켓의 효율이 어느 정도 좋은 지를 내부면적이 작은 쿨러 자켓과 비교 분석한다. 쿨러 자켓이 냉각수와 열 교류를 원활히 할 수 있도록 쿨러 자켓의 온도분포를 통하여 적절한 형상을 설계하여 CPU 수냉식 쿨러 자켓의 제작시 설계 자료로 이용하고자 한다.

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Computational Fluid Dynamic Analysis of Cooler Jacket (쿨러 자켓의 유동해석)

  • Lee Jong-Sun
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.7 no.1
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    • pp.1-6
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    • 2006
  • The objective of this study is CFD analysis of CPU cooler jacket. The ANSYS code using was for this CFD analysis. In order to analysis of CPU cooler jacket, many variables such as boundary condition, conductivity, mass density, specific heat were considered. This analysis results are compare to small inner size jacket and large inner size Jacket.

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A Convergent Investigation on the thermal and stress analyses of CPU Cooler (CPU 쿨러의 열 및 응력 해석에 관한 융합 연구)

  • Choi, Kye-Kwang;Cho, Jae-Ung
    • Journal of the Korea Convergence Society
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    • v.11 no.8
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    • pp.153-158
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    • 2020
  • In this study, the thermal and stress analyses were performed by applying a temperature condition of 100℃ at CPU cooler model. The value of heat flux value is shown to be the most at the lower rod area. The upper part becomes, the smaller the heat flow rate. The highest temperature is shown at the bottom of the CPU cooler model. Overall, the upper part becomes, the smaller the temperature becomes. Based on the temperature analysis, the thermal deformation caused by expansion, the deformation becomes smaller as the upper part of the overlapping plates. The great deformation happens at the bent area of the small rod as the lower part of model and the least deformation is shown at the lowest floor of model. In addition, the maximum thermal stress of 570.63 MPa happens at the floor below model. The stress is shown to decrease as the upper part of the overlapping plates becomes. But the stress is shown to increase somewhat at the middle part of model. By applying the study result on the thermal and stress analyses of CPU cooler, this study is seen to be suitable for the aesthetic convergence.

Cooling Performance of Liquid CPU Cooler using Water/PG-based $Al_2O_3$ Nanofluids (물/PG-기반 $Al_2O_3$ 나노유체를 적용한 수냉식 CPU 쿨러의 냉각성능)

  • Park, Y.J.;Kim, K.H.;Lee, S.H.;Jang, S.P.
    • Journal of ILASS-Korea
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    • v.19 no.1
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    • pp.19-24
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    • 2014
  • In this study, the cooling performance of a liquid CPU cooler using the water/propylene glycol(PG)-based $Al_2O_3$ nanofluids is experimentally investigated. Water/PG-based $Al_2O_3$ nanofluids are manufactured by two-step method with ultrasonic energy for 10 hours. The volume fractions of the nanofluids are 0.25% and 0.35%. Thermal conductivity and viscosity of the nanofluids are measured to theoretically predict the thermal performance of the liquid CPU cooler using performance factor. Performance factor results indicate that the cooling performance of the liquid CPU cooler can be improved using the manufactured nanofluids. To evaluate the cooling performance of the liquid CPU cooler experimentally, temperature differences between ambient air and heater are measured for base fluid and nanofluids respectively. Based on the results, it is shown that performance of the liquid CPU cooler using $Al_2O_3$ nanofluids is improved maximum up to 8.6% at 0.25 Vol.%.