• Journal of the Korean Institute of Telematics and Electronics A
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• v.33A no.2
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• pp.184-195
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• 1996

Beause BiCMOS logic circuits consist of CMOS part which constructs logic function and bipolar part which drives output load, the effect of short faults on BiCMOS logic circuits represented different types from that on CMOS. This paper proposes new test method which detects short faults on BiCMOS logic circuits using current path graph. Proposed method transforms BiCMOS circuits into raph constructed by nodes and edges using extended switch-level model and separates the transformed graph into pull-up part and pull-down part. Also, proposed method eliminates edge or add new edge, according ot short faults on terminals of transistor, and can detect short faults using current path graph that generated from on- or off-relations of transistor by input patterns. Properness of proposed method is verified by comparing it with results of spice simulation.

• JSTS:Journal of Semiconductor Technology and Science
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• v.12 no.1
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• pp.75-87
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• 2012

A design paradigm using sequential geometric programming is presented to accurately design CMOS op amps with BSIM3. It is based on new adaptive modeling of transistor parameters through the operating point simulation. This has low modeling cost as well as great simplicity and high accuracy. The short-channel dc, high-frequency small-signal, and short-channel noise models are used to characterize the physical behavior of submicron devices. For low-power and low-voltage design, this paradigm is extended to op amps operating in the subthreshold region. Since the biasing and modeling errors are less than 0.25%, the characteristics of the op amps well match simulation results. In addition, small dependency of design results on initial values indicates that a designed op amp may be close to the global optimum. Finally, the design paradigm is illustrated by optimizing CMOS op amps with accurate transfer function.

• Journal of Sensor Science and Technology
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• v.30 no.5
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• pp.295-299
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• 2021

In this study, we present a complementary metal-oxide-semiconductor (CMOS) binary image sensor. It can shoot an object rotating at a high-speed by using a gate/body-tied (GBT) p-channel metal-oxide-semiconductor field-effect transistor (PMOSFET)-type photodetector. The GBT PMOSFET-type photodetector amplifies the photocurrent generated by light. Therefore, it is more sensitive than a standard N+/P-substrate photodetector. A binary operation is installed in a GBT PMOSFET-type photodetector with high-sensitivity characteristics, and the high-speed operation is verified by the output image. The binary operations circuit comprise a comparator and memory of 1- bit. Thus, the binary CMOS image sensor does not require an additional analog-to-digital converter. The binary CMOS image sensor is manufactured using a standard CMOS process, and its high- speed operation is verified experimentally.

• Journal of IKEEE
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• v.11 no.1 s.20
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• pp.69-76
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• 2007

This paper presents the design of LVDS (Low-Voltage-Differential-Signaling) transmitter for Gb/s-per-pin operation. The proposed LVDS transmitter is designed using BiCMOS technology, which can be compatible with CMOS technology. To reduce chip area and enhance the robustness of LVDS transmitter, the MOS switches of transmitter are replaced with lateral bipolar transistor. The common emitter current gain($\beta$) of designed bipolar transistor is 20 and the cell size of LVDS transmitter is $0.01mm^2$. Also the proposed LVDS driver is operated at 1.8V and the maximum data rate is 2.8Gb/s approximately In addition, a novel ESD protection circuit is designed to protect the ESD phenomenon. This structure has low latch-up phenomenon by using turn on/off character of P-channel MOSFET and low triggering voltage by N-channel MOSFET in the SCR structure. The triggering voltage and holding voltage are simulated to 2.2V, 1.1V respectively.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.30A no.2
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• pp.63-75
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• 1993

As the CMOS technology becomes the most dominant circuit realization method, the cost problem for the test which includes both the transistor-level FET stuck-on and stuck-off faults and the gatelevel stuck-at faults becomes more and more serious. In accordance, this paper proposes a test set and its generation algorithm, which handles both the transistor-level faults and the gate-level faults, thus can unify the test steps during the IC design and fabrication procedure. This algorithm uses only the logic equation of the given logic function as the input resource without referring the transistor of gate circuit. Also, the resultant test set from this algorithm can improve in both the complexity of the generation algorithm and the time to apply the test as well as unify the test steps in comparing the existing methods.

• The KIPS Transactions:PartA
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• v.15A no.2
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• pp.69-74
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• 2008

This paper proposes a structure of low-power MOS current-mode logic circuit with sleep-transistor to reduce the leakage current. The sleep-transistor is used to high-threshold voltage transistor to minimize the leakage current. The $16\;{\times}\;16$ bit parallel multiplier is designed by the proposed circuit structure. Comparing with the conventional MOS current-model logic circuit, the circuit achieves the reduction of the power consumption in sleep mode by 1/50. This circuit is designed with Samsung $0.35\;{\mu}m$ CMOS process. The validity and effectiveness are verified through the HSPICE simulation.

• Journal of Sensor Science and Technology
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• v.21 no.6
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• pp.413-419
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• 2012

A dynamic range extension technique is proposed based on a 3-transistor active pixel sensor (APS) with gate/body-tied p-channel metal oxide semiconductor field effect transistor (PMOSFET)-type photodetector using a feedback structure. The new APS consists of a pseudo 3-transistor APS and an additional gate/body-tied PMOSFET-type photodetector, and to extend the dynamic range, an NMOSFET switch is proposed. An additional detector and an NMOSFET switch are integrated into the APS to provide negative feedback. The proposed APS and pseudo 3-transistor APS were designed and fabricated using a $0.35-{\mu}m$ 2-poly 4-metal standard complementary metal oxide semiconductor (CMOS) process. Afterwards, their optical responses were measured and characterized. Although the proposed pixel size increased in comparison with the pseudo 3-transistor APS, the proposed pixel had a significantly extended dynamic range of 98 dB compared to a pseudo 3-transistor APS, which had a dynamic range of 28 dB. We present a proposed pixel that can be switched between two operating modes depending on the transfer gate voltage. The proposed pixel can be switched between two operating modes depending on the transfer gate voltage: normal mode and WDR mode. We also present an imaging system using the proposed APS.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.25 no.5B
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• pp.974-984
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• 2000

A CMOS voltage driver circuit for voltage down converter is proposed. An adaptive biasing technique is used to enhance load regulation characteristics. The proposed driver circuit uses the NMOS transistor as a driving transistor, so it does not suffer from large Miller capacitances which is one of the problems with conventional PMOS driving transistor, and hence achieves good phase margin and stable frequency response. No additional complex circuit for frequency compensation such as compensation capacitor is required in this implementation. For the same current capability, the size of NMOS transistor in driver circuit is smaller than that of PMOS counterpart. So the smaller die area can be achieved. The circuits is implemented using a 0.8 ${\mu}{\textrm}{m}$ CMOS process and has a die area of 150 ${\mu}{\textrm}{m}$ x 360 ${\mu}{\textrm}{m}$. Proposed circuit has a quiescent power of 60 . In the current driving range from 100 $mutextrm{A}$ to 50 ㎃, load regulation of 5.6 ㎷ is measured.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.37 no.11
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• pp.1-8
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• 2000

In this paper, the dependence of interconnect line-induced delay time on the size of CMOSFET gate width is characterized. In case of capacitance dominant interconnect line, the total delay time decreases as transistor size increases. However, there exists a transistor size for minimum total delay time when both of resistance and capacitance of interconnect line become larger than those of transistor. The optimum transistor size for minimum total delay time is obtained using an analytic equation and the experimental results showed good agreement with the calculation.

• JSTS:Journal of Semiconductor Technology and Science
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• v.4 no.1
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• pp.41-44
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• 2004

The trend of decreasing the minimal structure sizes in microelectronics is still being continued. Therefore in its roadmap the Semiconductor Industries Association predicts a printed minimum MOS-transistor channel length of 10 nm for the year 2018. Although the resolution of optical lithography still dramatically increases, there are known and proved solutions for structure sizes significantly below 50 nm up to now. In this work a new method for the fabrication of extremely small MOS-transistors with a channel length and width below 50 nm with low demands to the used lithography will be explained. It's a further development of our deposition and etchback technique which was used in earlier research to produce transistors with very small channel lengths down to 30 nm, with a scaling of the transistor's width. The used technique is proved in a first charge of MOS-transistors with a channel area of W=200 nm and L=80 nm. The full CMOS compatible technique is easily transferable to almost any other technology line and results in an excellent homogeneity and reproducibility of the generated structure size. The electrical characteristics of such small transistor will be analyzed and the ultimate limits of the technique will be discussed.