• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2012.10a
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• pp.1003-1006
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• 2012

The image correction algorithm and system design for CMOS sensor to enhance the image resolution is presented in this paper. The proposed algorithm finds out the image cell from the sensor and process them by the limited memory configuration. The evaluation of the method is done by the designed hardware system. The experimental results are capable of improving contrast per channel and of sensing equalized image quality on an edge of image.

• JSTS:Journal of Semiconductor Technology and Science
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• v.4 no.2
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• pp.106-109
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• 2004

A high-density 3-transistor cell one-time programmable (OTP) ROM array using standard CMOS Gate-Oxide antifuse (AF) is proposed, fabricated, and characterized with $0.18{\mu}m$ CMOS process. The proposed non-volatile high-density OTP ROM is composed of an array of 3-T OTP cells with the 3-T consisting of an nMOS AF, a high voltage (HV) blocking transistor, and a cell access transistor, all compatible with standard CMOS technology.

• Journal of information and communication convergence engineering
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• v.3 no.1
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• pp.28-32
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• 2005

In this paper, we propose a novel test method to effectively detect hard and soft faults in CMOS 2-stage op-amps. The proposed method uses a very high frequency sinusoidal signal that exceeds unit gain bandwidth to maximize the fault effects. Since the proposed test method doesn't require any complex algorithms to generate the test pattern and uses only a single test pattern to detect all target faults, therefore test costs can be much reduced. The area overhead is also very small because the CUT is converted to a unit gain amplifier. Using HSPICE simulation, the results indicated a high degree of fault coverage for hard and soft faults in CMOS 2-stage op-amps. To verify this proposed method, we fabricated a CMOS op-amp that contained various short and open faults through the Hyundai 0.65-um 2-poly 2-metal CMOS process. Experimental results for the fabricated chip have shown that the proposed test method can effectively detect hard and soft faults in CMOS op-amps.

• Journal of Sensor Science and Technology
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• v.30 no.5
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• pp.295-299
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• 2021

In this study, we present a complementary metal-oxide-semiconductor (CMOS) binary image sensor. It can shoot an object rotating at a high-speed by using a gate/body-tied (GBT) p-channel metal-oxide-semiconductor field-effect transistor (PMOSFET)-type photodetector. The GBT PMOSFET-type photodetector amplifies the photocurrent generated by light. Therefore, it is more sensitive than a standard N+/P-substrate photodetector. A binary operation is installed in a GBT PMOSFET-type photodetector with high-sensitivity characteristics, and the high-speed operation is verified by the output image. The binary operations circuit comprise a comparator and memory of 1- bit. Thus, the binary CMOS image sensor does not require an additional analog-to-digital converter. The binary CMOS image sensor is manufactured using a standard CMOS process, and its high- speed operation is verified experimentally.

• Journal of Sensor Science and Technology
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• v.30 no.2
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• pp.82-87
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• 2021

In this paper, we propose a high-speed, low-power complementary metal-oxide semiconductor (CMOS) binary image sensor featuring a gate/body-tied (GBT) p-channel metal-oxide-semiconductor field-effect transistor (PMOSFET)-type photodetector based on a double-tail comparator. The GBT photodetector forms a structure in which the floating gate (n+ polysilicon) and body of the PMOSFET are tied, and amplifies the photocurrent generated by incident light. The double-tail comparator compares the output signal of a pixel against a reference voltage and returns a binary signal, and it exhibits improved power consumption and processing speed compared with those of a conventional two-stage comparator. The proposed sensor has the advantages of a high signal processing speed and low power consumption. The proposed CMOS binary image sensor was designed and fabricated using a standard 0.18 ㎛ CMOS process.

• Journal of Advanced Navigation Technology
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• v.7 no.2
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• pp.206-210
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• 2003

In this paper, we design standard cell libraries using the 0.18um deep submircom CMOS process, and port them into a P&R (Placement and Routing) CAD tool. A simple test chip has been designed in order to verify the functionalities of the 0.18um standard cell libraries whose technical process was provided by Anam semiconductor. Through these experiments, we have found that the new 0.18um CMOS process can be successfully applied to automatic digital system design.

• Journal of Information Processing Systems
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• v.7 no.1
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• pp.93-102
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• 2011

In deeply scaled CMOS technologies, two major non-ideal factors are threatening the survival of the CMOS; i) PVT (process, voltage, and temperature) variations and ii) leakage power consumption. In this paper, we propose a novel post-silicon tuning methodology to scale optimum voltage and frequency "dynamically". The proposed design technique will use our PVT sensor circuits to monitor the variations and based on the monitored variation data, voltage and frequency will be compensated "automatically". During the compensation process, supply voltage is dynamically adjusted to guarantee the minimum total power consumption without violating the frequency requirement. The simulation results show that the proposed technique can reduce the total power by 85% and the static power by 53% on average for the selected ISCAS'85 benchmark circuits with 45 nm CMOS technology compared to the results of the traditional PVT compensation method.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.9
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• pp.54-61
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• 1998

A new Triple well structure is proposed for improved latch-up immunity at deep submicron CMOS device. Optimum latch-up immunity process condition is established and analyzed with varying ion implantation energy and amount of dose and also compared conventional twin well structure. Doping profile and structure are investigated using ATHENA which is process simulator, and then latch-up current is calculated using ATLAS which is device simulator. Two types of different process are affected by latch-up characteristics and shape of doping profiles. Finally, we obtained the best latch-up immunity with 2.5[mA/${\mu}{m}$] trigger current using 2.5 MeV implantation energy and 1$\times$10$^{14}$ [cm$^{-2}$ ] dose at p-well

• Journal of the Korea Institute of Information and Communication Engineering
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• v.24 no.2
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• pp.325-328
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• 2020

This paper demonstrated a voltage-controlled oscillator (VCO) using cost-effective (1-poly 6-metal) mixed signal standard CMOS process. To have the high-quality factor inductor in LC resonator with thin metal thickness, patterned-ground shields (PGS) was adopted under the spiral to effectively reduce the ac current of low resistive Si substrate. And, because of thin top-metal compared with that of RF option (2 ㎛), we make electrically connect between the top metal (M6) and the next metal (M5) by great number of via array along the metal traces. The circuit operated from 2.48 GHz to 2.62 GHz tuned by accumulation-mode varactor device. And the measured phase noise of LC VCO has -123.7 dBc/Hz at 1MHz offset at 2.62 GHz and the dc-power consumption shows 2.07 mW with 1.8V supply voltage, respectively.

• Journal of Electrical Engineering and Technology
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• v.8 no.5
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• pp.1182-1187
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• 2013

Transient radiation is emitted during a nuclear explosion and causes fatal errors as upset and latch-up in CMOS circuits. This paper proposes the transient radiation SPICE models of NMOS, PMOS, and INVERTER based on the transient radiation analysis using TCAD (Technology Computer Aided Design). To make the SPICE model of a CMOS circuit, the photocurrent in the PN junction of NMOS and PMOS was replaced as current source, and a latch-up phenomenon in the inverter was applied using a parasitic thyristor. As an example, the proposed transient radiation SPICE model was applied to a CMOS NAND circuit. The CMOS NAND circuit was simulated by SPICE and TCAD using the 0.18um CMOS process model parameter. The simulated results show that the SPICE results were similar to the TCAD simulation and the test results of commercial CMOS NAND IC. The simulation time was reduced by 120 times compared to the TCAD simulation.