• Journal of the Semiconductor & Display Technology
• /
• v.10 no.4
• /
• pp.139-144
• /
• 2011

CMP process is an essential element in the semiconductor product processes in Chemical Mechanical Polishing. Taken as a whole, CMP is one process, but concretely, it is a detail process which consists of polishing, cleaning, and so on. Especially, the polishing and cleaning are key points in the whole process. Polishing rate is the most important factor and is related with deposition of slurry in the polishing process. Each outlet velocities is the most important factors in cleaning process. And when the velocities are more uniform, the cleaning becomes more effective. In this research, based on these factors, we performed a numerical analysis for effective polishing and cleaning which can be applied to industrial field. Consequently, we figured out that more than one opened nozzle is more effective than one opened nozzle at the polishing pad in case of this research. And we confirmed that the revised models have the uniform velocity distribution more than the previous model of the cleaning nozzle.

• Proceedings of the KSME Conference
• /
• 2008.11b
• /
• pp.2511-2514
• /
• 2008

As the minimum feature size decreases, techniques to avoid contamination and processes to maintain clean wafer surfaces have become very important. The deposition and detachment of nanoparticles from surfaces are major problem to integrated circuit fabrication. Therefore, cleaning technology which reduces nanoparticles is essential to increase yield. Previous megasonic cleaning technology has reached the limits to reduce nanoparticles. Megasonic cleaning is one of the efficiency method to reduce contamination nanoparticle. Two major mechanisms are active in a megasonic cleaning, namely, acoustic streaming and cavitation. Acoustic streaming does not lead to sufficiently strong force to cause damage to the substrates or patterns. Sonoluminescence is a phenomenon of light emission associated with the cavitation of a bubble under ultrasound. We studied a correlation between sonoluminescence and sound pressure distribution for the minimum of pattern damage in megasonic cleaning.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2007.06a
• /
• pp.557-557
• /
• 2007

최근 Ruthenium (Ru)은 높은 화학적 안정성, 누설전류에 대한 높은 저항성, 저유전체와의 높은 안정성 등과 같은 특성으로 인해 캐패시터의 하부전극으로 각광받고 있다. 이렇게 형성된 Ru 하부전극은 각 캐패시터간의 분리와 평탄화를 위해 CMP 공정이 도입되게 되었다. 이러한 CMP 공정후에는 화학적 또는 물리적 상호작용에 의해 웨이퍼 표면에 오염물이 발생할 수 있다. CMP 공정중에 공급되는 슬러리에는 부식액, pH 적정제, 연마입자등이 첨가되는데 이때 사용된 연마입자는 CMP 공정후 입자오염을 유발할 수 있다. 그러므로, CMP 공정후에는 이러한 오염으로 인해 cleaning 공정이 반드시 필요하게 되었다. 하지만, Post Ru CMP cleaning에 대한 연구는 아직 미비한 상태이다. 그리하여 본 연구에서는 post Ru CMP cleaning에 대한 연구와 cleaning solution 그리고 첨가제에 따른 영향을 살펴보았다.

• Laser Solutions
• /
• v.6 no.3
• /
• pp.29-35
• /
• 2003

In semiconductor processing, there are two types of particle contaminated onto the wafer, i.e. dry and wet state particles. In order to evaluate the cleaning performance of laser shock wave cleaning method, the removal of 1 m sized alumina particle at different particle conditions from silicon wafer has been carried out by laser-induced shock waves. It was found that the removal efficiency by laser shock cleaning was strongly dependent on the particle condition, i.e. the removal efficiency of dry alumina particle from silicon wafer was around 97％ while the efficiencies of wet alumina particle in DI water and IPA are 35％ and 55％ respectively. From the analysis of adhesion forces between the particle and the silicon substrate, the adhesion force of the wet particle where capillary force is dominant is much larger than that of the dry particle where Van der Waals force is dominant. As a result, it is seen that the particle in wet condition is much more difficult to remove from silicon wafer than the particle in dry condition by using physical cleaning method such as laser shock cleaning.

• Journal of the Korean institute of surface engineering
• /
• v.45 no.4
• /
• pp.143-150
• /
• 2012

Laser cleaning have been found to be a useful cleaning tool to remove contaminants without inducing damage to the substrate and making secondary pollutant. In this study, the effect of Nd:YAG laser cleaning system, emitting at 1064 nm and 532 nm, on acrylic resin applied onto copper coupons and pieces of bronze was investigated. The samples after laser cleaning tests were examined using microscopy, FT-IR, SEM-EDS. As a result, the acrylic resin could be removed from most of the samples at low laser energy density. Laser wavelength 532 nm was more effective than 1064 nm because of using lower laser energy density, which could reduce heat damage to substrates. Although the acrylic resin was easily removed, it revealed melted surfaces and removed bronze patina which must remain. The problems should be solved by future studies using different laser system or laser wavelengths.

• Membrane and Water Treatment
• /
• v.12 no.2
• /
• pp.65-73
• /
• 2021

Sponge ball cleaning can generate an abrasion effect, which leads to an attractive increasing in both permeate flux and membrane rejection. The aim of this study was to investigate the influence of the daily sponge ball cleaning (SBC) on the performance of different UF cross-flow membrane modules integrated with a bioreactor. Two 1"-membrane modules and one 1/2"-membrane module were tested. The parameters measured and controlled are temperature, pH, viscosity, particle size, dissolved organic carbon (DOC), total suspended solids (TSS), and permeate flux. The permeate flux could be improved by 60%, for some modules, after 11 days of daily sponge ball cleaning at a transmembrane pressure of 350 kPa and a flow velocity of 4 m/s. Rejection values of all tested modules were improved by 10%. The highest permeate flux of 195 L/㎡.h was achieved using a 1"-membrane module with the aid of its negatively charged membrane material and the daily sponge ball cleaning. In addition, the enhancement in the permeate flux caused by daily sponge ball cleaning improved the energy specific demand for all tested modules. The negatively charged membrane showed the lowest energy specific demand of 1.31 kWh/㎥ in combination with the highest flux, which is a very competitive result.

• The Journal of Korea Robotics Society
• /
• v.17 no.3
• /
• pp.381-386
• /
• 2022

We develop a business model for facade cleaning service robot system that provides service by meeting the market needs and environments. The size of the facade cleaning market is growing rapidly in recent years due to the increasing importance of indoor space and the modern trend of building construction methods. Also, maintenance of exterior appearance of buildings has become an important factor in residential and commercial facilities. Though demand for facade cleaning services is rising, the current facade cleaning services are performed dangerously in a human labor-dependent way. It is desirable that the existing human resource service should be replaced with robot-based services. In addition, quantitative analysis of rental pricing model was conducted to propose effective launch of products to the market. The robot system is economically attractive from the consumer's point of view. When the actual facade cleaning robot service is released, it is expected that verification of the business models and more accurate analysis with specific figures can be performed.

• Journal of the Semiconductor & Display Technology
• /
• v.22 no.4
• /
• pp.26-31
• /
• 2023

We investigated the impact of NF₃ / H₂O remote plasma dry cleaning conditions on the SiO₂ etching rate at different preparation states during the fabrication of ultra-large-scale integration (ULSI) devices. This included consideration of factors like Si crystal orientation prior to oxidation and three-dimensional structures. The dry cleaning process were carried out varying the parameters of pressure, NF₃ flow rate, and H₂O flow rate. We found that the pressure had an effective role in controlling anisotropic etching when a thin SiO₂ layer was situated between Si₃N₄ and Si layers in a multilayer trench structure. Based on these observations, we would like to provide further guidelines for implementing the dry cleaning process in the fabrication of semiconductor devices having 3D structures.

• Journal of the Korea Society of Computer and Information
• /
• v.29 no.7
• /
• pp.21-32
• /
• 2024

Since leather shoes cannot be washed with water, there is a need for a cleaning method that can remove extraneous substance from the inside and outside of shoes and senitize the inside of shoes without using water. For this purpose, this paper develops a shoes cleaning machine control system that automatically controls the entire process of shoes cleaning in a shoes cleaning machine that quickly cleans the inside and outside of shoes using compressed air, sterilization solution. The developed system uses Rasberry Pi, a general purpose single board computer(SBC), to control various actuators of the shoes cleaning machine. The shoes cleaning machine operated by the developed system shows a sterilization efficiency of more than 99% and an odor removal efficiency of more than 86% in a cleaning time of less than 1 minute.

• Clean Technology
• /
• v.17 no.4
• /
• pp.306-313
• /
• 2011

Flux or solder is used in soldering process for manufacturing electronic parts such as printed circuit boards (PCB). After soldering process, residual flux and solder paste on the parts should be removed since their residuals could cause performance degradation or failure of parts due to their corrosion and electric leakage. Ozone depletion substances such as 1,1,1- trichloroethane (TCE) and HCFC-141b have widely been using for removal of residual flux and solder paste after soldering process In manufacturing of electronic parts until now. In this study, non-aqueous cleaning agents without flash point were developed and applied to industrial field for replacement of cleaning agents with ozone depletion. In order to develop non-aqueous cleaning agents without ethers, esters, fluoride- type solvents. And their physical properties and cleaning abilities were evaluated, and they were applied to industrial fields for cleaning of flux and solder on the PCB. And vacuum distillation apparatus were operated to determine their operating conditions and recycling yields for recycling of used cleaning agents formulated in this study. As a result of physical properties measurement of our formulated cleaning agents, they were expected to have good wetting and penetrating power since their surface tensions were relatively low as 18.0~20.4 dyne/$cm^2$ and their wetting indices are relatively large. And some cleaning agents holding fluoride-type solvents as their components did not have any flash point and they seemed to be safe in their handling and storage. The cleaning experimental results showed that some cleaning agents were better in their cleaning of flux and solder paste than 1,1,1-TCE and HCFC-141b. And industrial application results of the formulated cleaning agents for cleaning PCB indicated that they can be applicable to industry due to their good cleaning capability in comparison with HCFC-141b. The recycling experiments of the used formulated cleaning agents through a vacuum distillation apparatus also showed that their 91.9~97.5% could be recycled with its proper operating conditions.