• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.6
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• pp.543-550
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• 2002

In this paper, the $CF_4$ decomposition rate and by-product were investigated for two simulated plasma reactors which are metal particle reactor and spiral wire reactors as a function of mixed gases. The $CF_4$ decomposition rate by plasma reactor with metal particle electrode had a gain of 20~25% over that by plasma reactor with spiral wire electrode. The $CF_4$ decomposition efficiency increases with increasing applied voltage up to the critical voltage for spark formation. The $CF_4$ decomposition efficiency of metal particle reactor was about 80% at AC 24kV. The $CF_4$ decomposition rate used Ar-$N_2$ as base gas was the highest among three base gases of $N_2$, $Ar-N_2$, air. The by-products of the $N_2$, $N_2Ar$ base as were similar, but in case of air base they were different.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.12
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• pp.1016-1020
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• 2002

Ru thin films were etched using CF/$_4$O$_2$ plasma in an ICP (inductively coupled plasma etching) system. The maximum etch rate of Ru thin films was 168 nm/min at a CF$_4$/O$_2$ gas mixing ratio of 10 %. The selectivity of SiO$_2$ over Ru was 1.3. From the OES (optical emission spectroscopy) analysis, the optical emission intensity of the O radical had a maximum value at 10% CF$_4$ gas concentration and drcrease with further addition of CF4 gas, but etch slope was enhanced. From XPS (x-ray photoelectron spectroscopy) analysis, the surface of the etched Ru thin film in CF$_4$/O$_2$ chemistry shows Ru-F bonds by the chemical reaction of Ru and F. RuF$_{x}$ compounds were suggested as a surface passivation layer that reduces the chemical reactions between Ru and O radicals. From a FE-SEM (field emission scanning electron microscope) micrograph, we had an almost perpendicular taper angle of 89$^{\circ}$.>.

• Bulletin of the Korean Chemical Society
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• v.29 no.1
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• pp.139-147
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• 2008

New PPV derivatives which contain electron-withdrawing CF3F4phenyl group, poly[2-(2-ethylhexyloxy)-5-(2,3,5,6-tetrafluoro-4-trifluoromethylphenyl)-1,4-phenylenevinylene] (CF3F4P-PPV), and poly[2-(4-(2-etylhexyloxy)-phenyl)-5-(2,3,5,6-tetrafluoro-4-trifluoromethylphenyl)-1,4-phenylenevinylene] (P-CF3F4P-PPV), have been synthesized by GILCH polymerization. As the result of the introduction of the electron-withdrawing CF3F4phenyl group to the phenyl backbone, the LUMO and HOMO energy levels of CF3F4P-PPV (3.14, 5.50 eV) and P-CF3F4P-PPV (3.07, 5.60 eV) were reduced. The PL emission spectra in solid thin film are more red-shifted over 50 nm and increased fwhm (full width at half maximum) than solution conditions by raising aggregation among polymer backbone due to electron withdrawing effect of 2,3,5,6-tetrafluoro-4-trifluoromethylphenyl group. The EL emission maxima of CF3F4P-PPV and P-CF3F4P-PPV appear at around 530-543 nm. The current density-voltage-luminescence (J-V-L) characteristics of ITO/PEDOT/polymer/Al devices of CF3F4P-PPV and P-CF3F4P-PPV show that turn-on voltages are around 12.5 and 7.0 V, and the maximum brightness are about 82 and 598 cd/m2, respectively. The maximum EL efficiency of P-CF3F4P-PPV (0.51 cd/A) was higher than that of CF3F4P-PPV (0.025 cd/A).

• Bulletin of the Korean Chemical Society
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• v.26 no.5
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• pp.795-801
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• 2005

New PPV derivatives which contain electron-withdrawing trifluoromethyl ($CF_3$) group, poly[2-(2-ethylhexyloxy)-5-(4-trifluoro methylphenyl)-1,4-phenylenevinylene] (EH$CF_3$P-PPV), and poly[2-(2-ethylhexyloxy)-5-(3,5-bis(trifluoromethyl)-phenyl)-1,4-phenylenevinylene] (EHB$CF_3$P-PPV), have been synthesized by GILCH polymerization. As the result of the introduction of the electron-withdrawing $CF_3$ group to the phenyl substituent, the LUMO and HOMO energy levels of EH$CF_3$P-PPV (2.8, 5.1 eV) and EHB$CF_3$P-PPV (3.0, 5.3 eV) were lower than those of known poly[2-(2-ethylhexyloxy)-5-phenyl-1,4-phenylenevinylene] (EHP-PPV) (2.6, 4.9 eV). These polymers have been used as the electroluminescent (EL) layers in double layer lightemitting diodes (LEDs) (ITO/PEDOT/polymer/Al). EH$CF_3$P-PPV, and EHB$CF_3$P-PPV show maximum photoluminescence (PL) peaks at ${\lambda}_{max}$ = 550, 539 nm, and maximum EL peak at ${\lambda}_{max}$ = 545, 540 nm, respectively. The current-voltage-luminance (I-V-L) characteristics of the polymers show that turn-on voltages of EH$CF_3$P-PPV and EHB$CF_3$P-PPV are around 4.0 and 3.5 V, respectively.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.91-91
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• 2010

본 논문은 펄스 직류전원 (Pulse DC) 플라즈마 소스와 반응성 가스인 $CF_4$와 불활성 가스인 Ar를 혼합하여 산업에서 널리 사용되는 유기고분자인 Polymethylmethacrylate (PMMA), Polyethylene terephthalate (PET), 그리고 Polycarbonate (PC) 샘플을 건식 식각한 결과에 대한 것이다. 각각의 샘플은 감광제 도포 후에 자외선을 조사하는 포토레지스트 방법으로 마스크를 만들었다. 펄스 직류전원 플라즈마 시스템을 사용하면 다양한 변수를 줄 수 있다는 장점이 있다. 공정 변수는 Pulse DC Voltage는 300 - 500 V, Pulse DC reverse time $0.5{\sim}2.0\;{\mu}s$, Pulse DC Frequency 100~250 kHz 이었다. 변수 각각의 값이 높아질수록 고분자의 식각률이 높아졌다. 특히, PMMA의 식각률이 가장 높았으며 PET, PC 순이었다. 샘플 중 PC의 식각률이 가장 낮은 이유는 고분자 결합 중에 이중결합의 벤젠 고리 모양을 포함하고 있어 분자 결합력이 비교적 높기 때문으로 사료된다. 기계적 펌프만을 사용한 공정 전 압력은 30 mTorr이었다. 쓰로틀 밸브를 완전 개방한 상태에서 식각 공정 중 진공 압력은 $CF_4$ 가스유량이 늘어날수록 증가하였다. 식각률 역시 $CF_4$ 가스유량(총 가스 유량은 10 sccm)이 많을수록 증가함을 보여주었다 (PMMA: 10 sccm $CF_4$에서 330 nm/min, 3.5 sccm $CF_4$/6.5 sccm Ar에서 260 nm/min., PET: 10 sccm $CF_4$에서 260 nm/min, 3.5 sccm $CF_4$/6.5 sccm Ar에서 210 nm., PC: 10 sccm $CF_4$에서 230 nm, 3.5 sccm $CF_4c$/6.5 sccm Ar에서 160 nm). 이는 펄스 직류전원 플라즈마 식각에서 $CF_4$와 Ar의 가스 혼합비를 조절함으로서 고분자 소재의 식각률을 적절히 변화시킬 수 있다는 것을 의미한다. 표면 거칠기는 실험 후 표면단차 측정기와 전자 현미경 등을 이용하여 식각한 샘플의 표면을 측정하여 알 수 있었다. 실험전 기준 샘플 표면 거칠기는 PMMA는 1.53nm, PET는 3.1nm, PC는 1.54nm 이었다. 식각된 샘플들의 표면 거칠기는 PMMA는 3.59~10.59 nm, PET은 5.13~11.32 nm, PC는 1.52~3.14 nm 범위였다. 광학 발광 분석기 (Optical emission spectroscopy)를 이용하여 식각 공정 중 플라즈마 발광특성을 분석한 결과, 탄소 원자 픽 (424.662 nm)과 아르곤 원자 픽 (751.465 nm, 763.510 nm)의 픽의 존재를 확인하였다. 이 때 탄소 픽은 $CF_4$ 가스에서 발생하였을 것으로 추측한다. 본 발표를 통해 펄스 직류전원 $CF_4$/Ar의 고분자 식각 결과에 대해 보고할 것이다.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.49 no.5
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• pp.265-269
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• 2000

$(Ba, Sr)TiO_3$thin films were etched with a magnetically enhanced inductively coupled plasma (MEICP) at different CF4/Ar gas mixing ratios. Experimental was done by varying the etching parameters such as rf power, dc bias and chamber pressure. The maximum etch rate of the BST films was $1800{AA}/min$ under $CF_4/(CF_4+Ar)$ of 0.1, 600 W/350 V and 5 mTorr. The selectivity of BST to Pt and PR was 0.6, 0.7, respectively. X-ray photoelectron spectroscopy (XPS) results show that surface reaction between Ba, Sr, Ti and C, F radicals occurs during the (Ba, Sr)TiO3 etching. To analyze the composition of surface residue after the etching, films etched with different CF_4/Ar$ gas mixing ratio were investigated using XPS and secondary ion mass spectroscopy (SIMS).

• Proceedings of the KIEE Conference
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• 2001.07c
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• pp.1509-1511
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• 2001

In this study, etching characteristics of polyimide(Pl) film with $O_2/CF_4$ gas mixing ratio was studied using inductively coupled plasma (ICP). The etch rate and selectivity were evaluated to chamber pressure and gas mixing ratio. High etch rate (over 8000$\AA$/min) and vertical profile were acquired in $CF_4$/($CF_4+O_2$) of 0.2. The selectivities of polyimide to PR and polyimide to $SiO_2$ were 1.15, 5.85, respectively. The profiles of polyimide film etched in $CF_4/O_2$ were measured by a scanning electron microscope (SEM) with using an aluminum hard mask pattern. The chemical states on the polyimide film surface were measured by x-ray photoelectron spectroscopy (XPS).

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11b
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• pp.26-29
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• 2001

$SrBi_2Ta_2O_{9}$ thin films were etched at high-density $Cl_2/CF_4/Ar$ in inductively coupled plasma system. The etching of SBT thin films in $Cl_2/CF_4/Ar$ were chemically assisted reactive ion etching. The maximum etch rate was 1300 $\AA$/min at 900W in $Cl_2(20)/CF_4(20)/Ar(80)$. As rf power increase, radicals (F, Cl) and ion(Ar) increase. The influence of plasma induced damage during etching process was investigated in terms of the surface morphology and th phase of X-ray diffraction. The chemical residue was investigated with secondary ion mass sperometry.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11a
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• pp.26-29
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• 2001

SrBi$_2$Ta$_2$$O_{9}$ thin films were etched at high-density C1$_2$/CF$_{4}$/Ar in inductively coupled plasma system. The etching of SBT thin films in C1$_2$/CF$_{4}$/Ar were chemically assisted reactive ion etching. The maximum etch rate was 1300 $\AA$/min at 900W in Cl$_2$(20)/CF$_4$(20)/Ar(80). As f power increase, radicals (F, Cl) and ion(Ar) increase. The influence of plasma induced damage during etching process was investigated in terms of the surface morphology and th phase of X-ray diffraction. The chemical residue was investigated with secondary ion mass spectrometry.y.

• Journal of Climate Change Research
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• v.8 no.1
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• pp.63-71
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• 2017

It is recognized that tetrafluoromethane ($CF_4$) has a great influence on global warming. The $CF_4$ is known to have a large impact on climate change due to its large global warming index. In this study, a waterjet plasma scrubber (WPS) was designed and manufactured for the $CF_4$ decomposition. The WPS is a novel technology which is combined a gliding arc plasma and water injection at the center of the plasma discharge. This can give an innovative way for $CF_4$ decomposition by achieving larger plasma columnand generating OH radicals. A performance analysis was achieved for the design factors such as waterjet flow rate, total gas flow rate, consumption electric power, and electrode gap. The highest $CF_4$ decomposition and energy efficiencies were 64.8% and 6.43 g/kWh, respectively; Optimal operating conditions were 20 mL/min of waterjet flow rate, 200 L/min total gas flow rate, 5.3 kW consumption electric power, and 4.4 mm electrode gap. As for the 2 stage reactor of the WPS, the $CF_4$ decomposition efficiency improved as the 85.3% while the energy efficiency decreased as the 5.57 g/kWh.