• 제목/요약/키워드: C/C-SiC-Cu

검색결과 540건 처리시간 0.03초

Exploration of growth mechanism for layer controllable graphene on copper

  • Song, Woo-Seok;Kim, Yoo-Seok;Kim, Soo-Youn;Kim, Sung-Hwan;Jung, Dae-Sung;Jun, Woo-Sung;Jeon, Cheol-Ho;Park, Chong-Yun
    • 한국진공학회:학술대회논문집
    • /
    • 한국진공학회 2011년도 제40회 동계학술대회 초록집
    • /
    • pp.490-490
    • /
    • 2011
  • Graphene, hexagonal network of carbon atoms forming a one-atom thick planar sheet, has been emerged as a fascinating material for future nanoelectronics. Huge attention has been captured by its extraordinary electronic properties, such as bipolar conductance, half integer quantum Hall effect at room temperature, ballistic transport over ${\sim}0.4{\mu}m$ length and extremely high carrier mobility at room temperature. Several approaches have been developed to produce graphene, such as micromechanical cleavage of highly ordered pyrolytic graphite using adhesive tape, chemical reduction of exfoliated graphite oxide, epitaxial growth of graphene on SiC and single crystalline metal substrate, and chemical vapor deposition (CVD) synthesis. In particular, direct synthesis of graphene using metal catalytic substrate in CVD process provides a new way to large-scale production of graphene film for realization of graphene-based electronics. In this method, metal catalytic substrates including Ni and Cu have been used for CVD synthesis of graphene. There are two proposed mechanism of graphene synthesis: carbon diffusion and precipitation for graphene synthesized on Ni, and surface adsorption for graphene synthesized on Cu, namely, self-limiting growth mechanism, which can be divided by difference of carbon solubility of the metals. Here we present that large area, uniform, and layer controllable graphene synthesized on Cu catalytic substrate is achieved by acetylene-assisted CVD. The number of graphene layer can be simply controlled by adjusting acetylene injection time, verified by Raman spectroscopy. Structural features and full details of mechanism for the growth of layer controllable graphene on Cu were systematically explored by transmission electron microscopy, atomic force microscopy, and secondary ion mass spectroscopy.

  • PDF

산업폐기물 소각시설에서 폐기물 유형에 따른 입자상물질의 배출특성 (Emission Characterization of Particulate Matters According to the Types of Wastes from Industrial Waste Incinerator)

  • 박정호;서정민;조정구;류재용;한성종
    • 한국환경과학회지
    • /
    • 제16권11호
    • /
    • pp.1225-1230
    • /
    • 2007
  • The emissions characteristics of particulate matters(PM) according to the types of wastes from industrial waste incinerator of 800 kg/hr treatment capacity were investigated. For this study, the incinerate waste are as follows; waste resin, waste wood, waste urethane, waste gunny, and waste paper. The particulate samples were collected to be emitted in stack and air pollution control(both cyclone and bag filter). In stack, the concentrations of PM were in the range of 2.61 to $26.51 mg/Sm^3$ and the major chemical species were C, Si, Cl, K, Na, Ca in all the wastes. In cyclone fly ash, the mean content of heavy metal were in the order of Fe > Zn > Pb > Cu > Mn > Cr > Ni > Cd > As > Hg and the heavy metal content of waste resin were Zn 34,197.5 mg/kg, Fe 27,587.6 mg/kg, Pb 6,055.8 mg/kg, respectively. In bag filter fly ash, the mean content of heavy metal were in the order of Zn > Pb > Fe > Cu > Mn > Cd > Cr > Ni > As > Hg and the heavy metal content of waste wood were Pb 36,405.2 mg/kg, Fe 15,762.9 mg/kg, Cu 9,989.5 mg/kg, Cd 2,230.1 mg/kg, respectively. Comparing the heavy metal content of both cyclone and bag filter, in cyclone, the Cr, Fe, Ni content were higher than in bag filter and the Cd, Cu, Hg content were lower than in bag filter.

ECAP 가공에 의해 제조된 초미세립 OFHC Cu 봉재의 미세조직 및 기계적 특성의 균질성 (Homogeneity of Microstructure and Mechanical Properties of Ultrafine Grained OFHC Cu Bars Processed by ECAP)

  • 지정훈;박이주;김형원;황시우;이종수;박경태
    • 대한금속재료학회지
    • /
    • 제49권6호
    • /
    • pp.474-487
    • /
    • 2011
  • Bars of OFHC Cu with the diameter of 45 mm were processed by equal channel angular pressing up to 16 passes via route $B_c$, and homogeneity of their microstructures and mechanical properties was examined at every four passes which develop the equiaxed ultrafine grains. In general, overall hardness, yield strength and tensile strength increased by 3, 7, and 2 times respectively compared with those of unECAPed sample. Cross-sectional hardness exhibited a concentric distribution. Hardness was the highest at the center of bar and it decreased gradually from center to surface. After 16 passes, overall hardness decreased due to recovery and partial recrystallization. Regardless of the number of passage, yield strength and tensile strength were quite uniform at all positions, but elongation showed some degree of scattering. At 4 passes, coarse and ultrafine grains coexisted at all positions. After 4 passes, uniform equiaxed ultrafine grains were obtained at the center, while uniform elongated ultrafine grains were manifested at the upper half position. At the lower half position, grains were equiaxed but its size were inhomogeneous. It was found that inhomogeneity of grain morphology and grain size distribution at different positions are to be attributed to scattering in elongation but they did not affect strength. The present results reveal the high potential of practical application of equal channel angular pressing on fabrication of large-sized ultrafine grained bars with quite homogeneous mechanical properties.

규질 이암으로부터 Na-A형 제올라이트의 scale-up 수열합성 및 중금속흡착 (Scaling up Hydrothermal Synthesis of Na-A Type Zeolite from Natural Siliceous Mudstone and Its Heavy Metal Adsorption Behavior)

  • 배인국;장영남;신희영;채수천;류경원
    • 한국광물학회지
    • /
    • 제21권4호
    • /
    • pp.341-347
    • /
    • 2008
  • 포항지역 널리 분포하고 있는 규질이암으로부터 상업화를 위한 50리터 bench scale 수열장치를 사용하여 Na-A형 제올라이트의 합성을 성공적으로 수행하였고 또한 이 제올라이트를 이용하여 환경 개선재로 활용하는 연구를 수행하였다. 초기물질로 사용된 규질이암은 제올라이트의 주요 성분인 $SiO_2$$Al_2O_3$가 각각 70.7% 및 10.0% 함유되어 제올라이트의 합성에 유리한 조성을 가지고 있다. 이전의 실험실적 규모에서 수행된 동일한 조건인 $Na_2O/SiO_2\;=\;0.6$, $SiO_2/Al_2O_3\;=\;2.0$, $H_2O/Na_2O\;=\;98.6$의 조성비로 $80^{\circ}C$에서 18시간 동안 합성한 결과, Na-A형 제올라이트의 결정도 및 결정형태는 실험실적 규모와 유사하였고, 회수율 및 양이온 교환능은 각각 95% 및 215 cmol/kg으로 실험실적 규모에서 보다 약간 우수한 결과를 나타냈다. 합성된 Na-A형 제올라이트를 이용하여 모사폐액(Pb, Cd, Cu, Zn 및 Mn)에 중금속 제거율을 조사한 결과, 중금속 제거율은 Pb > Cd > Cu = Zn > Mn의 순서이었다. Mn을 제외한 다른 중금속들은 1500 mg/L에서 99% 이상의 제거율을 보였고, Mn의 경우도 98%의 제거율을 보여 합성된 Na-A형 제올라이트는 중금속 흡착제로서 우수한 특성을 나타냈다.

중금속이 토양용액 중 화학종 변화에 미치는 영향 (Changes of Chemical Species in Soil Solution Induced by Heavy Metals)

  • 양재의;이기원;김정제;임형식
    • 한국환경농학회지
    • /
    • 제14권3호
    • /
    • pp.263-271
    • /
    • 1995
  • 중금속에 의한 토양오염을 화학적으로 평가하기 위한 일환으로 토양을 중금속으로 오염시킨 후 토양용액을 추출하여 pH, 이온강도, 이온농도, 화합물형태 변화를 분석했다. 토양이 Cu와 Cd에 의해 오염될수록 토양용액의 이온강도는 증가했다. 이런 변화는 Cd보다 Cu에 의해 더 컸다. 토양용액 중의 Cu와 Cd의 농도는 가한 양(量)에 비해 소량으로 존재했으나 처리량에 비례하여 금속의 농도는 증가했다. 토양용액 중의 Cd의 농도는 Cu보다 훨씬 높았다. 토양용액 중의 Ca, Mg, K의 농도는 중금속에 의해 증가되었으나 주로 free ion상태로 존재했으며 화합물형태는 Cu나 Cd의 처리에 의해 변화되지 않았다. 토양용액 중 중금속이온의 화합물의 변화 경향은 Cu와 Cd이 달랐다. Cu의 경우 토성과 pH에 의해 영향을 받았는데 pH가 낮은 SiCL 및 SL 토양에서는 free $Cu^{2+}$가 95 molar % 이상으로 주된 화합물형태이었고 pH가 높은 LS토양의 경우 free $Cu^{2+}$과 Cu-hydroxide이 주된 화합물형태로 Cu처리량에 따라 이들 화학종의 molar %는 변화되었다. Cd의 경우 free $Cd^{2+}$과 Cd-chloride 화합물이 주된 화합물형태이었고 Cd처리량이 증가함에 따라 $Cd^{2+}$는 감소한 반면 Cd-chloride 화합물 형성은 증가했다. 중금속에 의한 토양용액의 pH감소, 중금속의 흡착에 따른 양이온의 일시적인 증가, 중금속의 화합물 변화들은 식물영양적 측면에서 볼 때 식물에 불리한 변화로 간주되며, 중금속의 생물유효성과 독성을 평가하는 자료로 활용될 수 있을 것이다.

  • PDF

Dielectric Properties of $Ta_2O_{5-X}$ Thin Films with Buffer Layers

  • Kim, In-Sung;Song, Jae-Sung;Yun, Mun-Soo;Park, Chung-Hoo
    • KIEE International Transactions on Electrophysics and Applications
    • /
    • 제12C권4호
    • /
    • pp.208-213
    • /
    • 2002
  • The present study describe the electrical performance of amorphous T $a_2$ $O_{5-X}$ fabricated on the buffer layers Ti and Ti $O_2$. T $a_2$ $O_{5-X}$ thin films were grown on the Ti and Ti $O_2$ layers as a capacitor layer using reactive sputtering method. The X-ray pattern analysis indicated that the two as-deposited films were amorphous and the amorphous state was kept stable on the RTA(rapid thermal annealing) at even $700^{\circ}C$. Measurements of dielectric properties of the reactive sputtered T $a_2$ $O_{5-X}$ thin films fabricated in two simple MIS(metal insulator semiconductor), structures, (Cu/T $a_2$ $O_{5}$ Ti/Si and CuT $a_2$ $O_{5}$ Ti $O_2$Si) show that the amorphous T $a_2$ $O_{5}$ grown on Ti showed high dielectric constant (23~39) and high leakage current density(10$^{-3}$ ~10$^{-4}$ (A/$\textrm{cm}^2$)), whereas relatively low dielectric constant (~15) and tow leakage current density(10$^{-9}$ ~10$^{-10}$ (A/$\textrm{cm}^2$)) were observed in the amorphous T $a_2$ $O_{5}$ deposited on the Ti $O_2$ layer. The electrical behaviors of the T $a_2$ $O^{5}$ thin films were attributed to the contribution of Ti- $O_2$ and the compositionally gradient Ta-Ti-0, being the low dielectric layer and high leakage current barrier. In additional, The T $a_2$ $O_{5}$ Ti $O_2$ thin films exhibited dominant conduction mechanism contributed by the Poole-Frenkel emission at high electric field. In the case of T $a_2$ $O_{5}$ Ti $O_2$ thin films were related to the diffusion of Ta, Ti and O, followed by the creation of vacancies, in the rapid thermal treated thin films.films.

이온빔 및 이미다졸-실란 화합물에 의한 폴리이미드 필름과 구리의 접착 특성 (Adhesion Properties between Polyimide Film and Copper by Ion Beam Treatment and Imidazole-Silane Compound)

  • 강형대;김화진;이재흥;서동학;홍영택
    • 접착 및 계면
    • /
    • 제8권1호
    • /
    • pp.15-27
    • /
    • 2007
  • 폴리이미드 필름과 구리의 접착력을 향상시키기 위하여 이온빔과 실란-이미다졸 커플링제를 사용하여 폴리이미드 표면개질을 실시하였다. 실란-이미다졸 커플링제는 구리와의 배위결합을 형성하는 이미다졸 그룹과 실록산 폴리머를 형성하는 메톡시 실란 그룹을 함유한다. 폴리이미드 필름표면은 아르곤/산소 이온빔으로 일차로 처리하여 친수성을 높인 폴리이미드 필름에 커플링제 수용액에 침지하여 폴리이미드 필름 표면에 커플링제를 그라프트시켜 표면개질을 실시하였다. XPS 스펙트럼 분석결과 아르곤/산소 플라즈마 처리는 폴리이미드 표면에 하이드록시 및 카르보닐 그룹과 같은 산소 기능성기를 형성함을 알 수 있었고 폴리이미드 필름 표면에 실란-이미다졸과의 커플링반응에 의하여 표면이 개질되었음을 확인하였다. 이온빔을 사용하여 그라프트된 폴리이미드 필름과 구리와의 접착력은 처리되지 않은 폴리이미드 필름과의 접착력 보다 높은 접착력을 나타내었다. 또한 커플링제로 그라프트된 폴리이미드 필름의 접착력 보다 아르곤/산소의 양자화 이온을 이용하여 개질한 그라프트된 폴리이미드 필름의 시편이 더 높은 접착력을 나타내었다. 구리-폴리이미드 필름의 계면으로부터 박리된 층은 분석결과 완전히 서로 다른 화학적 조성을 나타내었는데 이것으로부터 박리가 접합면의 커플링제 내에서 일어나는 것보다는 폴리이미드와 커플링제의 사이에서 일어남을 확인하였다.

  • PDF

Nature of the Interfacial Regions in the Antiferromagnetically-coupled Fe/Si Multilayered Films

  • Moon, J.C.;Y.V. Kudryavtsev;J.Y.Rhee;Kim, K.W.;Lee, Y.P.
    • 한국진공학회:학술대회논문집
    • /
    • 한국진공학회 2000년도 제18회 학술발표회 논문개요집
    • /
    • pp.174-174
    • /
    • 2000
  • A strong antiferromagnetic coupling in Fe/Si multilayered films (MLF) had been recently discovered and much consideration has been given to whether the coupling in the Fe/Si MLF system has the same origin as the metal/metal MLF. Nevertheless, the nature of the interfacial ron silicide is still controversial. On one hand, a metal/ semiconductor structure was suggested with a narrow band-gap semiconducting $\varepsilon$-FeSi spacer that mediates the coupling. However, some features show that the nature of coupling can be well understood in terms of the conventional metal/metal multilayered system. It is well known that both magneto-optical (MO) and optical properties of a metal depend strongly on their electronic structure that is also correlated with the atomic and chemical ordering. In this study, the nature of the interfacial regions is the Fe/Si multilayers has been investigated by the experimental and computer-simulated MO and optical spectroscopies. The Fe/Si MLF were prepared by rf-sputtering onto glass substrates at room temperature with the number of repetition N=50. The thickness of Fe sublayer was fixed at 3.0nm while the Si sublayer thickness was varied from 1.0 to 2.0 nm. The topmost layer of all the Fe/Si MLF is Fe. In order to carry out the computer simulations, the information on the MO and optical parameters of the materials that may constitute a real multilayered structure should be known in advance. For this purpose, we also prepared Fe, Si, FeSi2 and FeSi samples. The structural characterization of Fe/Si MLF was performed by low- and high -angle x-ray diffraction with a Cu-K$\alpha$ radiation and by transmission electron microscopy. A bulk $\varepsilon$-FeSi was also investigated. The MO and optical properties were measured at room temperature in the 1.0-4.7 eV energy range. The theoretical simulations of MO and optical properties for the Fe/Si MLF were performed by solving exactly a multireflection problem using the scattering matrix approach assuming various stoichiometries of a nonmagnetic spacer separating the antiferromagnetically coupled Fe layers. The simulated spectra of a model structure of FeSi2 or $\varepsilon$-FeSi as the spacer turned out to fail in explaining the experimental spectra of the Fe/Si MLF in both intensity and shape. Thus, the decisive disagreement between experimental and simulated MO and optical properties ruled out the hypothesis of FeSi2 and $\varepsilon$-FeSi as the nonmagnetic spacer. By supposing the spontaneous formation of a metallic ζ-FeSi, a reasonable agreement between experimental and simulated MO and optical spectra was obtained.

  • PDF

금속기지 나노복합재용 탄소나노섬유 일방향 배열을 위한 이종재 인발 연구 (The study of drawing on the heterogeneous materials for the unidirectional alignment of carbon nanofiber in metal matrix nanocomposite)

  • 백영민;이상관;엄문광;김병민
    • 한국소성가공학회:학술대회논문집
    • /
    • 한국소성가공학회 2003년도 추계학술대회논문집
    • /
    • pp.301-301
    • /
    • 2003
  • In current study, Nanocomposites are reinforced with carbon nanofiber, carbon nanotube and SiC, etc. Since the nano reinforcements have the excellent mechanical, thermal and electrical properties compared with that of existing composites, it has lately attracted considerable attention in the various areas. Cu have been widely used as signal transmission materials for electrical electronic components owing to its high electrical conductivity. However, it's size have been limited to small ones due to its poor mechanical properties. Until now, strengthening of the copper alloy was obtained either by the solid solution and precipitation hardening by adding alloy elements or the work hardening by deformation process. Adding the alloy elements lead to reduction of electrical conductivity. In this aspect, if carbon nanofiber is used as reinforcement which have outstanding mechanical strength and electric conductivity, it is possible to develope Cu matrix nanocomposite having almost no loss of electric conductivity. It is expected to be innovative in electric conducting material market. The unidirectional alignment of carbon nanofiber is the most challenging task developing the cooer matrix composites of high strength and electric conductivity. In this study, the unidirectional alignment of carbon nanofibers which is used reinforced material are controlled by drawing process and align mechanism as well as optimized drawing process parameter are verified via numerical analysis. The materials used in this study were pure copper and the nanofibers of 150nm in diameter and of 10∼20$\mu\textrm{m}$ in length. The materials have been tested and the tensile strength was 75MPa with the elongation of 44% for the copper. it is assumed that carbon nanofiber behave like porous elasto-plastic materials. Compaction test was conducted to obtain constitutive properties of carbon nanofiber Optimal parameter for drawing process was obtained by analytical and numerical analysis considering the various drawing angles, reduction areas, friction coefficient, etc. The lower drawing angles and lower reduction areas provides the less rupture of co tube is noticed during the drawing process and the better alignment of carbon nanofiber is obtained.

  • PDF

동 매트제련의 반응생성물중 Ni와 Sb의 분배거동에 관한 연구 (A Study on Distribution Behavior of Ni and Sb in Reduction products of Cu Matte Converting)

  • 김영진;이광막;김영홍
    • 자원리싸이클링
    • /
    • 제8권5호
    • /
    • pp.44-50
    • /
    • 1999
  • 동 매트 중에 함유된 불순물 중 단순한 산화정련으로는 제거하기 어려워 제련 후 조동에 함유되어 동의 순도와 기계적 성질을 저하시키는 Ni와 Sb를 매트제련 동안에 제거하기 위한 기초 자료를 제시하고자 공기 송풍에 의한 합성 동 매트의 용련 반응을 통하여 반응 생성물인 매트와 슬래그 그리고 조동에 함유된 Ni와 Sb의 거동 및 상호 연관성을 조사하였다. 공기 송풍에 따른 합성 매트의 용련동안 생성된 반응 생성물에 대한 Ni와 Sb의 분배비로부터 Sb가 Ni과 공존 시 Ni의 슬래그화를 촉진하는 역할을 하며, 또한 Ni은 Sb와 공존시 조동 중으로의 Sb 이동을 저해하고 슬래그화를 촉진시키는 것으로 나타났다. 따라서 Ni와 Sb의 슬래그화를 유도하기 위해서는 Ni와 Sb의 공존이 필요한 것으로 생각된다.

  • PDF