• Transactions of the Korean Society of Mechanical Engineers A
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• v.25 no.12
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• pp.2048-2055
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• 2001

This paper develops a computational model for estimating the ride quality of a cabover type large-sized truck in a double wheel bumpy ride test. The computational model is developed using ADAMS. To verify the developed model, an actual vehicle double wheel bumpy ride test is performed. In the test, the vehicle maintains a straight course with a constant velocity such that the front two wheels are passed the bump at the same time. The bump has the height of 60mm, and the width of 550mm. In the test, four velocities are used. They are 10kph, 20kph, 30kph and 40kph. Since the large-sized truck's center of gravity location is high, and its weight is heavy, it is a quite severe test condition to perform the test with more than 30kph velocity. In the test, vertical accelerations on the floor of the cab are measured. The measured accelerations are compared to the simulation results. From the comparison, it is shown that the developed model can predict not only the measured acceleration's tendency but also peak accelerations quite well. In this paper, the validated model is utilized to compare the ride quality between a vehicle with a multi-leaf spring and a vehicle with a tapered leaf spring in the front suspension system in a double bumpy ride test.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.3
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• pp.27-32
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• 2010

For the flip chip joints processed using Cu pillar bumps and Sn pads, thermal cycling and high temperature storage reliabilities were examined as a function of the Sn pad height. With increasing the height of the Sn pad, which composed of the flip chip joint, from 5 ${\mu}m$ to 30 ${\mu}m$, the contact resistance of the flip chip joint decreased from 31.7 $m{\Omega}$ to 13.8 $m{\Omega}$. Even after thermal cycles of 1000 times ranging from $-45^{\circ}C$ to $125^{\circ}C$, the Cu pillar flip chip joints exhibited the contact resistance increment below 12% and the shear failure forces similar to those before the thermal cycling test. The contact resistance increment of the Cu pillar flip chip joints was maintained below 20% after 1000 hours storage at $125^{\circ}C$.

• Design & Manufacturing
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• v.14 no.3
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• pp.23-30
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• 2020

Laser Assisted Thermo-Compression Bonding (LATCB) has been proposed to improve the "chip tilt due to the difference in solder bump height" that occurs during the conventional semiconductor chip bonding process. The bonding module of the LATCB system has used a piezoelectric actuator to control the inclination of the compression jig on a micro scale, and the piezoelectric actuator has been directly coupled to the compression jig to minimize the assembly tolerance of the compression jig. However, this structure generates a lateral force in the piezoelectric actuator when the compression jig is tilted, and the stacked piezoelectric element vulnerable to the lateral force has a risk of failure. In this paper, the optimal design of the flexure hinge was performed to minimize the lateral force generated in the piezoelectric actuator when the compression jig is tilted by using the displacement difference of the piezoelectric actuator in the bonding module for LATCB. The design variables of the flexure hinge were defined as the hinge height, the minimum diameter, and the notch radius. And the effect of the change of each variable on the stress generated in the flexible hinge and the lateral force acting on the piezoelectric actuator was analyzed. Also, optimization was carried out using commercial structural analysis software. As a result, when the displacement difference between the piezoelectric actuators is the maximum (90um), the maximum stress generated in the flexible hinge is 11.5% of the elastic limit of the hinge material, and the lateral force acting on the piezoelectric actuator is less than 1N.

• ETRI Journal
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• v.37 no.3
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• pp.523-532
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• 2015

Recently, we have witnessed the gradual miniaturization of electronic devices. In miniaturized devices, flip-chip bonding has become a necessity over other bonding methods. For the electrical connections in miniaturized devices, fine-pitch solder bumping has been widely studied. In this study, high-volume solder-on-pad (HV-SoP) technology was developed using a novel maskless printing method. For the new SoP process, we used a special material called a solder bump maker (SBM). Using an SBM, which consists of resin and solder powder, uniform bumps can easily be made without a mask. To optimize the height of solder bumps, various conditions such as the mask design, oxygen concentration, and processing method are controlled. In this study, a double printing method, which is a modification of a general single printing method, is suggested. The average, maximum, and minimum obtained heights of solder bumps are $28.3{\mu}m$, $31.7{\mu}m$, and $26.3{\mu}m$, respectively. It is expected that the HV-SoP process will reduce the costs for solder bumping and will be used for electrical interconnections in fine-pitch flip-chip bonding.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.81-85
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• 2013

Wafer stacking technology becomes more important for the next generation IC technology. It requires new process development such as TSV, wafer bonding, and wafer thinning and also needs to resolve wafer warpage, power delivery, and thermo-mechanical reliability for high volume manufacturing. In this study, Cu CMP which is the key process for wafer bonding has been studied using Cu CMP and oxide CMP processes. Wafer samples were fabricated on 8" Si wafer using a damascene process. Cu dishing after Cu CMP and oxide CMP was $180{\AA}$ in average and the total height from wafer surface to bump surface was approximately $2000{\AA}$.

• Journal of Institute of Control, Robotics and Systems
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• v.19 no.11
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• pp.979-983
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• 2013

The three-dimensional measurement method of confocal systems is a spot scanning method which has a high resolution and good illumination efficiency. However, conventional confocal systems had a weak point in that it has to perform XY axis scanning to achieve FOV (Field of View) vision through spot scanning. There are some methods to improve this problem involving the use of a galvano mirror [1], pin-hole array, etc. Therefore, in this paper we propose a method to improve a parallel mode confocal system using a micro-lens and pin-hole array in a dual microscope configuration. We made an area scan possible by using a combination MLA (Micro Lens Array) and pin-hole array, and used an objective lens to improve the light transmittance and signal-to-noise ratio. Additionally, we made it possible to change the objective lens so that it is possible to select a lens considering the reflection characteristic of the measuring object and proper magnification. We did an experiment using 5X, 2.3X objective lens, and did a calibration of height using a VLSI calibration target.

• Tribology and Lubricants
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• v.39 no.5
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• pp.203-211
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• 2023

This study experimentally investigates the effects of angular acceleration on the friction and wear performances of a gas foil thrust bearing (GFTB) using a typical GFTB with six pads. The outer radius of the bearing is 31.5 mm, the total bearing area is 2,041 mm² , and the bump foil and incline (ramp) height are both 500 ㎛. The newly developed GFTB test rig for measuring the friction torque and coefficient measures the axial load, drag torque, lift-off speed, and touch-down speed. The experiment is conducted for angular accelerations of 78.5, 314.2, and 328.3 rad/s² at axial loads of 5, 10, and 15 N, respectively. The test shows that the start-up friction coefficient increases with increasing axial load at the same angular acceleration, and the friction coefficient decreases with increasing angular acceleration under the same axial load. As the angular acceleration increases, the lift-off speed at the motor start-up increases, and the touch-down speed at the motor stop decreases. The wear distance of the GFTB for a single on/off cycle increases with increasing axial load at the same angular acceleration and decreases nonlinearly with increasing angular acceleration under the same axial load. The test results suggest that adjusting the rotational angular acceleration helps reduce bearing friction and wear.

• Journal of the Computational Structural Engineering Institute of Korea
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• v.24 no.1
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• pp.79-85
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• 2011

Bridge Weigh-in-Motion(BWIM) system calculates a travelling vehicle's weight without interruption of traffic flow by analyzing the signals that are acquired from various sensors installed in the bridge. BWIM system or data accumulated from the BWIM system can be utilized to development of updated live load model for highway bridge design, fatigue load model for estimation of remaining life of bridges, etc. Field test with moving trucks including various load cases should be performed to guarantee successful development of precise BWIM system. In this paper, a numerical simulation technique is adopted as an alternative or supplement to the vehicle traveling test that is indispensible but expensive in time and budget. The constructed numerical model is validated by comparison experimentally measured signal with numerically generated signal. Also vehicles with various dynamic characteristics and travelling conditions are considered in numerical simulation to investigate the variation of bridge responses. Considered parameters in the numerical study are vehicle velocity, natural frequency of the vehicle, height of entry bump, and lateral position of the vehicle. By analyzing the results, it is revealed that the lateral position and natural frequency of the vehicle should be considered to increase precision of developing BWIM system. Since generation of vehicle travelling signal by the numerical simulation technique costs much less than field test, a large number of test parameters can effectively be considered to validate the developed BWIM algorithm. Also, when artificial neural network technique is applied, voluminous data set required for training and testing of the neural network can be prepared by numerical generation. Consequently, proposed numerical simulation technique may contribute to improve precision and performance of BWIM systems.