• Journal of the Korea Institute of Building Construction
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• v.12 no.4
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• pp.442-450
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• 2012

In this study, fire resistance and residual strength were examined after the addition of PF fiber and bonding fireproofing gypsum board to a high strength concrete-model column of 50 MPa grade. At the beginning of the experiment, all the properties of base concrete appeared to satisfy the target range. In terms of the internal temperature record, a trend of slightly high temperature was shown when the fireproofing gypsum board was not bonding, and when the fireproofing gypsum board was bonding, as PF content increased gradually, the temperature was gradually lowered. In terms of the relationship, as time elapsed a low temperature was shown when fiber was mixed, and when the board was bonding, the trend of lower temperature could be confirmed. Meanwhile, in terms of spalling property, a severe explosive fracture was generated at PF 0%, and falling off was prevented as the fiber content was increased; however, discoloration and a multitude of cracks were discovered, and when the board was bonding, the trend in which the exterior became satisfactory when the content was increased emerged. In terms of the residual compressive strength, measuring of strength could not be performed at PF 0% without bonding of board, and the strength was increased as the fiber content was increased; however, there was a decrease in strength of about 30 ~ 40%, and in the case of PF 0% with the bonding of board, the strength could be measured; however, about an 80% decrease in strength was shown, and only about a 10 ~ 20% decline in strength was displayed, as the range of decrease was reduced as the fiber content was increased. Considering all of these factors, it was determined that a more efficient enhancement of fire resistance was obtained when two methods are applied in combination rather than when the PF fiber content and bonding of fireproofing gypsum board are utilized individually.

• Korean Journal of Materials Research
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• v.19 no.11
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• pp.613-618
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• 2009

We designed new compositions for lead free and low temperature sealing glass frit of $ZnO-V_2O_5-P_2O_5$ system, which can be used for PDP (Plasma Display Panel) or other electronic devices. The $ZnO-V_2O_5-P_2O_5$ system can be used as a sealing material at temperatures even lower than 430$^{\circ}C$. This system, however, showed lower bonding strength with glass substrate compared to commercialized Pb based sealing materials. So, we added $TiO_2$ as a promoter for bonding strength. We examined the effect of $TiO_2$ addition on sealing behaviors of $ZnO-V_2O_5-P_2O_5$ glasses with the data for flow button, wetting angle, temporary & permanent residual stress of glass substrate, EPMA analysis of interface between sealing materials and glass substrate, and bonding strength. As a result, sealing characteristics of $ZnO-V_2O_5-P_2O_5$ system glasses were improved with $TiO_2$ addition, but showed a maximum value at 5 mol% $TiO_2$ addition. The reason for improved bonding characteristics was considered to be the chemical interaction between glass substrate and sealing glass, and structural densification of sealing glass itself.

• Fashion & Textile Research Journal
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• v.14 no.6
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• pp.1024-1031
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• 2012

The thermal bonding PET fabrics were produced through high temperature steaming (HTS) of low melting PET yarn as warp and composite fancy yarn containing low melting PET yarn as weft. The low melting PET yarn of sheath-core structure consisted of a regular PET in core portion and low melting PET in sheath portion. The composite fancy yarn consisted of regular PET yarn as inner part and effect part and low melting PET yarn as binding part. This study was carried out to investigate the melting behavior of thermal bonded PET fabric, the effect of HTS on the thermal bonding, mechanical properties, and dyeing properties. The melting peak of low melting PET yarn showed two melting peaks caused by sheath-core structure. Almost the entire thermal bonding of the fancy PET fabrics containing low melting PET yarn has formed at $200^{\circ}C{\times}3min$ of HTS. The tensile strength in warp and weft direction of the fancy PET fabrics slightly decreased as temperature of HTS increased. The total K/S value of the fancy PET fabrics decreased slightly to $180^{\circ}C{\times}3min$ of HTS, while increased slightly above $200^{\circ}C{\times}3min$ of HTS. The changes in the hue angle ($H^{\circ}$) of the thermal bonded fancy PET fabrics dyed with disperse dyes hardly ever happened.

• Journal of the Korean Wood Science and Technology
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• v.39 no.5
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• pp.381-389
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• 2011

The effect of organoclays on the mechanical properties of cured phenol formaldehyde resin and oriented strand lumber made from Mountain Pine Beetle killed pine strands was analyzed. Three organoclays were used: a natural montmorillonite, hydrophobic organically modified 10 A, and hydrophilic organically modified 30 B. The oriented strand lumber samples were less creep deformation as well as improved internal bonding strength by adding organoclays in the order of 10 A 2% > MMT 2% > 30 B 2% > control. Furthermore, time-temperature superposition (TTS) analysis was proved to be able to predict the long-term creep behavior of MPB-OSL samples.

• Journal of Mechanical Science and Technology
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• v.18 no.3
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• pp.453-459
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• 2004

TiNi/ Al6061 shape memory alloy (SMA) composite was fabricated by hot press method to investigate the microstructure and mechanical properties. Interface bonding between TiNi reinforcement and A1 matrix was observed by using SEM and EDS. Pre-strain was imposed to generate compressive residual stress inside composite. A tensile test for specimen, which under-went pre-strain, was performed at high temperature to evaluate the variation of strength and the effect of pre-strain. It was shown that interfacial reactions occurred at the bonding between matrix and fiber, creating two inter-metallic layers. And yield stress increased with the amount of pre-strain. Acoustic Emission technique was also used to nondestructively clarify the microscopic damage behavior at high temperature and the effect of pre-strain of TiNi/ Al6061 SMA composite.

• Transactions of Materials Processing
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• v.20 no.2
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• pp.140-145
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• 2011

The aim of the present study is to derive optimized post heat treatment temperatures to get a proper formability for Ti/STS409L/Ti clad materials. These clad materials were fabricated by cold rolling followed by a post heat treatment process for 10 minutes at temperatures ranging from $500^{\circ}C$ to $850^{\circ}C$. The microstructure of the interface was observed using a Scanning Electron Microscope(SEM) and an Energy Dispersive X-ray Analyser(EDX) in order to investigate the effects of post heat treatment on the bonding properties of the Ti/STS409L/Ti clad materials. Diffusion bonding was observed at the interfaces with a diffusion layer thickness increasing with the post heat treatment temperature. The diffusion layer was composed of a type of(${\varepsilon}+{\zeta}$) intermetallic compound containing additional elements, namely, Fe, Ti and Ni. The micro Knoop hardness of the Ti/STS409L interfaces was found to increase with heat treatment up to $800^{\circ}C$ and then decrease for temperatures rising up to $850^{\circ}C$. The tensile strength was shown to decrease for heat treatment temperature increasing to $750^{\circ}C$ and then increase rapidly for temperature rising up to $850^{\circ}C$. A post heat treatment temperature range of $700{\sim}750^{\circ}C$ was found to optimize the formability of Ti/STS409L/Ti clad materials.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07b
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• pp.830-833
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• 2003

This paper describes the fabrication and characteristics of 3C-SiCOI sotctures by SDB and etch-back technology for high-temperature MEMS applications. In this work, insulator layers were formed on a heteroepitaxial 3C-SiC film grown on a Si(001) wafer by thermal wet oxidation and PECVD process, successively. The pre-bonding of two polished PECVD oxide layers made the surface activation in HF and bonded under applied pressure. The wafer bonding characteristics were evaluated by the effect of HF concentration used in the surface treatment on the roughness of the oxide and pre-bonding strength. Hydrophilic character of the oxidized 3C-SiC film surface was investigated by ATR-FTIR. The strength of the bond was measured by tensile strengthmeter. The bonded interface was also analyzed by SEM. The properties of fabricated 3C-SiCOI structures using etch-back technology in TMAH solution were analyzed by XRD and SEM. These results indicate that the 3C-SiCOI structure will offers significant advantages in the high-temperature MEMS applications.

• Journal of the Korean Wood Science and Technology
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• v.45 no.6
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• pp.703-719
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• 2017

Miscanthus had a higher lignin content (19.5 wt%) and carbohydrate (67.6 wt%) than other herbaceous crops, resulting in higher pellet strength and positive effect on combustion. However, miscanthus also contains a high amount of hydrophobic waxes on its outer surface, cuticula, which limits the pellet quality. The glass transition of lignin and cuticula were related to forming inter-particle bonding, which determined mechanical properties of pellet. To determine the effects of surface waxes, both on the pelletizing process and the pellet strength were compared with raw and extracted samples through solvent extraction. In addition, to clarify the relationship between pellet process parameters and bonding mechanisms, the particle size and temperature are varied while maintaining the moisture content of the materials and the die pressure at constant values. Furthermore, kraft lignin was employed to determine the effect of kraft lignin as an additive in the pellets. As results, the removal of cuticula through ethanol extractions improved the mechanical properties of the pellet by the formation of strong inter-particle interactions. Interestingly, the presence of lignin in miscanthus improves its mechanical properties and decreases friction against the inner die at temperatures above the glass transition temperature ($T_g$) of lignin. Consequently, it could found that the use of kraft lignin as an additive in pellet reduced friction in the inner die upon reaching its glass transition temperature.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.11a
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• pp.138-140
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• 2001

Fluxless flip chip bonding using plasma & ultrasonic wave was investigated in order to evaluate the effect of plasma & ultrasonic treatment on the bondability of the Sn-3.5wt%Ag solder bumped die to TSM-coated glass substrate. The $Ar+10%H_2plasma$ was effective in removing tin oxide on solder surface. The die shear strength of the plasma-treated Si-chip is higher than that of non-treated specimen but lower than that of specimen bonded with flux. The die shear strength with the bonding load at 25W ultrasonic power increased to 0.8N/bump for all bonding temperature but decreased above 1.0N/bump.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 1995.03a
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• pp.90-106
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• 1995

The "O"S' BONDING make metallic and non-metalic crystal structures and form localized superconducting orbitals , which induce electrical conduction , semi-conduction, and superconduction. The orbitals are proced by Ampere's law, Faraday's law , Meissner effect, highcritical temperature of thecopper oxide layers. abnomal trans-membrane signal in cancer cell and plastic deformations bytwins and dislocations, In the case of alloying metals, the most deterimentla cases of electrical conduction are those of solid solution and intermetalic compound . The highest case for the hardness are also those of solid solution and intermetallic compound. It explains the contributions of the "O"S' BONDING for conduction bands and plastic deformation by twins and dislocations.ns and dislocations.