• 제목/요약/키워드: Bonding surface

검색결과 1,560건 처리시간 0.028초

Ni-Cr합금과 도재간의 결합력에 gold-based bonding agent가 미치는 영향 (The effect of the gold based bonding agents on the bond between Ni-Cr alloys and ceramic restorations)

  • 이정환;주규지
    • 대한치과기공학회지
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    • 제29권2호
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    • pp.213-223
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    • 2007
  • The success of a porcelain fused to metal (PFM) restoration depends upon the quality of the porcelain-metal bond. The adhesion between metal substructure and dental porcelain is related to the diffusion of oxygen to the reaction layer formed on cast-metal surface during firing. The purposed of this investigation was to study the effects of gold based bonding agent on Ni-Cr alloy-ceramic adhesion between porcelain matrix, gold based bonding agent and metal substructure interface. gold based bonding agent have been applied as an intermediate layer between a metal substructure and a ceramic coating. gold based bonding agent(Aurofilm NP, Metalor, Swiss) was applied on Ni-Cr alloy surface by four method. Surfaces only air abraded with 110${\beta}\neq$ Al2O3 particles were used as control. metal ceramic adhesion was evaluated by a biaxial flexure test(N=5) and volume fraction of adherent porcelain was determined by SEM/EDS analysis. Result of this study suggest that the layering sequence of gold based bonding agent is very important and can improve porcelain adherence to PFM.

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실험계획법을 이용한 LCD 압착장비의 설계최적화 (The Design Optimization of LCD Panel Bonding Equipment by Design of Experiment)

  • 황일권;김동민;채수원
    • 한국정밀공학회지
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    • 제27권12호
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    • pp.92-98
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    • 2010
  • The design of press bonding tool in LCD module equipment is a very complex and difficult task because many design able variables are involved while their effects are not known. It takes longtime experiments and much expenses to verify the effects of these design variables. However the optimization of bonding tool using OLB(outer lead bonding) and PCB Bonding is a very important problem in LCD manufacturing process, so much design efforts have been made for improving the bonding tool performance. In this paper, a reasonable and fast process which gives optimized solution under the design requirements has been presented. Both analytical and statistical methods are employed in this process. A reliable analytic model using experiment-oriented FE analysis can be obtained, in which the regression equations that predict the tool efficiency from various DOE method are found. Improvement of tool efficiency could be estimated by the regression equations using meaningful factors converged by RSM(Response Surface Method). With this process a reasonable optimized solution that meets a variety of design requirements can be easily obtained.

Direct Bonding System의 도포액이 법랑질 표면에 주는 효과 (THE EFFECTS OF PRETREATMENT SOLUTION OF THE DIRECT BONDING SYSTEM ON THE ENAMEL SURFACE)

  • 장영일
    • 대한치과교정학회지
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    • 제3권1호
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    • pp.21-28
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    • 1972
  • 저자는 direct bonding system의 pretreatment액 처리후 Epoxy adhesive의 bonding strength의 변화를 측정하기 위해서 발거된 상악 전치 진면 법랑질 표면에 pretreatment액으로서 $65\%$ phosphoric acid를 도포한 실험군과 도포하지 않은 비교군을 비교연구하고 임상에 적용하여 다음과 같은 결과를 얻었다. 1. 법랑질 표면에 pumicing과 $65\%$ phosphoric acid를 도포했을때 joint strength는 현저히 상승했다. 2. Epoxy adhesive의 bonding strength는 plastic attachment를 치아면에 접착유지시키기에 충분하며 임상적으로 이용할 수 있다. 3. Joint area가 클 수록 bonding strength는 증가했다.

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모래분사법과 불투명 도재의 도포방법이 도재용착주조관의 전단결합강도에 미치는 영향 (The Influence of Surface Treatment and Opaque Application Methods on the Bond Strength of PFM Restorations)

  • 김성민;최성민;정인성
    • 대한치과기공학회지
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    • 제33권4호
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    • pp.339-347
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    • 2011
  • Purpose: This study was investigated the bonding strength of two kinds of Ni-Cr alloy with respect to the condition of surface treatment. Methods: The surface treatment was performed on the two kinds of Ni-Cr alloy (B alloy and R alloy) specimens, which were sandblasted with $50{\mu}m$, $110{\mu}m$, and $250{\mu}m$ aluminium oxide and were treated with opaque application (paste and wash opaque). The roughness on the surfaces of the specimens was observed. The metal-ceramic interfaces were analyzed with EPMA in order to ionic diffusion, and the shear test was performed. Results: The BA250 specimen, which has higher surface roughness, showed the highest bonding strength in B specimens. In R specimens, the bonding strength of RA110 specimen was the highest. Conclusion: B specimen formed a mechanical bond between metal-ceramic interfaces; however, in the case of R specimen, a chemical bond was formed between that interfaces. There was no significant statistical difference between the bonding strengths of two types of specimens (p>0.05).

단결정 초내열합금의 재결정 방지를 위한 접합 전처리 조건에 관한 연구 (A Study on the Optimum Bonding Preparation Condition of Single Crystal Superalloy)

  • 김대업
    • Journal of Welding and Joining
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    • 제19권2호
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    • pp.191-199
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    • 2001
  • The oxidation and recrystallization behaviors of Ni-base single crystal superalloy, CMSX-2 were investigated to determine the condition of the preparation for transient liquid phase (TLP) bonding operations. The faying surfaces of CMSX-2 were worked by the shot peening, fine cutting and mechanical polishing treatments and the degree of working of treated surfaces was evaluated by the hardness test and X-ray diffraction method CMSX-2 was heat-treated at 1,173∼1.589k for 3.6ks in vacuum of 4mPa. The mechanically polished surface was slightly oxidized after heat treatment even in the vacuum atmosphere of 4mPa. The thickness of an oxide film increased with increasing the heating temperature and the surface roughness of the faying surface. Recrystallization occurred at the surface after heat treatment at above 1,423K when the hardness was increased more than Hv600 by the shot peening treatment while the mechanically polished or fine cut surfaces didn't recrystallized. Based on these results, it was clearfied that the mechanically polishing with fine abrasive grit could be used for the preparation of faying surface of CMSX-2 before bonding operation.

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Results of Delamination Tests of FRP- and Steel-Plate-Reinforced Larix Composite Timber

  • LEE, In-Hwan;SONG, Yo-Jin;SONG, Da-Bin;HONG, Soon-Il
    • Journal of the Korean Wood Science and Technology
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    • 제47권5호
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    • pp.655-662
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    • 2019
  • This study evaluated the multi-bonding performances of timbers as well as those of reinforcement and timber to obtain data for preparing guidelines regarding the use of timbers as large structural members. For the multi-bonding performances of timbers, four types of bonding surfaces were prepared according to the pith position. For the bonding performances of FRP (fiber-reinforced plastic)/steel plate and timber, a total of 11 types of specimens were produced for the selection of the appropriate adhesive. The bonding performances of the produced specimens were evaluated through a water soaking delamination test, a water boiling delamination test, and a block shear strength test. The test results showed that the bonding strength of the bonding surface according to the pith position was highest in the specimen for which the two sections with the pith at the center of the cross-section on timber and between the bonding surfaces (the tangential and radial sections were mixed) were bonded. Furthermore, the specimens for which the section (radial section) with the pith on the bonding surface of the timber was bonded showed a high delamination percentage. The results of the block shear strength test showed that the bonding section did not have a significant effect on the shear strength, and that the measured wood failure percentage was higher than the KS standard value. The PVAc adhesive showed the highest bonding strength between larix timber and GFRP (glass FRP). Furthermore, the epoxy and polyurethane adhesives showed good bonding strength for CFRP (carbon FRP) and structure steel, respectively.

냉간 및 온간에서의 구리와 알루미늄 압접에 관한 실험적 연구 (Experimental Study on Pressure Welding of Cu and Al at Cold and Warm Temperatures)

  • 심경섭;김용일;장성동;김원술;이용신
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2003년도 추계학술대회논문집
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    • pp.225-228
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    • 2003
  • This paper is concerned with pressure welding, which has been known as a main bonding mechanism for the cold and warm clad forming. Bonding characteristics of pressure welding between the copper and aluminum plates are experimentally investigated. Experiments are performed at the cold and warm temperature range with the variation of important factors such as magnitude of pressure, surface roughness of Cu and Al plates, and pressure holding time. It could be concluded that the bonding criterion might be given as a function of bonding pressure and surface roughness for the cold and warm temperature ranges.

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표면 개질된 탄소나노튜브를 사용한 에폭시 복합재료의 마모특성에 관한 연구 (An investigation of tribology properties carbon nanotubes reinforced epoxy composites)

  • 아부바카 빈 술렁;곽정춘;박주혁
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2005년도 춘계학술대회 논문집
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    • pp.663-667
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    • 2005
  • Surface modified carbon nanotubes were applied into the epoxy composites to investigate its tribological property. Carbon nanotubes reinforced epoxy composites were fabricated by casting. Effects to the tribological property of loading concentrations and types of surface modification of carbon nanotubes were investigated under sliding condition using linear reciprocal sliding wear tester. The results show that the small amount of carbon nanotubes into the epoxy exhibited lower weight loss than the pure epoxy. It is concluded that the effect of an enormous aspect ratio of carbon nanotubes surface area which wider than conventional fillers that react as interface for stress transfer. As increased the contents of carbon nanotubes, the weight loss from the wear test was reduced. And the surface modified carbon nanotubes show better tribological property than as produced carbon nanotubes. It is due that a surface modification of carbon nanotubes increases the interfacial bonding between carbon nanotubes and epoxy matrix through chemical bonding. Changes in worn surface morphology are also observed by optical microscope and SEM for investigating wear behaviors. Carbon nanotubes in the epoxy matrix near the surface are exposed, because it becomes the lubricating working film on the worn surface. It reduces the friction and results in the lower surface roughness morphology in the epoxy matrix as increasing the contents of the carbon nanotubes.

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상아질에 대한 저점도 복합레진의 자가접착에 관한 연구 (SELF-ADHESION OF LOW-VISCOSITY COMPOSITES TO DENTIN SURFACE)

  • 조태희;최경규;박상혁;박상진
    • Restorative Dentistry and Endodontics
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    • 제28권3호
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    • pp.209-221
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    • 2003
  • The objectiveness of this study was to evaluate whether low-viscosity composite can bond effectively to dentin surface without bonding resin. The low-viscosity composites being 50wt% filler content were made by the inclusion of bonding resin of two self-etching systems(Cleafil SE Bond, Unifil Bond) varied with contents as 0, 10, 20, 30, 40, 50wt%. Exposed dentin surfaces of extracted 3rd molars are used. Dentin bond strengths were measured. The tests were carried out with a micro-shear device placed testing machine at a CHS of 1mm/min after a low-viscosity composite was filled into an iris cut from micro tygon tubing with internal diameter approximately 0.8mm and height of 1.0mm. 1 Flexural strength and modulus was increased with the addition of bonding resin. 2. Micro-shear bond strength to dentin was improved according to content of bonding resin irrespective of applying or not bonding resin in bonding procedure, and that of Clearfil SE Bond groups was higher than Unifil Bond. 3. There were no significant difference whether use of each bonding resin in bonding procedure for S-40, S-50, U-50(p>0.05). 4. In SEM examination, resin was well infiltrated into dentin after primed with self-etching primer only for S-50 and U-50 in spite of the formation of thinner hybrid layer. Low viscosity composite including some functional monomer may be used as dentin bonding resin without an intermediary bonding agent. It makes a simplified bonding procedure and foresees the possibility of self-adhesive restorative material.

반응표면분석법을 이용한 LED Die Bonding 공정능력 최적화 (Process Capability Optimization of a LED Die Bonding Using Response Surface Analysis)

  • 하석재;조용규;조명우;이광철;최원호
    • 한국산학기술학회논문지
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    • 제13권10호
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    • pp.4378-4384
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    • 2012
  • LED 칩 패키징에서 다이 본딩은 웨이퍼에서 분할된 다이를 리드 프레임에 접착제로 고정시켜 칩이 다음 공정을 견딜 수 있는 충분한 강도를 제공하는 중요한 공정이다. 본 논문에서는 PLCC 구조 LED 패키지 프레임에 소형 제너 다이오드를 부착하는 다이 본딩 공정능력의 최적화를 위하여 공정에 영향을 미치는 여러 인자를 분석하여 반응표면분석법을 적용하여 그 결과를 도출하였다. 인자를 분석하여 5인자 3수준 4반응치를 고려하여 실험계획법을 수립하였으며, 그 결과 모든 반응치의 목표를 만족하는 최적 조건을 확보할 수 있었다.