• 한국구조물진단유지관리공학회 논문집
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• 제12권6호
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• pp.225-232
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• 2008

본 논문에서는 FRP 보강재의 부착방식에 따른 RC보의 휨보강 성능평가에 대하여 연구하였다. 기존의 FRP 휨보강공법은 보강재의 형태에 따라 크게 FRP 쉬트 보강공법과 FRP 플레이트 보강공법으로 분류될 수 있으며, 각 공법은 에폭시의 양생기간동안 쉬트의 들뜸이 발생하지 않도록 주의해야하거나, 앵커설치 등 시공이 복잡하며, 인력이 많이 소요되는 단점이 있다. 이러한 문제점을 개선하기 위하여 본 논문에서는 Velcro형 고정재를 사용하여 FRP 플레이트를 임시 고정하는 보강공법을 제안하였고, 이에 대한 휨보강 성능평가 실험을 실시하였다. 실험은 FRP보강재의 부착방식을 변수로 하여 총 4개 실험체에 대하여 수행하였다. 실험결과 벨크로형 FRP판 보강공법은 타 공법에 비하여 우수한 시공성을 가짐과 동시에 휨내력이나 연성도 면에서도 우수한 보강성능을 확보하고 있는 것으로 나타났다.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 1995년도 춘계학술대회논문집
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• pp.155-161
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• 1995

Superplastic forming/diffusion bonding(SPF/DB) processes are analyzed using a rigid visco-plastic finite element method. The optimum pressure-time relationship for a target strain rate and thickness distributions were predicted using two-node line element based on membrane approximation for plane strain shapes. Material behavior during SPF/DB of the integral structures with complicated shapes are investigated. The tying condition is employed for the analysis inter-sheet contact problems. A movement of rib structure is successfully prodicted during the forming.

• 콘크리트학회지
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• 제11권1호
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• pp.129-139
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• 1999

본 연구는 콘크리트 구조물의 보강공법으로 널리 쓰이고 있는 강판에 의한 부착식 보강공법의 단점인 단부에서의 강판분리 현상에 대한 보완실험으로 실시되었다. 실험결과 노치가 적용된 강판부착식 공법이 항복하중 이후 최대하중까지의 증가율이 기존의 공법보다 증가되어 구조물의 보강 성능의 개선 및 안전성의 확보 측면에서 크게 개선되었을 뿐만 아니라 균열이나 처짐의 조절측면에서도 우수한 것으로 판명되었다. 이는 강판에 대한 약간의 변형만으로도 구조물의 수명을 연장시킬 수 있다는 장점과 함께 경제적으로도 보강된 구조물에 대한 추가적인 제반 비용의 절감도 기대할 수 있을 것이다.

• Advanced Composite Materials
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• 제18권3호
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• pp.221-232
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• 2009

The allylamine plasma treatment is used to modify the surface properties of vapor grown carbon fibers (VGCF). It is to improve the interfacial bonding between the VGCF and epoxy matrix. The allylamine plasma process was performed by batch process in a vacuum chamber, using gas injection followed by plasma discharge for the durations of 20, 40 and 60 min. The interdependence of mechanical properties on the VGCF contents, treatment time and interfacial bonding between VGCF/ep was investigated. The interfacial bonding between VGCF and epoxy matrix was observed by scanning electron microscopy (SEM) micrographs of nanocomposites fracture surfaces. The changes in the mechanical properties of VGCF/ep, such as the tensile modulus and strength were discussed. The mechanical properties of allylamine plasma treated (AAPT) VGCF/ep were compared with those of raw VGCF/ep. The tensile strength and modulus of allyamine plasma treated VGCF40 (40 min treatment)/ep demonstrated a higher value than those of other samples. The mechanical properties were increased with the allyamine plasma treatment due to the improved adhesion at VGCF/ep interface. The modification of the carbon nanofibers surface was observed by transmission electron microscopy (TEM). SEM micrographs showed an excellent dispersion of VGCF in epoxy matrix by ultrasonic method.

• 한국자동차공학회논문집
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• 제13권4호
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• pp.129-134
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• 2005

There is a strong industrial demand for the development of light-weight vehicle to improve fuel efficiency and dynamic performance. The effective method of achieving the weight reduction is to use low-density materials such as aluminum and magnesium. In applying these materials to the vehicle, it is often required to join dissimilar materials such as aluminum and steel. However, conventional joining method, namely resistance spot welding cannot be used in joining dissimilar materials. Self·piercing rivet(SPR) and adhesive bonding is a good alternative to resistance spot welding. In this study, the impact test of double hat-shaped member made by resistance spot welding, SPR and adhesive bonding was performed. As a result, various parameters of crashworthiness were analyzed and evaluated. Also, the applicability of SPR and adhesive bonding as an alternative to resistance spot welding was suggested.

• 대한금속재료학회지
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• 제46권9호
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• pp.604-608
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• 2008

The layered compounds vanadium disulfide($VS_2$) and vanadium dioxide($VO_2$) intercalated with Li are investigated for using the Discrete Variational $(DV)-X{\alpha}$ molecular orbital method. The chemical bonding properties of the atoms were examined by bond overlap population of electronic states. The plot of density of states supports the covalent bonding properties by showing the overlap between the atoms. There is a strong tendency of covalent bonding between V-S and V-O. The intensity of covalent bonding of $VS_2$ is stronger than $VO_2$. The net charge of $LiVO_2$ is higher than that of $LiVS_2$. This results of the calculation of $VO_2$ and $VS_2$ indicate that $(DV)-X{\alpha}$ method can be widely applied in the new practical materials.

• 대한금속재료학회지
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• 제49권5호
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• pp.380-387
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• 2011

Wire brushing, which is a typical surface preparation method for roll bonding, has recently been highlighted as a potentially effective method for surface nanocrystallization. In the present study, the microstructure evolution and hardness of the wire-brushed surface and roll-bonded interface of a 1050 aluminum sheet were investigated. Wire brushing formed protruded layers with a nanocrystalline structure and extremely high surface hardness. After roll bonding, the protruded layers remained as hard layers at the interface. Due to their hardness and brittleness the interface hard layers, can affect the interface bonding properties and also play an important role determining the mechanical properties of multi-layered clad sheets.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2018년도 춘계학술대회 논문집
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• pp.102-102
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• 2018

Electronic industry had required the finer size and the higher performance of the device. Therefore, 3-D die stacking technology such as TSV (through silicon via) and micro-bump had been used. Moreover, by the development of the 3-D die stacking technology, 3-D structure such as chip to chip (c2c) and chip to wafer (c2w) had become practicable. These technologies led to the appearance of HBM (high bandwidth memory). HBM was type of the memory, which is composed of several stacked layers of the memory chips. Each memory chips were connected by TSV and micro-bump. Thus, HBM had lower RC delay and higher performance of data processing than the conventional memory. Moreover, due to the development of the IT industry such as, AI (artificial intelligence), IOT (internet of things), and VR (virtual reality), the lower pitch size and the higher density were required to micro-electronics. Particularly, to obtain the fine pitch, some of the method such as copper pillar, nickel diffusion barrier, and tin-silver or tin-silver-copper based bump had been utillized. TCB (thermal compression bonding) and reflow process (thermal aging) were conventional method to bond between tin-silver or tin-silver-copper caps in the temperature range of 200 to 300 degrees. However, because of tin overflow which caused by higher operating temperature than melting point of Tin ($232^{\circ}C$), there would be the danger of bump bridge failure in fine-pitch bonding. Furthermore, regulating the phase of IMC (intermetallic compound) which was located between nickel diffusion barrier and bump, had a lot of problems. For example, an excess of kirkendall void which provides site of brittle fracture occurs at IMC layer after reflow process. The essential solution to reduce the difficulty of bump bonding process is copper to copper direct bonding below $300^{\circ}C$. In this study, in order to improve the problem of bump bonding process, copper to copper direct bonding was performed below $300^{\circ}C$. The driving force of bonding was the self-annealing properties of electrodeposited Cu with high defect density. The self-annealing property originated in high defect density and non-equilibrium grain boundaries at the triple junction. The electrodeposited Cu at high current density and low bath temperature was fabricated by electroplating on copper deposited silicon wafer. The copper-copper bonding experiments was conducted using thermal pressing machine. The condition of investigation such as thermal parameter and pressure parameter were varied to acquire proper bonded specimens. The bonded interface was characterized by SEM (scanning electron microscope) and OM (optical microscope). The density of grain boundary and defects were examined by TEM (transmission electron microscopy).

• 소성∙가공
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• 제16권2호
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• pp.138-143
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• 2007

Superplastic forming/diffusion bonding (SPF/DB) processes were analyzed using a 3-D rigid visco-plastic finite element method. A constant-triangular element based on membrane approximation and an incremental theory of plasticity are employed for the formulation. The coulomb friction law is used for interface friction between tool and material. Pressure-time relationship for a given optimal strain rate is calculated by stress and pressure values at the previous iteration step. In order to improve the contact searching, hierarchical search algorithm has been applied and implemented into the code. Various geometries including sandwich panel and 3 sheet shape for 3-D SPF/DB model are analyzed using the developed program. The validity fer the analysis is verified by comparison between analysis and results in the literature.

• 소성∙가공
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• 제16권2호
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• pp.144-149
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• 2007

The superplastic forming/diffusion bonding(SPF/DB) is widely used in the automotive and aerospace industry because it has great advantage to produce complex, light and strong parts. But the superplastic forming process requires much forming time and generates excessive thinning in the thickness distribution of formed part. It is necessary to minimize trial and error for SPF/DB Process. Finite element analysis using $L_{18}$ orthogonal may table of Taguchi method for 3-Sheet D/B process is carried out. Through the study, effect of process parameters, such as DH region size, thickness and friction coefficient, is evaluated and the optimum condition is derived.