• 대한기계학회:학술대회논문집
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• 대한기계학회 2000년도 추계학술대회논문집A
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• pp.292-297
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• 2000

In this research, the dynamic photoelastic experimental hybrid method for bimaterial is introduced. Dynamic biaxial loading device is developed, its strain rate is 31.637 s-1 and its maximum impact load is 20 ton. Manufactured methods for model of the dynamic photoelastic experiment for bimaterial are suggested. They are bonding method(bonding material: AW106, PC-1) and molding method. In the bonding method, residual stress is not occurred in the manufactured bimaterial. Crack is propagated along the interface or sometimes deviated from the interface. While in the molding method, residual stress is occurred in the manufactured bimaterial. Crack is always deviated from the interface and propagated in the epoxy region(softer materila). In order to propagate with constant velocity along the interface of bimaterial with arbitrary stiffer material, edge crack should be located along the interface of the acute angle side of the softer material in the bimaterial.

• Journal of the Korean Wood Science and Technology
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• 제44권3호
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• pp.315-322
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• 2016

2개 이상의 보부재 집성재 요소들의 측면접착으로 제작된 "블록접착집성재"는 대단면 목조건축물의 건축부재로 활용 가능한 구조용재다. 블록접착집성재의 측면은 접착제의 종류와 도포량 및 압체압력을 각기 다른 조합으로 접착하여 박리시험과 전단블록시험으로 접착성능을 검토하였다. 실험결과 레조시놀접착제 $500g/m^2$을 도포하고 압체압력 1.5 MPa의 조건으로 제작된 블록접착집성재의 측면접착성능이 가장 양호하였다. 양호한 측면접착조건으로 제작된 블록접착집성재는 동일단면계수의 대조군 집성재와 휨 강도 성능을 비교 검토하였다. 블록접착집성재의 휨 탄성계수는 대조군 집성재와 유사하였으며, 파괴계수는 대조군집성재 보다 27% 향상되었다. 할렬은 대조군집성재 보다 블록접착집성재에서 다량 발생하였으며, 블록접착집성재의 측면접착층에서 계면파괴나 응집파괴는 관찰되지 않았다.

• 대한기계학회논문집A
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• 제37권3호
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• pp.373-378
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• 2013

엔진의 출력증대와 이에 따른 변속기의 크기 증가 등으로 인한 회전체의 관성증가로 변속기의 변속성능은 악조건이 되고 있다. 따라서, 이를 해결하기 위하여 내마모성이 높은 마찰소재의 개발이 요구된다. 디젤차량 수동변속기용 싱크로나이저 링에 요구되는 마찰특성에 적합한 소재를 개발하고, 이에 대한 접합 특성을 평가하였다. 즉, 철합금 모재와 동합금계 마찰재를 접합하는 공정을 개발하고, 접합층에 대하여 BSE분석, EDX분석을 수행하여 접합특성을 평가하였으며, 해당 시험편에 대하여 전단강도를 평가하였다.

• 대한금속재료학회지
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• 제47권9호
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• pp.573-579
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• 2009

Titanium/aluminum/stainless steel(Ti/Al/STS) clad materials have received much attention due to their high specific strength and corrosion-resisting properties. However, it is difficult to fabricate these materials, because titanium oxide is easily formed on the titanium surface during heat treatment. The aim of the present study is to derive optimized cladding conditions and thereupon obtain the stable quality of Ti/Al/STS clad materials. Ti sheets were prepared with and without pre-heat treatment and Ti/Al/STS clad materials were then fabricated by cold rolling and a post-heat treatment process. Microstructure of the Ti/Al and STS/Al interfaces was observed using a Scanning Electron Microscope(SEM) and an Energy Dispersed X-ray Analyser(EDX) in order to investigate the effects of Ti pre-heat treatment on the bond properties of Ti/Al/STS clad materials. Diffusion bonding was observed at both the Ti/Al and STS/Al interfaces. The bonding force of the clad material with non-heat treated Ti was higher than that with pre-heat treated Ti before the cladding process. The bonding force decreased rapidly beyond $400^{\circ}C$, because the formed Ti oxide inhibited the joining process between Ti and Al. Bonding forces of STS/Al were lower than those of Ti/Al, because brittle $Fe_3Al$, $Al_3Fe$ intermetallic compounds were formed at the interface of STS/Al during the cladding process. In addition, delamination of the clad material with pre-heat treated Ti was observed at the Ti/Al interface after a cupping test.

• 한국기계가공학회지
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• 제20권1호
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• pp.42-47
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• 2021

Recently, many structures using lightweight materials have been developed. This study was conducted by using Al6061-T6 and carbon fiber reinforced plastic (CFRP), two common lightweight materials. In addition, the failure characteristics of an interface bonded between a single material and a heterogeneous bonding material were analyzed. The specimens bonded with CFRP and Al6061-T6 were utilized by the combination of the heterogeneous bonding material. The specimens had a double cantilevered shape and the bonding between the materials was achieved by applying a structural adhesive. The experiments were conducted in opening mode: the lower part of the samples was fixed, while their upper part was subjected to a forced displacement of 3 mm/min by using a tensile tester. Under the tested amount of strength, energy release rate, and considering the specimens' fracture characteristics in opening mode, the specimen "CFRP-Al" presented the maximum stress, followed by "Al" and "CFRP". We can hence conclude that the inhomogeneous material "CFRP-Al" is useful for the construction of lightweight structures bonded with structural adhesive.

• 한국표면공학회지
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• 제49권6호
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• pp.549-554
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• 2016

Low melting metals are difficult to weld because it is vaporized. But epoxy resin make bonding possible using low melting material and dismissal materials. This study is to improve the bonding strength of epoxy and substrate by mechanical and electrochemical methods. In case of mechanical work, bonding strength is 17.6MPa and in case of pre-work, bonding strength is 15.3MPa. When anodizing and mechanical work is applied, bonding strength is 25.3Mpa is increased 165%. When anodizing is applied, bonding strength is 27.6Mpa.

• 마이크로전자및패키징학회지
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• 제20권2호
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• pp.11-15
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• 2013

The wafer bonding process becomes a flexible approach to material and device integration. The bonding strength in 3-dimensional process is crucial factor in various interface bonding process such as silicon to silicon, silicon to metals such as oxides to adhesive intermediates. A measurement method of bonding strength was proposed by utilizing AFM applied CNT probe tip which indicated the relative simplicity in preparation of sample and to have merit capable to measure regardless type of films. Also, New Tool was utilized to measure of tip radius. The cleaned $SiO_2$-Si bonding strength of SPFM indicated 0.089 $J/m^2$, and the cleaning result by RCA 1($NH_4OH:H_2O:H_2O_2$) measured 0.044 $J/m^2$, indicated negligible tolerance which verified the possibility capable to measure accurate bonding strength. And it could be confirmed the effective bonding is possible through SPFM cleaning.

• 한국재료학회지
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• 제2권4호
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• pp.241-247
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• 1992

본 연구에서는 $Cu-Cu_2$O의 공정반응에 의한 구리와 알루미나의 직접접합에 대하여 연구 하였다. $1.5{\times}10^{-1}$torr, $1015^{\circ}C$에서 산화시킨 후 $10_{-3}$torr, 107$5^{\circ}C$에서 접합시킨 시편의 접합력과 계면특성을 인장시험, SEM, EDS 및 XRD를 통하여 분석하였다. 3분 산화시켜 접합하면 우수한 접합강도를 보이며 산화시간이 이보다 짧거나 길면 결합력은 저하하였다. 과단은 알루미나 공정조직 계면에서 발생하였으며 파단후 $Al_2O_3$표면에는 Cu쪽에서 빠져나간 $Cu_2$O nodule의 존재하였는 바 접합력은 $Cu_2$O-A$l_2O_3$계면보다는 $Cu-Cu_2$O계면에 좌우됨을 보여주고 있다. 접합력은 접합시간에 따라 완만한 증가를 보였으며 CuA$l_2O_4$및 $CuAlO_2$의 반응생성물이 접합중 형성되었다.

• Journal of Welding and Joining
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• 제32권4호
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• pp.46-54
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• 2014

In this study, the effect of bonding temperature and bonding pressure on deformation and tensile properties of diffusion bonded joint of STS304 compact heat exchanger was investigated. The diffusion bonds were prepared at 700, 800 and $900^{\circ}C$ for 30, 60 and 90 min in pressure of 3, 5, and 7 MPa under high vacuum condition. The height deformation of joint decreased and the width deformation of joint increased with increasing bonding pressure at $900^{\circ}C$. The ratio of non-bonded layer and void observed in the joint decreased with increasing bonding temperature and bonding pressure. Three types of the fracture surface were observed after tensile test. The non-bonded layer was observed in diffusion bonded joint preformed at $700^{\circ}C$, the non-bonded layer and void were observed at $800^{\circ}C$. On the other hand, the ductile fracture occurred in diffusion bonded joint preformed at $900^{\circ}C$. Tensile load of joint bonded at $800^{\circ}C$ was proportional to length of bonded layer and tensile load of joint bonded at $900^{\circ}C$ was proportional to minimum width of pattern. The tensile strength of joint was same as base metal.

• 한국재료학회지
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• 제19권11호
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• pp.625-630
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• 2009

Embedding of active devices in a printed circuit board has increasingly been adopted as a future electronic technology due to its promotion of high density, high speed and high performance. One responsible technology is to embedded active device into a dielectric substrate with a build-up process, for example a chipin-substrate (CiS) structure. In this study, desmear treatment was performed before Cu metallization on an FR-4 surface in order to improve interfacial adhesion between electroless-plated Cu and FR-4 substrate in Cu via structures in CiS systems. Surface analyses using atomic force microscopy and x-ray photoemission spectroscopy were systematically performed to understand the fundamental adhesion mechanism; results were correlated with peel strength measured by a 90o peel test. Interfacial bonding mechanism between electrolessplated Cu and FR-4 substrate seems to be dominated by a chemical bonding effect resulting from the selective activation of chemical bonding between carbon and oxygen through a rearrangement of C-C bonding rather than from a mechanical interlocking effect. In fact, desmear wet treatment could result in extensive degradation of FR-4 cohesive strength when compared to dry surface-treated Cu/FR-4 structures.