• Journal of Mechanical Science and Technology
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• 제17권11호
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• pp.1638-1649
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• 2003

A study is made on the characterization of damage tolerance by spherical indentation in hardly coated layer structure with modest elastic modulus mismatch. A hard silicon nitride is prepared for the coating material and silicon nitride with 5wt% of boron nitride composites for underlayer. Hot pressing to eliminate the effect of interface delamination during the fracture makes strong interfacial bonding. The elastic modulus mismatch between the layers is not only large enough to suppress the surface crack initiation from the coating layer but sufficiently small to prevent the initiation of radial crack from the interface. The strength degradation of the layer structure after sphere contact indentation does not significantly occur, while the degradation of silicon nitride-boron nitride composite is critical at a high load and high number of contacts.

• Journal of Powder Materials
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• 제4권3호
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• pp.196-204
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• 1997

Joining of AIN ceramics to W and Cu by active-metal brazing method was tried with use of (Ag-Cu)-Ti alloy as insert-metal. Joints were produced under various conditions of temperature, holding time and Ti-content in (Ag-Cu) alloy Reaction and microstructural development in bonded interface were investigated through observation and analysis by SEM/EDS, EPMA and XRD. Joint strengths were measured by shear test. Bonded interface consists of two layers: an insert-metal layer of eutectic Ag- and Cu-rich phases and a reaction layer of TiN. Thickness of reaction layer increases with bonding temperature, holding time and Ti-content of insert-metal. It was confirmed that the growth of reaction layer is a diffusion-controlled process. Activation energy for this process was 260 KJ/mol which is lower than that for N diffusion in TiN. Maximum shear strength of 108 MPa and 72 MPa were obtained for AIN/W and AIN/Cu joints, respectively. Relationship between processing variables, joint strength and thickness of reaction layer was also explained.

• Journal of Sensor Science and Technology
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• 제13권3호
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• pp.175-181
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• 2004

A pressure sensor for high temperature was fabricated by using a SDB(Silicon-Direct-Bonding) wafer with a Si/$SiO_{2}$/ Si structure. High pressure sensitivity was shown from the sensor using a single crystal silicon of the first layer as a piezoresistive layer. It also was made feasible to use under the high temperature as of over $120^{\circ}C$, which is generally known as the critical temperature for the general silicon sensor, by isolating the piezoresistive layer dielectrically and thermally from the silicon substrate with a silicon dioxide layer of the second layer. The pressure sensor fabricated in this research showed very high sensitivity as of $183.6{\mu}V/V{\cdot}kPa$, and its characteristics also showed an excellent linearity with low hysteresis. This sensor was usable up to the high temperature range of $300^{\circ}C$.

• Journal of the Korean institute of surface engineering
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• 제22권1호
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• pp.26-42
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• 1989

It has between investigated that the optimum spaying conditions, such as, spraying distance, fusing temperature and fusing time, ect, in a Ni-cr base self fluxing alloy sprayed on the mild steel substrate by oxygen-acetylenc flame spraying. Sprayed specimens on various conditions were fuused in a vacuum furnace and the results were as follows. The optimum spraying condition for excellent coating layer are obtained under spraying distances, fusing temperature and fusing and time ; 180~240mm,1050~110$0^{\circ}C$and 15~30min, respectively. The adhesive strength and surface hurface hardness of the as sprayed specimens were very low by mechanical bonding becaus of the diffusion layer during process. The carbides and borides and formed in the sprayed coating layer and densification of the layer was resulted from the elimination of pores and oxides. The hardness of sprayed coating layer, particularly in the high temperature, was superior to ordinary tool steels.

• Transactions of the Korean Society of Mechanical Engineers A
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• 제27권7호
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• pp.1132-1137
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• 2003

This study dealt with the suppression of interfacial reaction between Nb and MoSi$_2$ for the fabrication of high toughness Nb/MoSi$_2$ laminate composites, based on the results of a thermodynamical estimation. Especially, the effect of ZrO$_2$ particle on the interfacial reaction of Nb/MoSi$_2$ bonding materials has been examined. Nb/MoSi$_2$ bonding materials have been successfully fabricated by alternatively stacking matrix mixtures and Nb sheets and hot pressing in the graphite mould. The addition of ZrO$_2$ particle to MoSi$_2$ matrix is obviously effective for promoting both the interfacial reaction suppression and the sintered density of Nb/MoSi$_2$ bonding materials, since it is caused by the formation of ZrSiO$_4$ in the MoSi$_2$-ZrO$_2$ matrix mixture. The interfacial shear strength of Nb/MoSi$_2$ bonding materials also decreases with the reduction of interfacial reaction layer associated with the content of ZrO$_2$ particle and the fabrication temperature.

• Restorative Dentistry and Endodontics
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• 제21권1호
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• pp.425-435
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• 1996

The effect of application of dentin bonding agent to the exposed dentin on the intradental nerve activity (INA), dentinal fluid movement and sealing of the dentinal tubules, was investigated in this study. The INA was recorded from the single pulp nerve unit dissected from the inferior alveolar nerve. And specimen of dentin was observed by SEM. Dentinal fluid 'movement through exposed dentin surface was measured before and after the application of dentin bonding agent. 1. Eight Ao-fiber units (conduction velocity: $8.0{\pm}4.0m$/sec) were identified. 4M NaCl evoked an irregular burst of action potentials which ceased immediately after washing. 2. In 4 $A{\delta}$-fiber units, appliction of All Bond 2 completely abolished the INA induced by 4M NaCl. Also, application of Scotchbond Multipurpose(SBMP) totally abolished the INA induced by 4M NaCl in 4 $A{\delta}$-fiber units. 3. Before the application of dentin bonding agent, outward dentinal fluid movement of $10.2{\pm}5.7\;pl{\cdot}s^{-1}{\cdot}mm^{-2}$ was obsered. But after the application of dentin bonding agent the movement of dentinal fluid was stopped. 4. The gap width of 2-$3{\mu}m$ was formed between exposed dentin and adhesive resin in the specimens applied with dentin bonding agents of All Bone 2 and SBMP. But the formation of hybrid layer and the penetration of resin into were dentinal tubules were not clearly observed in interface between dentin and adhesive resin.

• Journal of the Korean Wood Science and Technology
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• 제44권3호
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• pp.315-322
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• 2016

Block-glued glulam is a structural material that can be used as a construction member of a large-section wooden building, which is produced by edgewise bonding of two or more glulam beam elements. The edgewise bonding performance of the block-glued glulam was examined through delamination test and block shear strength test. According to the test results, the block-glued glulam that was manufactured with 1.5 MPa of compressive pressure after applying $500g/m^2$ of Resorcinol adhesive showed the best edgewise bonding performance. The block-glued glulam produced in a good edgewise bonding condition was compared with a control glulam with the same section modulus for bending strength performance. The modulus of elasticity (MOE) in bending was similar to that of the control glulam. The modulus of rupture (MOR) of the block-glued glulam was higher by 27% than that of the control glulam. No interfacial failure or cohesive failure were observed in the edgewise bonding layer.

• Transactions of the Korean Society of Mechanical Engineers A
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• 제37권3호
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• pp.373-378
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• 2013

The speed change performance of transmissions has become a serious issue because of the increase in the inertia moment that has accompanied increases in engine output and transmission size. Therefore, it is necessary to develop better wear resistant friction materials. In this study, an appropriate sintered friction component for the synchronizer ring of a diesel manual transmission was developed, and its bonding characteristics were analyzed. That is, a process for bonding an Fe-based base material and Cu-based sintered friction material was developed. BSE and EDX analyses of this bonding layer were conducted, along with a shear strength test, to determine the bonding characteristics.

• Journal of Technologic Dentistry
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• 제35권2호
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• pp.113-120
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• 2013

Purpose: This study was to observe surface property and bonding strength according to composition of Ni-Cr alloy for porcelain fused to metal crown. The two kinds of Ni-Cr alloy with different composition ratio of parent metal were observed general properties and chemical properties of each alloy surface and measured the shear bonding strength between ceramic and each alloys. The aim of study was to suggest the material for design of parent metal's composition ratio to development of alloy for porcelain fused to metal crown. Methods: The two kinds of alloy as test specimen was Ni(71wt.%)-Cr(12wt.%) and Ni(63wt.%)-Cr(23wt.%) alloy. The oxide on surface was observed by SEM and EDX. And the shear test was performed by MTS. Results: The surface property and oxide characteristic analysis of oxide layer, weight percentage of Element O within $Ni_{71}Cr_{12}$ alloy measured 12.74wt.%, but $Ni_{63}Cr_{23}$ alloy was measured 15.91wt.%. And the maximum shear bonding strength was measured 106.14MPa between $Ni_{71}Cr_{12}$ alloy and vintage halo (VV group). Conclusion: The surface property and oxide characteristic of $Ni_{71}Cr_{12}$ alloy was similar to $Ni_{63}Cr_{23}$ alloy. And VV group has the strongest shear bonding strength.

• Korean Journal of Materials Research
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• 제34권3호
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• pp.170-174
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• 2024

In this study, we report the microstructural evolution and shear strength of an Sn-Sb alloy, used for die attach process as a solder layer of backside metal (BSM). The Sb content in the binary system was less than 1 at%. A chip with the Sn-Sb BSM was attached to a Ag plated Cu lead frame. The microstructure evolution was investigated after die bonding at 330 ℃, die bonding and isothermal heat treatment at 330 ℃ for 5 min and wire bonding at 260 ℃, respectively. At the interface between the chip and lead frame, Ni₃Sn₄ and Ag₃Sn intermetallic compounds (IMCs) layers and pure Sn regions were confirmed after die bonding. When the isothermal heat treatment is conducted, pure Sn regions disappear at the interface because the Sn is consumed to form Ni₃Sn₄ and Ag₃Sn IMCs. After the wire bonding process, the interface is composed of Ni₃Sn₄, Ag₃Sn and (Ag,Cu)₃Sn IMCs. The Sn-Sb BSM had a high maximum shear strength of 78.2 MPa, which is higher than the required specification of 6.2 MPa. In addition, it showed good wetting flow.