• Title/Summary/Keyword: Bonding interfaces

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Application of Generalized Lamb Wave for Evaluation of Coating Layers

  • Kwon, Sung-Duk;Kim, Hak-Joon;Song, Sung-Jin
    • Journal of the Korean Society for Nondestructive Testing
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    • v.27 no.3
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    • pp.224-230
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    • 2007
  • This work is aimed to explore a possibility of using the generalized Lamb waves for nondestructive evaluation of the bonding quality of layered substrates. For this purpose, we prepared two sets of specimens with imperfect bonding at their interfaces; 1) TiN-coated specimens with various wear conditions, and 2) CVD diamond specimens with various cleaning conditions. A dispersion simulation performed for layered substrates with imperfect interfaces are carried out to get the characteristics of dispersion curves that can be used for bonding quality evaluation. Then the characteristics of dispersion curves of the fabricated specimens are experimentally determined by use of an ultrasonic backward radiation measurement technique. The results obtained in the present study show that the lowest velocity mode (Rayleigh-like) of the generalized Lamb waves are sensitively affected by the bonding quality. Therefore, the generalized Lamb waves can be applied for nondestructive evaluation of imperfect bonding quality in various layered substrates.

Characterization of Cu/cordierite Interfaces by STEM (STEM에 의한 구리와 코디에라이트 접촉면의 특성 연구)

  • Han, Byung-Sung
    • Journal of the Korean Institute of Telematics and Electronics
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    • v.27 no.10
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    • pp.101-105
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    • 1990
  • The use of a sol-gel processed cordierite precursor sinterable about$900^{\circ}C$ allows cosintering of the copper and the ceramic. A strong bonding between the copper film and the cordierite substrate can be achieved through an eutectic bonding technique. These interfaces were investigated using STEM. copper diffusion as well as strong chemical and structural modifications was observed in the interface region. Although these interfaces have good adhesion properties, there was no evidence of the formation of the copper compound at the interface.

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STRESS ANALYSIS WITH NONLINEAR MODELLING OF THE LOAD TRANSFER CHARACTERISTICS ACROSS THE OSSEOINTEGRATED INTERFACES OF DENTAL IMPLANT

  • Lee Seung-Hwan;Jo Kwang-Hun
    • The Journal of Korean Academy of Prosthodontics
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    • v.42 no.3
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    • pp.267-279
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    • 2004
  • A modelling scheme for the stress analysis taking into account load transfer characteristics of the osseointegrated interfaces between dental implant and surrounding alveolar bone was investigated. Main aim was to develop a more realistic simulation methodology for the load transfer at the interfaces than the prefect bonding assumption at the interfaces which might end up the reduced level in the stress result. In the present study, characteristics of osseointegrated bone/implant interfaces was modelled with material nonlinearity assumption. Bones at the interface were given different stiffness properties as functions of stresses. Six different models, i.e. tens0, tens20, tens40, tens60, tens80, and tens100 of which the tensile moduli of the bones forming the bone/implant interfaces were specified from 0, 20, 40, 60, 80, and 100 percents, respectively, of the compressive modulus were analysed. Comparisons between each model were made to study the effect of the tensile load carrying abilities, i.e. the effectivity of load transfer, of interfacial bones on the stress distribution. Results of the present study showed significant differences in the bone stresses across the interfaces. The peak stresses, however, were virtually the same regardless of the difference in the effectivity of load transfer, indicating the conventional linear modelling scheme which assumes perfect bonding at the bone/implant interface can be used without causing significant errors in the stress levels.

Analysis of Bonding Interfaces between Cemented Carbide and Stainless Steel made via Hot Vacuum Brazing (고온 진공 브레이징을 이용한 초경합금과 스테인리스강의 접합 계면 특성)

  • Park, D.H.;Hyun, K.H.;Kwon, H.H.
    • Transactions of Materials Processing
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    • v.29 no.6
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    • pp.307-315
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    • 2020
  • The cemented carbide and stainless steel were bonded using a hot-vacuum brazing method to analyze the bonding interface. Since it is suitable for the hot vacuum brazing, nickel metal was used as a binder among the main components of the cemented carbide, and a new cemented carbide material was developed by adjusting the alloy composition. The paste, which is one of the important factors affecting the hot vacuum brazing bonding, was able to improve brazing adhesion by mixing solder as Ni powder and a binder as an organic compound at an appropriate ratio. Division of the stainless steel yielded a dense brazing result. This study elucidated the interfacial characteristics of wear-resistant parts by bonding stainless steel and cemented carbide via hot vacuum brazing.

The Influence of Surface Treatment and Opaque Application Methods on the Bond Strength of PFM Restorations (모래분사법과 불투명 도재의 도포방법이 도재용착주조관의 전단결합강도에 미치는 영향)

  • Kim, Sung-Min;Choi, Sung-Min;Chung, In-Sung
    • Journal of Technologic Dentistry
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    • v.33 no.4
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    • pp.339-347
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    • 2011
  • Purpose: This study was investigated the bonding strength of two kinds of Ni-Cr alloy with respect to the condition of surface treatment. Methods: The surface treatment was performed on the two kinds of Ni-Cr alloy (B alloy and R alloy) specimens, which were sandblasted with $50{\mu}m$, $110{\mu}m$, and $250{\mu}m$ aluminium oxide and were treated with opaque application (paste and wash opaque). The roughness on the surfaces of the specimens was observed. The metal-ceramic interfaces were analyzed with EPMA in order to ionic diffusion, and the shear test was performed. Results: The BA250 specimen, which has higher surface roughness, showed the highest bonding strength in B specimens. In R specimens, the bonding strength of RA110 specimen was the highest. Conclusion: B specimen formed a mechanical bond between metal-ceramic interfaces; however, in the case of R specimen, a chemical bond was formed between that interfaces. There was no significant statistical difference between the bonding strengths of two types of specimens (p>0.05).

Stress Analysis of Bonding Interface in the Dissimilar Friction Welded Joints (STS304와 Sl5C 이종마찰압접부의 접합계면 응력해석)

  • 오정국;차용순;성백섭;박창언;김하식;김충환
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.11 no.3
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    • pp.65-71
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    • 2002
  • Friction welding has may merits such as energy efficiency, simple processing, etc. but it is difficult to obtain good welding at the welded interfaces and heat affected zone. It is discovered that stress singularity exists at the interferes and heat affected zone. The computer program based on boundary element method is utilized in this study. A mathematical model is implemented based on results from several experiments performed at and around the welded interfaces and heat affected zone of disimilar metals under static and dynamic loadings. This stay is to investigate the characteristics of the deformation and fracture behavior around interfaces for friction welded materials under static tensile load. Also, the stress distribution at the tip of crack is analyzed by using BU based on Kelvin's solution of 2-dimensional binding zone. The results of BEM are identical with those in case of considering interfaces of both heat affected zone. Also, stress singularity at the tip of interfaces appears when the elastic modulus ratio is 1.07.

Bonding Strength of Conductive Inner-Electrode Layers in Piezoelectric Multilayer Ceramics

  • Wang, Yiping;Yang, Ying;Zheng, Bingjin;Chen, Jing;Yao, Jinyi;Sheng, Yun
    • Transactions on Electrical and Electronic Materials
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    • v.18 no.4
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    • pp.181-184
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    • 2017
  • Multilayer ceramics in which piezoelectric layers of $0.90Pb(Zr_{0.48}Ti_{0.52})O_3-0.05Pb(Mn_{1/3}Sb_{2/3})O_3-0.05Pb(Zn_{1/3}Nb_{2/3})O_3$ (0.90PZT-0.05PMS-0.05PZN) stack alternately with silver electrode layers were prepared by an advanced low-temperature co-fired ceramic (LTCC) method. The electrical properties and bonding strength of the multilayers were associated with the interface morphologies between the piezoelectric and silver-electrode layers. Usually, the inner silver electrodes are fabricated by sintering silver paste in multi-layer stacks. To improve the interface bonding strength, piezoelectric powders of 0.90PZT-0.05PMS-0.05PZN with an average particle size of $23{\mu}m$ were added to silver paste to form a gradient interface. SEM observation indicated clear interfaces in multilayer ceramics without powder addition. With the increase of piezoelectric powder addition in the silver paste, gradient interfaces were successfully obtained. The multilayer ceramics with gradient interfaces present greater bonding strength as well as excellent piezoelectric properties for 30~40 wt% of added powder. On the other hand, over addition greatly increased the resistance of the inner silver electrodes, leading to a piezoelectric behavior like that of bulk ceramics in multilayers.

A CONFOCAL MICROSCOPIC STUDY ON DENTINAL INFILTRATION OF ONE-BOTTLE ADHESIVE SYSTEMS AND SELF-ETCHING PRIMING SYSTEM BONDED TO CLASS V CAVITIES (제 5급 와동에서의 단일용기 상아질 접착제와 자가 산부식 접착제의 상아질에 대한 침투도 평가)

  • Kim, Hyung-Su;Park, Sung-Ho
    • Restorative Dentistry and Endodontics
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    • v.27 no.3
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    • pp.257-269
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    • 2002
  • Objective : The purpose of this study was to evaluate the resin infiltration into dentin of one-bottle adhesive systems and self-etching primer bonded to Class V cavities using confocal laser scanning microscope(CLSM). Material and Methods : Forty Class V cavities were prepared from freshly extracted caries-free Human teeth. These teeth were divided into two groups based on the presence of cervical abrasion: Group I, cervical abrasion : Group II, wedge-shaped cavity preparation. Resin-dentin interfaces were produced with two one-bottle dentin bonding systems-ONE COAT BOND(OCB; Coltene$^R$) and Syntac$^R$SPrint$^{TM}$(SS; VIVADENT)-, one self-etching priming system-CLEARFIL$^{TM}$ SE BOND (SB : KURARAY)- and one multi-step dentin bonding system-Scotchbond$^{TM}$Multi-Purpose (SBMP, 3M Dental Products)-as control according to manufacturers' instructions. Cavities were restored with Spectrum$^{R}$(Dentsply). Specimens were immersed in saline for 24 hours and sectioned longitudinally with a low-speed diamond disc. The resin-dentin interfaces were microscopically observed using CLSM. The quality of resin-infiltrated dentin layers were evaluated by five dentists using 0~4 scale. Results : Confocal laser scanning microscopal investigations using primer labeled with rhodamine B showed that the penetration of the primer occurred along the cavity margins. Statistical analysis using one-way ANOVA followed by Duncan's Multiple Range test revealed that the primer penetration of the group 2(wedge-shaped cavity preparation) was more effective than group 1(cervical abrasion) and that of the gingival interfaces was more effective than the occlusal interfaces. In the one-bottle dentin bonding systems, the resin penetration score of OCB was compatible to SBMP, but those of SS and self-etching priming system, SB were lower than SBMP.

Effect of Post Heat Treatment on Bonding Interfaces in Ti/STS409L/Ti Cold Rolled Clad Materials (Ti/STS409L/Ti 냉연 클래드재의 접합계면특성에 미치는 후열처리의 영향)

  • Bae, D.S.;Kim, W.J.;Eom, S.C.;Park, J.H.;Lee, S.P.;Kim, M.J.;Kang, C.Y.
    • Transactions of Materials Processing
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    • v.20 no.2
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    • pp.140-145
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    • 2011
  • The aim of the present study is to derive optimized post heat treatment temperatures to get a proper formability for Ti/STS409L/Ti clad materials. These clad materials were fabricated by cold rolling followed by a post heat treatment process for 10 minutes at temperatures ranging from $500^{\circ}C$ to $850^{\circ}C$. The microstructure of the interface was observed using a Scanning Electron Microscope(SEM) and an Energy Dispersive X-ray Analyser(EDX) in order to investigate the effects of post heat treatment on the bonding properties of the Ti/STS409L/Ti clad materials. Diffusion bonding was observed at the interfaces with a diffusion layer thickness increasing with the post heat treatment temperature. The diffusion layer was composed of a type of(${\varepsilon}+{\zeta}$) intermetallic compound containing additional elements, namely, Fe, Ti and Ni. The micro Knoop hardness of the Ti/STS409L interfaces was found to increase with heat treatment up to $800^{\circ}C$ and then decrease for temperatures rising up to $850^{\circ}C$. The tensile strength was shown to decrease for heat treatment temperature increasing to $750^{\circ}C$ and then increase rapidly for temperature rising up to $850^{\circ}C$. A post heat treatment temperature range of $700{\sim}750^{\circ}C$ was found to optimize the formability of Ti/STS409L/Ti clad materials.

Orthotropic sandwich plates with interlayer slip and under edgewise loads

  • Hussein, R.
    • Structural Engineering and Mechanics
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    • v.17 no.2
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    • pp.153-166
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    • 2004
  • An elasticity solution for sandwich plates assembled with non-rigid bonding and subjected to edgewise loads is presented. The solution satisfies the equilibrium equations of the face and core elements, the compatibility equations of stresses and strains at the interfaces, and the boundary conditions. To investigate the effects of bonding stiffnesses on the responses of sandwich plates, numerical evaluations are conducted. The results obtained have shown that the bonding stiffness, up to a certain level, has a strong effect on the plate mechanical response. Beyond this level, the usual assumption of perfect bonding used in classical theories is quite acceptable. An answer to what constitutes perfect bonding is found in terms of the ratio of the core stiffness to the bonding stiffness.