• Journal of the Korean institute of surface engineering
• /
• v.54 no.5
• /
• pp.207-212
• /
• 2021

The mechanical and electrical characteristics can be improved in 3D stacked IC technology which can accomplish the ultra-high integration by stacking more semiconductor chips within the limited package area through the Cu direct bonding method minimizing the performance degradation to the bonding surface to the inorganic compound or the oxide film etc. The surface was treated in a ultrasonic washer using a diamond abrasive to remove other component substances from the prepared cast plate substrate surface. FE-SEM was used to analyze the bonding characteristics of the bonded copper substrates, and the cross section of the bonded Cu conjugates at the sintering junction temperature of 100 ℃, 150 ℃, 200 ℃, 350 ℃ and the pressure of 2303 N/cm² and 3087 N/cm². At 2303 N/cm², the good bonding of copper substrate was confirmed at 350 ℃, and at the increased pressure of 3087 N/cm², the bonding condition of Cu was confirmed at low temperature junction temperature of 200 ℃. However, the recrystallization of Cu particles was observed due to increased pressure of 3087 N/cm² and diffusion of Cu atoms at high temperature of 350 ℃, which can lead to degradation in semiconductor manufacturing.

• Transactions of Materials Processing
• /
• v.31 no.4
• /
• pp.179-185
• /
• 2022

The influence of post-roll bonding heat treatment conditions such as temperature and time on the variation in the diffusion layer, generated at the bonding interface and the subsequent mechanical properties of the roll-bonded Ti grade 1/Al1050/Ti grade 1 sheets, was systematically investigated. The intermetallic compound (IMC) phase generated by post heat treatment conditions adopted in this study was obviously indexed as monolithic TiAl₃. Whereas the thickness of IMC layer generated by annealing at 500 ℃ was approximately 100 nm scale, it drastically increased above 1.5 ㎛ when annealed at 600 ℃. Uniaxial tensile and peel tests were then performed to compare mechanical properties. As a result, the bonding strength drastically increased above 7.9 N/mm by annealing at 600 ℃, which implies that proper annealing condition was a prerequisite, to improving interface bonding strength as well as global elongation properties for Ti/Al/Ti 3-ply sheet.

• Journal of Sensor Science and Technology
• /
• v.9 no.2
• /
• pp.134-140
• /
• 2000

Si wafer direct bonding(SDB) technology is very attractive for both Si-on-insulator(SOI) electronic devices and MEMS applications. This paper presents on pre-bonding according to HF pre-treatment conditions in Si wafer direct bonding. The characteristics of bonded sample were measured under different bonding conditions of HF concentration and applied pressure. The bonding strength was evaluated by tensile strength method. A bond characteristic on the interface was analyzed by using FT-IR, and surface roughness according to HF concentration was analyzed by AFM. Si-F bonds on Si surface after HF pre-treatment are replaced by Si-OH during a DI water rinse. Consequently, hydrophobic wafer was bonded by hydrogen bonding of Si-OH$\cdots$(HOH$\cdots$HOH$\cdots$HOH)$\cdots$OH-Si. The pre-bonding strength depends on the HF pre-treatment condition before pre-bonding. (Min : $2.4kgf/cm^2{\sim}$Max : $14.9kgf/cm^2$)

• Proceedings of the Korea Concrete Institute Conference
• /
• 2006.05a
• /
• pp.282-285
• /
• 2006

This study is to examine bond strength of beam reinforced with GFRP rebar under 4-point bending test by adopting BRITISH STANDARD. The variables were made to have bonding length of 5times$(5d_b)$, 10times$(10d_b)$ and 15times$(15d_b)$ of the nominal diameter of GFRP rebar and were done to analyze the relationship between the bonding strength and the slip. In the result of the test, pull-out failure was dominant in the $5d_b$ and $10d_b$ specimen, both patterns of the pull-out failure and concrete splitting failure appeared in the $10d_b$. On the other hand, the $15d_b$ specimen showed only concrete splitting failure at the end of bonding length. Therefore, it was prove that available bonding length of the GFRP rebar under bending condition on static test is over $15d_b$ then farther research such as fatigue bending test, development of bonding model, FEM parameter study should be performed.

• Laser Solutions
• /
• v.11 no.3
• /
• pp.10-15
• /
• 2008

This study is aimed to analyse the laser glass bonding process numerically. Due to the viscoelastic behaviour of glass, the extremely large deformation of the frit seal is resulted continuously over the transition temperature, so that the thermal boundary condition be changed in the entire calculation process. The commercial FEM algorithm is restrictively able to remesh the large geometrical boundary shape and to adapt the boundary conditions simultaneously. According to our manual adaptation of increasing the laser line intensity to 700 mW/mm, it is possible to estimate the thermal glass bonding process under the fracture stress in principle. But it should be studied further in the case of high laser line intensity.

• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 1997.03a
• /
• pp.140-143
• /
• 1997

The present study is concerned with the hydrostatic extrusion process of copper-clad aluminium bar to investigate the basic flow characteristics. Considering the bonding mechanism of bi-metal contact surface as cold pressure welding, the normal pressure and the contact surface expansion are selected as process parameters governing the bonding condition. The critical pressure required for the bonding at the interface is obtained by solving a "local extrusion" using a slip line meyhod. A viscoplastic finite element method is used to analyze the steady state extrusion process. The boundary profile of bi-metal rod is predicted by tracking a particle path adjacent to interface surface. The variations of contact surface area and the normal pressure along the interface profile are predicted and compared to those by experiments.

• Transactions of the Korean Society of Automotive Engineers
• /
• v.5 no.2
• /
• pp.87-93
• /
• 1997

The bonding strength evaluation of light weight materials for electrical vehicle applications has been performed through single lap joint tests in which the design parameters such as fillet, joint style, adherend, bonding overlap length,bonding thickness, and environmental condition(soaking time in $25^{\circ}C$ water) are considered. It is experimentally oberved that lap shear strength of joint increases for higher fillet height, longer overlap length, and thinner bonding layer thickness. Al-Al adherend combination shows much higher lap shear strength than AL-FRP and FRP-FRP adherend combinations. Riveting at adhesive bonded joint of AL-AL adherend combination makes lap shear strength decrease. Effect of soaking time on lap shear strength is negligible.

• Journal of the Korean Ceramic Society
• /
• v.36 no.8
• /
• pp.863-870
• /
• 1999

SOI(silicon on insulafor) was fabricated through the direct bonding using (100) Si wafer and 4$^{\circ}$off (100) Si wafer to investigate the stacking faults in silicon at the Si/SiO2 oxidized and bonded interface. The treatment time of wafer surface using MSC-1 solution was varied in order to observe the effect of cleaning on bonding characteristics. As the MSC-1 treating time increased surface hydrophilicity was saturated and surface microroughness increased. A comparison of surface hydrophilicity and microroughness with MSC-1 treating time indicates that optimum surface modified condition for time was immersed in MSC-1 for 2 min. The SOI structure directly bonded using (100) Si wafer and 4$^{\circ}$off (100) Si wafer at the room temperature were annealed at 110$0^{\circ}C$ for 30 min. Then the stacking faults at the bonding and oxidation interface were examined after the debonding. The results show that there were anomalies in the gettering of the stacking faults at the bonded region.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.11 no.12
• /
• pp.1079-1083
• /
• 1998

In this study, ultrasonic power of Aluminum wire bonder, bond time and bond force are investigated and valued in order to minimize failure of bonding pad lift. We also tried to control those 3 factors properly. We got the conclusion that if we turn down the ability of ultrasonic power or bond time, we can get a pad lift from a boundary between bond pad ad wire because pad metal and wire joining is unstable, but it is best condition when it ultrasonic power is 100∼130unit, bond time is 15∼20msec and bond force is 4∼6gf.

• Journal of Korean Tunnelling and Underground Space Association
• /
• v.11 no.1
• /
• pp.71-83
• /
• 2009

Shotcrete is an important primary support for tunnelling in rock. The quality control of shotcrete is a core issue in the safe construction and maintenance of tunnels. Although shotcrete may be applied well initially onto excavated rock surfaces, it is affected by blasting, rock deformation and shrinkage and can debond from the excavated surface, causing problems such as corrosion, buckling, fracturing and the creation of internal voids. This study suggests an effective non-destructive evaluation method of the tunnel shotcrete bonding state applied onto hard rocks using the impact-echo (IE) method and ground penetration radar (GPR). To verify previous numerical simulation results, experimental study carried out. Generally, the bonding state of shotcrete can be classified into void, debonded, and fully bonded. In the laboratory, three different bonding conditions were modeled. The signals obtained from the experimental IE tests were analyzed at the time domain, frequency domain, and time-frequency domain (i.e., the Short- Time Fourier transform). For all cases in the analyses, the experimental test results were in good agreement with the previous numerical simulation results, verifying this approach. Both the numerical and experimental results suggest that the bonding state of shotcrete can be evaluated through changes in the resonance frequency and geometric damping ratio in a frequency domain analysis, and through changes in the contour shape and correlation coefficient in a time-frequency analysis: as the bonding state worsens in hard rock condition, the autospectral density increases, the geometric damping ratio decreases, and the contour shape in the time-frequency domain has a long tail parallel to the time axis. The correlation coefficient can be effectively applied for a quantitative evaluation of bonding state of tunnel shotcrete. Finally, the bonding state of shotcrete can be successfully evaluated based on the process suggested in this study.