• 대한기계학회논문집A
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• 제26권5호
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• pp.960-968
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• 2002

In this research, the effects of fiber stacking sequence on damage behaviors of FML(Fiber Metal Laminates) subject to indentation loading. SOP (Singly Oriented Ply) FML and angle ply FML were fabricated to study fiber orientation effects and angle ply effects. FML were fabricated by using 1050 aluminum laminate and carbon/epoxy prepreg. To increase adhesive bonding strength, Al laminate was etched using FPL methods. The static indentation test were conducted by using UTM under the 2side clamped conditions. During the tests, load and displacement curve and crack initiation and propagation behaviors were investigated. As fiber orientation angle increases, the crack initiation load of SOP FML increases because the stiffness induced by fiber orientation is increased. The penetration load of SOP FML is influenced by the deformation tendency and boundary conditions. However, the macro-crack of angle ply FML was initiated by fiber breakage of lower ply because angle plies in Angle ply FML prevents the crack growth and consolidation. The Angle ply FML has a critical cross-angle which prevent crack growth and consolidation. Damage behavior of Angle ply FML is changed around the critical cross-angle.

• 마이크로전자및패키징학회지
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• 제20권4호
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• pp.7-11
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• 2013

As thermosonic ball bonding is developed for more and more advanced applications in the electronic packaging industry, the control of process stresses induced on the integrated circuits becomes more important. If Cu bonding wire is used instead of Au wire, larger ultrasonic levels are common during bonding. For advanced microchips the use of Cu based wire is risky because the ultrasonic stresses can cause chip damage. This risk needs to be managed by e.g. the use of ultrasound during the impact stage of the ball on the pad ("pre-bleed") as it can reduce the strain hardening effect, which leads to a softer deformed ball that can be bonded with less ultrasound. To find the best profiles of ultrasound during impact, a numerical model is reported for ultrasonic bonding with capillary dynamics combined with a geometrical model describing ball deformation based on volume conservation and stress balance. This leads to an efficient procedure of ball bond modelling bypassing plasticity and contact pairs. The ultrasonic force and average stress at the bond zone are extracted from the numerical experiments for a $50{\mu}m$ diameter free air ball deformed by a capillary with a hole diameter of $35{\mu}m$ at the tip, a chamfer diameter of $51{\mu}m$, a chamfer angle of $90^{\circ}$, and a face angle of $1^{\circ}$. An upper limit of the ultrasonic amplitude during impact is derived below which the ultrasonic shear stress at the interface is not higher than 120 MPa, which can be recommended for low stress bonding.

• 한국재료학회지
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• 제8권10호
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• pp.890-897
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• 1998

n-InP(001)기판과 PECVD법으로 ${Si}_3N_4$(200nm)막이 성장된 InP 기판사이의 direct wafer bonding을 분석하였다. 두 기판을 접촉시켰을 때 이들 사이의 결합력에 크게 영향을 주는 표면 상태를 접촉각 측정과 AFM을 통해서 분석하였다. InP 기판은 $50{\%}$ 불산용액으로 에칭하였을 때 접촉각이 $5^{\circ}$, RMS roughness는 $1.54{\AA}$이었다. ${Si}_3N_4$는 암모니아수 용액으로 에칭하였을 때 RMS roughness가 $3.11{\AA}$이었다. Inp 기판과 ${Si}_3N_4$/InP를 각각 $50{\%}$ 불산 용액과 암모니아수 용액에 에칭한 후 접촉시켰을 때 상당한 크기의 초기 겹합력을 관찰할 수 있었다. 기계적으로 결합된 시편을 $580^{\circ}C$-$680^{\circ}C$, 1시간동안 수소 분위기와 질소분우기에서 열처리하였다. SAT(Scanning Acoustic Tomography)측정으로 두 기판 사이의 결합여부를 확인하였다. shear force로 측정한 InP 기판과 ${Si}_3N_4$/InP사이의 결합력은 ${Si}_3N_4$/InP 계면의 결합력만큼 증가되었다. TEM과 AES를 이용해서 di-rect water bonding 계면과 PECVD계면을 분석하였다.

• 펄프종이기술
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• 제48권1호
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• pp.61-66
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• 2016

In order to improve the bonding efficiency of starch adhesives and water resistance of corrugated board, mixing ratio of additives dosage was changed and its effects were analyzed. When the additives dosage was increased, bonding strength, vertical compression strength, bursting strength and water resistance were increased, because of hydroxyl groups or acetyl groups in starch adhesives and cellulose fibers of corrugated board were cross-linked by additives. When 1.0% glyoxal dosage was added, flat crush strength and vertical compression strength were increased. With 1.5% glyoxal, bonding strength and bursting strength were increased. However, 2.0% glyoxal dosage was added, most of strength except bursting strength were decreased. Thus, when the appropriate amount of additives are added during corrugated board production process, increased bonding efficiency of starch adhesives and higher water resistance of corrugated board can be achieved.

• ETRI Journal
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• 제28권5호
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• pp.648-651
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• 2006

In this letter we present a right-angle-bent coplanar waveguide (CPW) which we developed for the application of the driver amplifier-integrated (DAI) 40 Gbps traveling wave electroabsorption modulated laser module. The developed CPW realized parallel progression of the radio frequency (RF) and light using a dielectric overlay structure and wedge bonding on the bending section. The measured $S_{11}$ and $S_{21}$ of the developed CPW were kept below-10 dB up to 35 GHz and -3 dB up to 43 GHz, respectively. These measured results of the CPW were in good agreement with the simulation results and demonstrated the applicability of the CPW to the 40 Gbps communication module.

• 한국정밀공학회지
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• 제24권12호
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• pp.143-148
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• 2007

Polyethylene is a typical hydrophobic material and it is difficult to bond the polyethylene material with metal material. Thus, it is important to modify the surface of polyethylene material to improve the bonding strength between the polyethylene and the metal materials. In this study, the surface modification of polyethylene material was investigated to improve the interfacial strength between the polyethylene and the steel materials. Polyethylene material was surface-modified in a plasma cleaner using an oxygen gas. Two cases of composites (surface-modified pelyethylene/steel composite and regular (as-received) pelyethylene/steel composite) were fabricated using a secondary bonding method. Shear and bending tests have been performed using the two cases of composites. The results showed that the contact angle did not change much as the modification time increased. However, the contact angle decreased from ${\sim}76^{\circ}\; to\;{\sim}41^{\circ}$ with the modification. The results also showed that the shear strength and the bending strength were improved about 3030 % and 7 %, respectively when the polyethylene was plasma-modified using an oxygen gas.

• Bulletin of the Korean Chemical Society
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• 제24권10호
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• pp.1485-1489
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• 2003

The gelation for di-(2-ethylhexyl) phthalate (DEHP)-plasticized poly(vinyl chloride) was studied by measuring time-resolved small-angle X-ray scattering (SAXS) and a flow of the solutions in test tube. It was found that for the gelation there were three regimes. At Regime I, the solution rapidly changed to a gel, and the SAXS intensity showed a peak and the peak intensity increased, keeping the peak angle constant. Applying the SAXS intensity to the kinetic analysis of the liquid-liquid phase separation, it was revealed that the spinodal decomposition proceeded to develop a periodic length of 29.9 nanometer in size, a hydrogen-bonding-type association in polymer rich phase followed, and then it induced fast gelation rate. At Regime II, the gelation slowly occurred and the SAXS intensity was not observed, suggesting that a homogeneous gel network was formed by a hydrogen-bonding. At regime III, the solution was a homogeneous sol.

• Restorative Dentistry and Endodontics
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• 제32권1호
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• pp.9-18
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• 2007

이 연구의 목적은 와동벽에서 다른 위치에서의 상아질 접착제의 두께를 평가하고, 이런 다양한 접착제의 두께와 미세 인장 강도 사이의 관계를 평가하기 위한 것이다. 여섯 개의 인간 대구치에 모든 상아질 면이 노출되도록 I급 와동을 형성하였다 3개의 치아는 filled adhesive ($Clearfil^{TM}$ SE bond)를 와동 내에 도포하였고, 다른 3개의 치아는 unfilled adhesives ($Scotchbond^{TM}$ Multi Purpose)를 도포하였다. 형광 현미경을 이용하여 접착층의 형태와 두께를 관찰하였다. 접착제의 두께는 수직 와동벽을 따라 와동 변연, 와동벽 1/2, 와동 내각의 세 지점에서 측정되었다. $Scotchbond^{TM}$ Multi Purpose와 $Clearfil^{TM}$ SE bond가 와동 변연과 와동벽 1/2, 와동 내각에서의 접착제의 두께를 재현하여 미세 인장 결합 강도를 측정하였다. 이 실험의 결과에서 두 가지 상아질 접착제 모두에서 와동 내각에서의 접착제의 두께가 와동 변연과 와동벽 1/2위치에서의 두께보다 두꺼웠으며, 와동 내각의 두꺼운 접착제의 미세 인장 결합 강도는 와동 변연과 와동벽 1/2에서의 얇은 접착제 두께의 미세 인장 결합 강도보다 유의성 있게 높게 나타났다.

• 콘크리트학회논문집
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• 제13권3호
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• pp.221-227
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• 2001

강판으로 철근콘크리트 보를 휨보강하면 보의 강성과 강도는 현저하게 증가하나 부착면에서의 조기파괴로 인하여 충분한 연성을 발휘하지 못하는 경우가 자주 발생한다. 본 연구에서는 에폭시와 콘크리트 계면에서의 부착파괴 메카니즘을 규명하기 위하여 Mohr-Coulomb 규준을 채택하였으며, 에폭시-콘크리트 계면의 부착특성을 결정하기 위하여 사전단 부착실험, 직접전단 부착실험 및 휨보강 부재실험을 수행하였다. 실험과 수치해석을 통하여 에폭시-콘크리트 계면의 내부마찰각이 45$^{\circ}$ 일 때 점착력은 50 kgf/$\textrm{cm}^2$~70 kgf/$\textrm{cm}^2$을 얻었으며, 이를 강판으로 보강된 RC보의 구조계산에 적용하여 파괴하중을 예측함으로써 보강보의 조기파괴를 효과적으로 방지할 수 있을 것으로 판단된다.

• 한국콘크리트학회:학술대회논문집
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• 한국콘크리트학회 2004년도 춘계 학술발표회 제16권1호
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• pp.80-83
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• 2004

The FRP plate or sheet bonding technology was widely used for strengthening deficient RC structures. The strengthened structure using FRP bonding scheme, however, experience the complex interfacial behaviour which is difficult to predict. Therefore, the unbonded scheme using some anchorage device can be is an alternative for more reliable design. In this study, wedge-type anchor for FRP plate is developed for the unbonded flexural strengthening scheme. Some parameter study using 2D finite element method is performed. The analysis parameters are taken as wedge-guide friction coefficients, wedge- FRP ,.friction coefficient and wedge inclination angle. Based on the parameter study, more efficient anchors are designed and tested. The test result show that the developed anchor assure about $80\%$ FRP strength, which is higher performance than typical bonding scheme. Last, 3D finite element analysis is performed.