• The Transactions of The Korean Institute of Electrical Engineers
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• v.57 no.4
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• pp.653-659
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• 2008

This paper describes the design of high power transistor packages using high power chip transistor dies, chip capacitors and a new wire bonding technique. Input impedance variation and output power performances according to wire inductance and resistance for internal matching are also discussed. A multi crossing type(MCT) wire bonding technique is proposed to replace the conventional stepping stone type(SST) wire bonding technique, and eventually to improve the output power performances of high power transistor packages. Using the proposed MCT wire bonding technique, it is possible to design high power transistor packages with highly improved output power compared to SST even the package size is kept to be the same.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.09a
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• pp.253-257
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• 2003

The low temperature flip chip technique is applied to the package of the temperature-sensitive devices for LCD systems and image sensors since the high temperature process degrades the polymer materials in their devices. We will introduce the various low temperature flip chip bonding techniques; a conventional flip chip technique using eutectic Bi-Sn (mp: $138^{\circ}C$) or eutectic In-Ag (mp: $141^{\circ}C$) solders, a direct bump-to-bump bonding technique using solder bumps, and a low temperature bonding technique using low temperature solder pads.

• Journal of Institute of Control, Robotics and Systems
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• v.14 no.6
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• pp.543-547
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• 2008

In the paper, we develop the ultrasonic bonding technique for LCD driver chips having small size and high pin-density. In general, the mounting technology for LCD driver ICs is a thermo-compression method utilizing the ACF (An-isotropic Conductive Film). The major drawback of the conventional approach is the long process time. It will be shown that the conventional ACF method based on thermo-compression can be remarkably enhanced by employing the ultrasonic bonding technique in terms of bonding time. The proposed approach is to apply the ultrasonic energy together with the thermo-compression methodology for the ACF bonding process. To this end, we design a bonding head that enables pre-heating, pressure and ultrasonic excitation. Through the bonding experiments mainly with LCD driver ICs, we present the procedures to select the best combination of process parameters with analysis. We investigate the effects of bonding pressure, bonding time, pre-heating temperature before bonding, and the power level of ultrasonic energy. The addition of ultrasonic excitation to the thermo-compression method reduces the pre-heating temperature and the bonding process time while keeping the quality bonding between the LCD pad and the driver IC. The proposed concept will be verified and demonstrated with experimental results.

• Steel and Composite Structures
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• v.19 no.3
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• pp.735-757
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• 2015

Composite bonding steel plate (CBSP) is a newly developed type of structure strengthened technique applicable to the existing RC beam. This composite structure is applicable to strengthening the existing beam bearing high load. The strengthened beam consists of two layers of epoxy bonding prestressed steel plates and the RC beam sandwiched in between. The bonding enclosed and prestressed U-shaped steel jackets are applied at the beam sides. This technique is adopted in case of structures with high longitudinal reinforcing bar ratio and impracticable unloading. The prestress can be generated on the strengthening steel plates and jackets by using the CBSP technique before loading. The test results of full-scale CBSP strengthened beams show that the strength and stiffness are enhanced without reduction of their ductility. It is demonstrated that the strain hysteresis effect can be effectively overcome after prestressing on the steel plates by using such technique. The applied plates and jackets can jointly behave together with the existing beam under the action of epoxy bonding and the mechanical anchorage of the steel jackets. The simplified formulas are proposed to calculate the prestress and the ultimate capacities of strengthened beams. The accuracy of formulas was verified with the experimental results.

• The korean journal of orthodontics
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• v.19 no.2
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• pp.155-163
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• 1989

Indirect bonding is done by placing the brackets on a model in the laboratory and using a template or tray to transfer the laboratory positioning to the teeth. The advantages of this technique are 1. decreased chair time 2. less patient discomfort 3. accuracy of a attachment placement 4. good adaptation of attachment to tooth contour 5. occlusal relationship of brackets and opposing teeth can be checked The disadvantages of the technique are 1. complex laboratory procedure 2. sometimes difficult on very short clinical crowns 3. teeth with crowns, large buccal restoration will not bond 4. may not be fitted close, if poor adaptation 5. likely to be disturbed setting Several indirect bonding techniques have proved reliable in clinical practice. However, they differ in the way the brackets are attached temporarily to the model, the type of transfer tray or other mechanism used, the adhesive or sealant employed, whether segmented or full bonding used, and the way the transfer is removed so as not to exert excessive force on a still maturing bond.

• Nuclear Engineering and Technology
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• v.54 no.4
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• pp.1221-1229
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• 2022

In this work, the guided wave de-bonding area-detecting technique was studied for application to containment liner plates in nuclear power plant areas. To apply this technique, an appropriate Lamb wave mode, symmetric and longitudinal dominance, was verified by the frequency shifting technique. The S0 2.7 MHz mm Lamb wave mode was chosen to realize quantitative experimental results and their visualization. Results of the bulk wave, longitudinal wave mode, and comparison experiments indicate that the wave mode was able to distinguish between the de-bonded and bonded areas. Similar to the bulk wave cases, the bonded region could be distinguished from the de-bonded region using the Lamb wave approach. The Lamb wave technique results showed significant correlation to the de-bonding area. As the de-bonding area increased, the Lamb wave energy attenuation effect decreased, which was a prominent factor in the realization of quantitative tomographic visualization. The feasibility of tomographic visualization was studied via the application of Lamb waves. The reconstruction algorithm for the probabilistic inspection of damage (RAPID) technique was applied to the containment liner plate to verify and visualize the de-bonding condition. The results obtained using the tomography image indicated that the Lamb wave-based RAPID algorithm was capable of delineating debonding areas.

• The Journal of the Korean dental association
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• v.37 no.7 s.362
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• pp.530-535
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• 1999

Detailed finishing of the occlusion is a clinical skill that has become difficult with the development of fixed appliances. Accuracy of bracket placement definitely improves with indirect technique, Several methods for the placement of orthodontic brackets on dental casts are currently used in the indirect bonding technique. These include attachment by means of bonding resins, adhesive tapes or sticky wax. This article presents the indirect procedures of our clinic, which use paste-paste chemically cured composites. Detailed laboratory and clinical procedure for dual tray method and other application of indirect bonding will be presented.

• Earthquakes and Structures
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• v.5 no.4
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• pp.477-497
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• 2013

This paper reports extensive experimental study done to compare workability and bond strength of five different types of polymer-based bonding agents for reinforcing bars in pinning retrofit. In pinning retrofit, steel pins of 6 to 10 mm diameters are inserted into holes drilled diagonally from mortar joints. This technique is superior to other techniques especially in retrofitting historic masonry constructions because it does not change the appearance of constructions. With an ordinary cement paste as bonding agent, it is very difficult to insert reinforcing bars at larger open times due to poor workability and very thin clearance available. Here, open time represents the time interval between the injection of bonding agent and the insertion of reinforcing bars. Use of polymer-cement paste (PCP), as bonding agent, is proposed in this study, with investigation on workability and bond strengths of various PCPs in brick masonry, at open times up to 10 minutes, which is unavoidable in practice. Corresponding nonlinear finite element models are developed to simulate the experimental observations. From the experimental and analytical study, the Styrene-Butadiene Rubber polymer-cement paste (SBR-PCP) with prior pretreatments of drilled holes showed strong bond with minimum strength variation at larger open times.

• International Journal of Advanced Culture Technology
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• v.8 no.2
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• pp.246-251
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• 2020

Dimethyl Ether(DME) engine use a highly efficient alternative fuel having a great quantity of oxygen and has a advantage no polluting PM gas. The existing DME fuel cam material is a highly expensive carbide alloy, and it is difficult to take a price advantage. Therefore the study of replacing body area with inexpensive steel material excluding piston shoe and contact area which demands high characteristics is needed. The development of WC-Ni base carbide alloy optimal bonding composition technique was accomplished in this study. To check out the influence of bonding temperature and time, bonding characteristics of sintering temperature was experimented. The hardness of specimen and bonding rate were measured using ultrasound equipment. The bonding state of each condition was excellent, and the thickness of mid-layer, temperature and maintaining time were measured. The mid-layer thickness according to bonding temperature and maintaining time were observed with optical microscope. We analyzed the micro-structural analysis, formation of bonding specimen, wafer fabrication and fuel cam abrasion test. Throughout this study, we confirmed that the fuel cam for DME engine which demands high durability against velocity and pressure is excellent.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08a
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• pp.733-736
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• 2007

We have proposed novel bonding technique of substrates for developing the flexible LCD with high quality. The gel type mixture of agarose and UV curable epoxy developed to obtain tight bonding ability and enhanced electro-optical characteristic simultaneously. This technique can be used to roll-to-roll process for fabricating the flexible LCDs.