• International Journal of Automotive Technology
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• 제6권6호
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• pp.657-663
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• 2005

Recently, weight reduction of vehicles has been of great interest, and consequently the use of composite materials in the automotive industry is increasing every year. Composite sandwich panels which consist of two skins and core materials are replacing steels in automotive floor and door. The substitution of one material for another is accompanied by change of joining method, so that adhesive bonding has been popularly used for joining method of composite materials. In the case of adhesive bonding of composite materials, there could be loss in the joint strength by delamination of two faceplates or cracking on faceplate. Thus, it is necessary to prevent loss in the joint strength by designing the joint geometry. In the present paper, adhesive bonding of aluminum sandwich sheet was tried. For understanding joint behavior, studies on stresses in the single lap joint were reviewed and failure modes of composite material were analyzed. Strength tests on the single lap joint consisting of aluminum sandwich sheet and steel were performed and variation of the joint strength with the joint configuration was shown. Based on these results, design guide of adhesive bonding in aluminum sandwich sheet was suggested.

• 한국에너지공학회:학술대회논문집
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• 한국에너지공학회 1996년도 춘계학술발표회 초록집
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• pp.73-87
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• 1996

The outer-most electrons of metal atoms and the remining valence electrons of any molecular atoms make three dimensional crystallizing $\pi$-bondings. The electrons on the $\pi$-bonding orbital rotate clockwise or counter-clockwise and they then make electro-magnetic waves between atoms on the orbital because electron move between plus charged ions. The three dimensional crystallizing $\pi$-bonding orbitals are quantum-mechanically modeled by a cyclic Kronig-Penny Model and energy band structures are analyzed with their potential barrier thickness. The waves generated between plus charged ions are the particular $\pi$-far infrared rays, which have dual properties between material and electro-magnetic waves and can be measured not by modern electro-magnetic tester but biosensor such as finger's force tester. Because the $\pi$-rays can be modulated with electro-magnetic waves it can be applied for harmful electro-magnetic wave killers. Because the $\pi$-rays make new three dimensional crystallizing $\pi$-bonding orbitals in the material the food and drink can be transformed into a helpful physical constitutional property for human health. Distinction between crystalline and amorphous metals is possible because very strong crystalline $\pi$-bonding orbitals can not easily be transformed into another. The $\pi$-rays can also be applied for biofunctional diagnostics and therapy. Gravitational field is one of the electro-magnetic fields. And also magnetic field and gravitational force field make charge's movement. ($\times$ = q, : magnetic field, : force field, q: plus charge, : velocity field)

• 한국전기전자재료학회논문지
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• 제21권4호
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• pp.354-361
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• 2008

The dielectric characteristics of low-k interlayer dielectric materials was fabricated by plasma enhanced chemical vapor deposition (PECVD). BTMSM precursor was evaporated and introduced with the flow rates from 16 sccm to 25 sccm by 1sccm step in the constant flow rate of 60 sccm $O_2$ in process chamber. Manufactured samples are analyzed components by measuring FT/IR absorption lines. Decomposition each Microscopic structures through two-dimensional correlation analysis about mechanisms for the formation of SiOCH in $SiOCH_3$, Si-O-Si and Si-$CH_3$ bonding group and analyzed correlation between the micro-structure of each group. It is a tendency that seems to be growing of Si-O-Ci(C) bonding group and narrowing of Si-O-$CH_3$ bonding group relative to the increasing flow-rate BTMSM. The order of changing sensitivity about changes of flow-rate in Si-O-Si(C) bonding group is cross link mode$(1050cm^{-1})$ $\rightarrow$ open link mode$(1100cm^{-1})\rightarrow$ cage link mode $(1140cm^{-1})$.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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• pp.374-375
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• 2006

This paper describes anodic bonding characteristics of MCA to Si-wafer using evaporated Pyrex #7740 glass thin-films for MEMS applications. Pyrex #7740 glass thin-films with the same properties were deposited on MCA under optimum RF sputter conditions (Ar 100 %, input power $1\;W/cm^2$). After annealing at $450^{\circ}C$ for 1 hr, the anodic bonding of MCA to Si-wafer was successfully performed at 600 V, $400^{\circ}C$ in $110^{-6}$ Torr vacuum condition. Then, the MCA/Si bonded interface and fabricated Si diaphragm deflection characteristics were analyzed through the actuation and simulation test. It is possible to control with accurate deflection of Si diaphragm according to its geometries and its maximum non-linearity being 0.05-0.08 %FS. Moreover, any damages or separation of MCNSi bonded interfaces did not occur during actuation test. Therefore, it is expected that anodic bonding technology of MCNSi-wafers could be usefully applied for the fabrication process of high-performance piezoelectric MEMS devices.

• Journal of Welding and Joining
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• 제13권4호
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• pp.147-154
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• 1995

In order to study the bonding mechanism of Ni/B/Ni transient liquid phase bonding system, width of liquid layers were calculated, where in this system melting point of insert material(B) is higher than bonding temperature and melting point of base metal(Ni). Caclulated values were compared with experimental ones which were measured by bonding Ni/B/Ni system at 1433-1474K under vacuum atmosphere. As results, the width of initial liquid layer of Ni/B/Ni system was calculated as $W_{IL}$ = $W_{o}$[1 + {2.100..rho.$_{S/}$ ( $X_{3}$ + $X_{4}$)..rho.$_{Ni}$ }-.rho.$_{S/}$.rho. Ni/], and it was nearly same with experimental values. Maximum width of liquid layer, width of liquid layer during isothermal solidification and isothermal solidification time were calculated also.o.o.o.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
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• pp.769-775
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• 2002

The results gained as part of the study on weldability of compositions from steels, aluminium, titanium alloys in various combinations including similar and dissimilar metal bonding variants with reference to solution of specific practical problems are presented in this work. It has been shown that in the case of HIP/DB carried out with direct interaction of bonding surfaces of the most dissimilar material combinations under study, formation of high-quality joints is not assured due to various reasons. That is why development of special bonding techniques was required. The bonding techniques developed and used for HIP/DB of dissimilar steels, "Steel-bronze", "Titanium-niobium"; "Titanium-steel" and other compositions under study ensured vacuum-tight microvoid-free joints strength of a which was equal to the milder parent metal, including those obtained at reduced welding pressures. Examples of new products manufactured by HIP/DB using the technologies developed are presented.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1998년도 춘계학술대회 논문집
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• pp.497-502
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• 1998

To understand the effect of surface roughness on silicon wafer bonding, a continuum mechanical model is presented. This model is based on Obreimoff's experiment and the contact theory of rough surfaces. The surface energy of silicon was calculated to be much reduced than the theoretical value. Problems are discussed concerning surface film effects and the assumption of constant asperity radius and statistical distribution function.

• 대한기계학회논문집A
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• 제25권1호
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• pp.11-15
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• 2001

We present the design and strength evaluation of an anodically bonded pressurized cavity array, based on the energy release rate measured from the anodically bonded plates of two dissimilar materials. From a theoretical analysis, a simple fracture mechanics model of the pressurized cavity array has been developed. The energy release rate (ERR) of the bonded cavity with an infinite bonding length has been derived in terms of cavity pressure, cavity size, bonding length, plate size and material properties. The ERR with a finite bonding length has been evaluated from the finite element analysis performed for varying cavity and plate sizes. It is found that, for an inter-cavity bonding length greater than the half of the cavity length, the bonding strength of cavity array approaches to that of the infinite plate. For a shorter bonding length, however, the bonding strength of the cavity array is monotonically decreased with the ratio of the bonding length to the cavity length. The critical ERR of 6.21J/㎡ has been measured from anodically bonded silicon-glass plates. A set of critical pressure curves has been generated for varying cavity array sizes, and a design method of the pressurized cavity array has been developed for the failure-free wafer-level packaging of MEMS devices.

• 소성∙가공
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• 제28권1호
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• pp.15-20
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• 2019

The superplastic forming/diffusion bonding process has been developed to fabricate a core frame structure with joint nodes out of tubes, for the development of a titanium high performance bicycle. The hydroforming process has been applied for bulging of a tube in the superplastic condition before, and during the diffusion bonding process. In this experiment, a commercial Ti-3Al-2.5V tube was selected as raw material for the study. The forming experiment has been performed using a servo-hydraulic press with a capacity of 200 ton. Next, nitrogen gas was used to acquire necessary pressure for the bulging and bonding of the tubes to fabricate the joint nodes. The pertinent processing temperature was $870^{\circ}C$ for the superplastic hydroforming/diffusion bonding (SHF/DB) process, using the Ti-3Al-2.5V tube. The bonding quality and the progress of bulging and diffusion bonding have been observed by the investigation of the joining interfaces at the cross section of the joint structure. The control of the nitrogen pressure throughout the SHF/DB process, was an important factor to avoid any significant defects in the joint structure. The whole progress stage of the diffusion bonding could be observed at a joint interface. A core structure with 5 joint nodes to manufacture a titanium bicycle could be obtained in a SHF/DB process.

• 한국철도학회논문집
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• 제12권5호
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• pp.641-648
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• 2009

최근 철도차량의 속도가 증가함에 따라 철도시설물에도 철근콘크리트 구조물이 많이 적용되고 있는 실정이다. 하지만 이러한 콘크리트 구조물은 공용년수의 증가에 따라 필연적으로 구조적인 보강이 요구된다. 강판보강법 및 섬유복합체(FRP)를 활용한 보강법 등이 가장 일반적으로 적용되는 실정이지만 각 공법마다 나름대로의 단점 역시 존재 한다. 최근 화재나 기타 환경적인 공격에 대하여 강한 내구성을 가진 재료의 개발이 요구되고 있으며 이에 따른 현무암으로부터 추출한 Basalt 섬유를 활용한 섬유보강재가 많은 관심을 받고 있다. 이에 본 연구에서는 Basalt 섬유쉬트를 보강재로 사용할 경우 중요한 특성인 콘크리트와의 부착특성에 관하여 연구를 수행하였다. 실험변수는 보강폭, 길이, 보강겹수를 포함한다. 실험결과, 파괴형태는 계면파괴, 섬유파단, 그리고 rip-off의 형태가 관측되었으며 보강길이보다는 보강폭이 보강강도에 더 많은 영향을 미치는 것으로 판단되었다. 또한 보강길이가 전부 유효하게 작용하지는 않았으며 이에 유효보강길이를 산정하고 이에 따른 부착강도를 산정하였다. 이를 다른 종류의 FRP재료를 활용한 경우에 유효 보강길이와 비교하여 Basalt 섬유쉬트의 부착특성을 분석하였다.