• Proceedings of the Materials Research Society of Korea Conference
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• 1997.10a
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• pp.25-25
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• 1997

• Restorative Dentistry and Endodontics
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• v.47 no.2
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• pp.21.1-21.11
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• 2022

Objectives: This study aimed to investigate the bonding effects of cleaning protocols on dentin impregnated with endodontic sealer residues using ethanol (E) or xylol (X). The effects of dentin acid etching immediately (I) or 7 days (P) after cleaning were also evaluated. For bonding to dentin, universal adhesive (Scotchbond Universal; 3M ESPE) was used. The persistence of sealer residues, hybrid layer formation and microshear bond strength were the performed analysis. Materials and Methods: One hundred and twenty bovine dentin specimens were allocated into 4 groups (n = 10): G1 (E+I); G2 (X+I); G3 (E+P); and G4 (X+P). The persistence of sealer residues was evaluated by SEM. Confocal laser scanning microscopy images were taken to measure the formed hybrid layer using the Image J program. For microshear bond strength, 4 resin composite cylinders were placed over the dentin after the cleaning protocols. ANOVA followed by Tukey test and Kruskal-Wallis followed by Dunn test were used for parametric and non-parametric data, respectively (α = 5%). Results: G2 and G4 groups showed a lower persistence of residues (p < 0.05) and thicker hybrid layer than the other groups (p < 0.05). No bond strength differences among all groups were observed (p > 0.05). Conclusions: Dentin cleaning using xylol, regardless of the time-point of acid etching, provided lower persistence of residues over the surface and thicker hybrid layer. However, the bond strength of the universal adhesive system in etch-and-rinse strategy was not influenced by the cleaning protocols or time-point of acid etching.

• International Journal of Highway Engineering
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• v.7 no.4 s.26
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• pp.9-20
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• 2005

This study was carried out to select most efficient bonding methods of geogrid at the interface of old concrete pavement before placing asphalt overlay layer for reflection cracking retardation. Three bonding methods, a RSC-4 emulsified asphalt, a compound and an unsaturated polyester resin (UPR) were compared in this study. Three types of asphalt mixture (AC 60-80, RLDPE 8%, PG 76-22) and a dense-graded aggregate were used for overlay asphalt pavement. A reinforcing material which consists of a woven fabric underneath a glass fiber grid was used. An expedite test method which is for simulating mixed mode (mode I and II) fracture test was performed using a wheel tracker in laboratory. Cracking development by load repetition was measured as fatigue life (number of load cycle) and expansion of specimen body were measured for each test specimen. The results showed that UPR was the best and RSC-4 the next. But considering field applicability, RSC-4 was considered as an appropriate choice for bonding reinforcing material.

• Journal of Sensor Science and Technology
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• v.12 no.6
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• pp.265-272
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• 2003

This paper describes anodic bonding characteristics of MLCA (Multi Layer Ceramic Actuator) to Si-wafer using evaporated Pyrex #7740 glass thin-films for MEMS applications. Pyrex #7740 glass thin-films with same properties were deposited on MLCA under optimum RF magneto conditions(Ar 100%, input power $1\;W/cm^2$). After annealing in $450^{\circ}C$ for 1 hr, the anodic bonding of MLCA and Si-wafer was successfully performed at 600 V, $400^{\circ}C$ in - 760 mmHg. Then, the MLCA/Si bonded interface and fabricated Si diaphragm deflection characteristics were analyzed through the actuation test. It is possible to control with accurate deflection of Si diaphragm according to its geometries and its maximum non-linearity is 0.05-0.08 %FS. Moreover, any damages or separation of MLCA/Si bonded interfaces do not occur during actuation test. Therefore, it is expected that anodic bonding technology of MLCA/Si wafers could be usefully applied for the fabrication process of high-performance piezoelectric MEMS devices.

• Journal of Technologic Dentistry
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• v.23 no.1
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• pp.31-43
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• 2001

This study was performed to observe the micro-structure change of surface, behavior of oxide change of element, the component transformation of the alloy and the bonding strength between the porcelain interface in order to investigate effects of indium, tin on interfacial properties of porcelain fused to low gold alloy. Hardness of castings was measured with a micro-Vicker's hardness tester. The compositional change of the surface of heat-treated specimen was analyzed with an EDS and an EPMA. The interfacial shear bonding strength between alloy specimen and fused porcelain was measured with a mechanical testing system(MTS 858.20). The results were as follows: 1) The hardness value of alloy increased as increasing amount of indium addition. 2) The formation of oxidation increased as increasing indium and tin contents after heat treatment. 3) Diffusion of indium and tin elements increased as increasing indium and tin contents in metal-porcelain surface after porcelain fused to metal firing. 4) The most interfacial shear bonding strength was increased as increasing a composition of adding elements, and a heat-treatment time, and an oxygen partial pressure. From the results of this study it was found that the addition of alloying elements such as indium and tin increase hardness of as-cast alloy, produce surface oxide layer of adding elements by heat-treatment which may improve interfacial bonding strength between alloy and porcelain.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.4
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• pp.133-140
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• 2019

The effects of thermal cycle conditions on the bonding strength and crack propagation behaviors in electroplated Cr/electroplated Ni-P coatings were systematically evaluated. 1^st heat treatment was performed at 500℃ for 3 hours after electroplating Ni-P, and then, 2^nd heat treatment was performed at 750℃ for 6 hours after electroplating Cr. The measured bonding strength by ASTM C633 were around 25.6 MPa before thermal cycling, while it increased to 47.6 MPa, after 1,000 cycles. Increasing thermal cycles led to dominant fail mode with cohesive failure inside adhesive, which seemed to be closely related to the increasing bonding strength possibly not only due to higher Cr surface roughness, but also to penetrated channeling crack density. Also, increasing density of penetrated channeling cracks in electroplating Cr layer led to slightly stronger bonding strength due to mechanical interlocking effects of adhesive inside channeling cracks.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.874-877
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• 2001

SOI(Silicon-On-Insulator) technology is proposed as an alternative to bulk silicon for MEMS(Micro Electro Mechanical System) manufacturing. In this paper, we fabricated the SOI wafer with uniform active layer thickness by silicon direct bonding and mechanical polishing processes. Specially-designed electrostatic bonding system is introduced which is available for vacuum packaging and silicon-glass wafer bonding for SOG(Silicon On Glass) wafer. We demonstrated thermopile sensor and RF resonator using the SOI wafer, which has the merits of simple process and uniform membrane fabrication.

• Transactions of the Korean Society of Automotive Engineers
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• v.5 no.2
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• pp.87-93
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• 1997

The bonding strength evaluation of light weight materials for electrical vehicle applications has been performed through single lap joint tests in which the design parameters such as fillet, joint style, adherend, bonding overlap length,bonding thickness, and environmental condition(soaking time in $25^{\circ}C$ water) are considered. It is experimentally oberved that lap shear strength of joint increases for higher fillet height, longer overlap length, and thinner bonding layer thickness. Al-Al adherend combination shows much higher lap shear strength than AL-FRP and FRP-FRP adherend combinations. Riveting at adhesive bonded joint of AL-AL adherend combination makes lap shear strength decrease. Effect of soaking time on lap shear strength is negligible.

• Journal of the Korean institute of surface engineering
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• v.48 no.6
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• pp.260-268
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• 2015

The thermal barrier coating (TBC) for inner wall of liquid-fuel rocket combustor consists of NiCrAlY as bonding layer and $ZrO_2$ as a top layer. In most case, the plasma spray coating is used for TBC process and this process has inherent possibility of cracking due to large difference in thermal expansion coefficients among bonding layer, top layer and metal substrate. In this paper, we suggest crack-free TBC process by using a precise electrodeposition technique. Electrodeposited Ni-P/Cr double layer has similar thermal expansion coefficient to the Cu alloy substrate resulting in superior thermal barrier performance and high temperature oxidation resistance. We studied the effects of phosphorous concentrations (2.12 wt%, 6.97 wt%, and 10.53 wt%) on the annealing behavior ($750^{\circ}C$) of Ni-P samples and Cr double layered electrodeposits. Annealing temperature was simulated by combustion test condition. Also, we conducted SEM/EDS and XRD analysis for Ni-P/Cr samples. The results showed that the band layers between Ni-P and Cr are Ni and Cr, and has no formed with heat treatment. These band layers were solid solution of Cr and Ni which is formed by interdiffusion of both alloy elements. In addition, the P was not found in it. The thickness of band layer was increased with increasing annealing time. We expected that the band layer can improve the adhesion between Cr and Ni-P.

• Journal of Adhesion and Interface
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• v.24 no.3
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• pp.86-94
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• 2023

To fabricate all-solution-processed flexible Organic Light-Emitting Diodes (OLEDs), we demonstrated a bonding technology using a polyethyleneimine (PEI) as an adhesion layer between the two substrates. As the adhesion layer requires not only a high adhesion strength, but also a high current density, we have tried to find out the optimum condition which meets the two requirements at the same time by changing experimental factors such as PEI concentration, thickness of the layer and by mixing some additives into the PEI. The adhesion strength and the electrical current density were investigated by tensile tests and electron only device (EOD) experiments, respectively. The results showed that at higher PEI concentration the adhesion strength showed higher value, but the electrical current through the PEI layer decreased rapidly due to the increased PEI layer thickness. We added Sorbitol and PolyEthyleneGlycohol (PEG) into the 0.1 wt% PEI solution to enhance the adhesion and electrical properties. With the addition of the 0.5 wt% PEG into the 0.1 wt% PEI solution, the device showed an electrical current density of 900 mA/cm² and a good adhesion characteristic also. These data demonstrated the possibility of fabricating all-solution-processed OLEDs using two-substrate bonding technology with the PEI layer as an adhesion layer.