• Journal of Technologic Dentistry
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• v.39 no.1
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• pp.43-52
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• 2017

Purpose: Physical and chemical properties of gold is most suitable to be restored of teeth to its original state. Recently zirconia was used instead of gold because of esthetical and intimacy of human body. Because of high strength and high abrasion resistance of zirconia, all zirconia artificial tooth lead to wear the original tooth of opposite site. To preserve this original tooth, zirconia artificial tooth covered with dental ceramic glass was used. When joining the zirconia core and dental ceramic glass, difference of their thermal expansion coefficient and wetting ability is generated the residual stress at interface lead to crack. In order to solve this problem, intermediate layer what is called zir-liner was imported to decrease the residual stress and increase the bonding strength. Methods: In this study, to identify the optimum conditions for manufacturing process, various methods to rough the surface of zirconia core were adopted, and vary the thickness of interlayer, and analyzed bond strength. Results: Bond strength of sanding specimens group showed higher than that of non-sanding specimens group, and once applied intermediate layer with sanding specimens showed highest bond strength with 28 MPa. SEM photomicrographs of zirconia cores fired at $1500^{\circ}C$ showed parallel straight lines in sanding and pockmarked surface in blasting surfaces as abrasion traces. Observation of the destruction section after shear test by SEM were carried out. Liner applied non-sanding group and non-liner applied sanding group all showed interfacial crack. Sandblasting group with non-liner showed remained dental ceramic glass on the surface of zirconia. Sandblasting group with once applied liner showed partially remained liner and dental ceramic glass on the surface of zirconia. XRD analysis revealed that sandblasting group showed higher monoclinic peaks than other specimens group and this result was due to the high collision energy for stress induced phase transformation. Conclusions: A study on the improvement of bonding strength between zirconia and dental ceramic glass steadily carried out for the future to practical use.

• Macromolecular Research
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• v.11 no.1
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• pp.9-13
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• 2003

Poly (vinylidene fluoride) (PVDF) samples were implanted by using high energy (MeV)F$^{2+}$ and Cl$^{2+}$ ions. We observed that AC dielectric constant of the ion-implanted PVDF samples decreased from 10.5 to 2.5 at 1 kHz as the ion dosage increased from 10$^{11}$ to 3 $\times$ 10$^{14}$ ions/$\textrm{cm}^2$. From differential scanning calorimetry experiments, we observed that PVDF samples become more disordered state through the ion implantation. The decrease of the number of bonding of C-H and C-F and the increase of unsaturated bonding were observed from X-ray photoelectron spectroscopy experiments. The emission of HF and H$_2$ molecules during the ion implantation was detected by residual gas analyzer spectrum. Based upon the results, we analyzed that the low AC dielectric constant of the MeV ion-implanted PVDF samples originated from the reduction of polarization due to the structural change of the CF$_2$ molecules in the MeV ion-implanted PVDF samples.les.

• Journal of the Korean institute of surface engineering
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• v.32 no.4
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• pp.496-502
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• 1999

Electroplating of Ag and Au on the functional area of lead frames are required for good bonding ability in IC packaging. As the patterns of the lead frame become finer, development of new deposition technology has been required for solving problems associated with process control for uniform thickness on selected area. Sputtering was employed to investigate the adhesion between substrate Alloy42 and Ag film as a new candidate process alternative to conventional electroplating. Coating thickness of Ag film was controlled to 3.5$\mu\textrm{m}$ at room temperature as a reference. The deposition of film was optimized to ensure the adhesion by process parameters of substrate heating temperature at $100~300^{\circ}C$, sputter etching time at -300V for 10~30min, bias voltage of -100~-500V, and existence of Cr interlayer film of $500\AA$. The critical $load L_{c}$ /, defined as the minimum load at which initial damage occurs, was the highest up to 29N at bias voltage of -500V by scratch test. AFM surface image and AES depth profile were investigated to analyze the interface. The effect of bias voltage in sputtering was to improve the surface roughness and remove the oxide on Alloy42.

• Bulletin of the Korean Chemical Society
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• v.21 no.3
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• pp.305-309
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• 2000

The cerium ion intercalated aluminosilicate was prepared by ion exchange reaction between $Na^+$ in montmorillonite and $Ce^{+4}$ in aqueous solution. The X-ray absorption near edge structrure(XANES) analyses indicate that the $Ce^{+4}$ ions are partially reduced to the $Ce^{+3}$ ones during the intercalation into layered aluminosilicate due to a charge transfer between host and intercalant. From the EXAFS analysis, two different (Ce-O) bonding pairs could be characterized with the distances and coordination numbers of 2.31 $({\pm}0.02){\AA}$ ${\times}$ 8.2 $({\pm}1.5)$ and 2.66 $({\pm}0.02){\AA}$ ${\times}$ 2.7 $({\pm}1.0)$, respectively, with the oxygen atoms as the first nearest neighbor, and two (Ce-Ce) pairs at 3.78 ${\AA}$ as the second neighbor. It is therefore concluded that the most probable Ce-species stabilized in the interlayer space of aluminosilicate after the intercalation is the tetrameric Ce-polyoxy/hydorxy cations with the mixed valent state of 0.75 $Ce^{+4}$.0.25 $Ce^{+3}$.

• Elastomers and Composites
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• v.57 no.4
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• pp.197-204
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• 2022

Recently, the demand has increased for protective clothing materials capable of shielding the wearer from bullets, fragment bullets, knives, and swords. It is therefore necessary to develop light and soft protective clothing materials with excellent wearability and mobility. To this end, research is being conducted on hybrid design methods for various highly functional materials, such as carbon nanotube (CNT) sheets, which are well known for their low weight and excellent strength. In this study, a hybrid protective material using CNT sheets was developed and its performance was evaluated. The material design incorporated a bonding method that used a binder for interlayer combination between the CNT sheets. Four types of binders were selected according to their characteristics and impregnated within CNT sheets, followed by further combination with aramid fabric to produce the hybrid protective material. After applying the binder, the tensile strength increased significantly, especially with the phenoxy binder, which has rigid characteristics. However, as the molecular weight of the phenoxy binder increased, the adhesive force and strength decreased. On the other hand, when a 25% lightweight-design and high-molecular-weight phenoxy binder were applied, the backface signature (BFS) decreased by 6.2 mm. When the CNT sheet was placed in the middle of the aramid fabric, the BFS was the lowest. In a stab resistance test, the penetration depth was the largest when the CNT sheet was in the middle layer. As the binder was applied, the stab resistance improvement against the P1 blade was most effective.

• Structural Engineering and Mechanics
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• v.87 no.2
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• pp.107-116
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• 2023

The three-dimensional Hashin criterion and user subroutine VUMAT were used to simulate the damage in the composite layer, and the secondary stress criterion was used to simulate the interlayer failure of the cohesive element of the bonding layer and the propagation characteristics under the layer. The results showed that when the shear stress wave (shear wave) propagates on the surface of the laminate, the stress wave attenuation along the fiber strength direction is small, and thus producing a large stress profile. When the compressive stress wave (longitudinal wave) is transmitted between the layers, it is reflected immediately instead of being transmitted immediately. This phenomenon occurs only when the energy has accumulated to a certain degree between the layers. The transmission of longitudinal waves is related to the thickness and the layer orientation. Along the symmetry across the thickness direction, the greater is the stress amplitude along the layer direction. Based on the detailed investigation on the impact on various laminated composites carried out in this paper, the propagation characteristics of stress waves, the damage and the destruction of laminates can be explained from the perspective of stress waves and a reasonable layering sequence of the composite can be designed against damage and failure from low velocity impact.

• KSCE Journal of Civil and Environmental Engineering Research
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• v.37 no.6
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• pp.1043-1051
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• 2017

Asphalt overlay on deteriorated concrete pavement has a problem of early damage due to reflective cracking. There is a need for a new method capable of reducing reflection cracking and ensuring the durability of pavement. The purpose of this study was to obtain durability of asphalt overlay with stress absorbing membrane interlayer (SAMI) using epoxy asphalt binder. The tensile performance, durability, water resistance and bonding performance of Epoxy-SAMI were evaluated by various tests. As a result of tests, Epoxy-SAMI meets the quality standard of the bridge waterproofing material. The repeated direct tensile test was carried out to investigate the effect of reflective cracking reduction. When the Epoxy-SAMI was applied, it had 1.2~1.56 times higher reflective cracking resistance than PSMA asphalt concrete with the thickness of 10cm even if the section thickness decreased. 4-point bending beam test results showed the number of fatigue failures increased 7.5 times when Epoxy-SAMI was applied. The Epoxy-SAMI was found to be effective in improving the durability of the asphalt pavement overlay because it serves to prevent reflective cracking, increase lifespan, and function as a waterproof layer.

• Nuclear Engineering and Technology
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• v.55 no.6
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• pp.2139-2146
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• 2023

During reactor operation, the divertor must withstand unprecedented simultaneous high heat fluxes and high-energy neutron irradiation. The extremely severe service environment of the divertor imposes a huge challenge to the bonding quality of divertor joints, i.e., the joints must withstand thermal, mechanical and neutron loads, as well as cyclic mode of operation. In this paper, potassium-doped tungsten (KW) is selected as the plasma facing material (PFM), oxygen-free copper (OFC) as the interlayer, oxide dispersion strengthened copper (ODS-Cu) alloy as the heat sink material, and reduced activation ferritic/martensitic (RAFM) steel as the structural material. In this study, a vacuum brazing technology is proposed and optimized to bond Cu and ODS-Cu alloy with the silver-free brazing material CuSnTi. The most appropriate brazing parameters are a brazing temperature of 940 ℃ and a holding time of 15 min. High-quality bonding interfaces have been successfully obtained by vacuum brazing technology, and the average shear strength of the as-obtained KW/Cu and ODS-Cu alloy joints is ~268 MPa. And a fabrication route for manufacturing the flat-type divertor target based on brazing technology is set. For evaluating the reliability of the fabrication technologies under the reactor relevant condition, the high heat flux test at 20 MW/m² for the as-manufactured flat-type KW/Cu/ODS-Cu/RAFM mockup is carried out by using the Electron-beam Material testing Scenario (EMS-60) with water cooling. This paper reports the improved vacuum brazing technology to connect Cu to ODS-Cu alloy and summarizes the production route, high heat flux (HHF) test, the pre and post non-destructive examination, and the surface results of the flat-type KW/Cu/ODS-Cu/RAFM mockup after the HHF test. The test results demonstrate that the mockup manufactured according to the fabrication route still have structural and interfacial integrity under cyclic high heat loads.

• Proceedings of the KWS Conference
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• 2010.05a
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• pp.81-81
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• 2010

전자 패키징은 미세화, 경량화, 저가화를 지향하고 신뢰성의 향상을 위해 발전해 왔다. 이러한 경향은 전자부품 자체의 성능 향상 뿐 아니라 전자부품을 장착, 고정할 수 있게 하는 인쇄회로 기판(PCB : Printed Circuit Board)의 성능에 많은 관심을 가지게 되었다. 전기적 신호의 손실을 줄이기 위해 전기, 전자 산업체에서는 가볍고 굴곡성이 우수한 연성인쇄회로기판(FPCB : Flexible PCB)과 가격이 싸고 신뢰성이 입증된 경성인쇄회로기판(RPCB : Rigid PCB)이 그 대상이다. 본 논문에서는 이 PCB중에서도 RPCB와 FPCB간의 열압착 방식으로 접합 시 전극간의 접합 양상을 보았다. 이 열압착 방식은 기존에 PCB를 접합하는데 사용하고 있는 connector를 이용한 체결법을 대체하는 기술로써 솔더를 중간층(interlayer)로 이용하여 열과 압력으로 접합하는 방식이다. 이 방식을 connector를 사용하는 방식에 비해 그 부피가 작고 I/O개수에 크게 영향 받지 않으며 자동화 공정이 쉬운 장점을 가지고 있다. 접합의 대상 중 RPCB의 경우는 무전해 니켈 금도금(ENIG : Electroless Nickle Immersion Gold)로 제작하였으며 FPCB의 경우는 ENIG와 유기보호피막(OSP : Organic solderability preservation) 처리하였다. 실험에 사용한 PCB는 $300\;{\mu}m$ pitch의 미세피치이며 솔더의 조성은 Sn-3.0Ag-0.5Cu (in wt%)과 Sn-3.0Ag (in wt%)를 사용하였다. 접합 온도와 접합 시간 그리고 접합 압력에 따라 최적의 접합 조건을 도출하였다. 접합 강도는 $90^{\circ}$ Peel Test를 통해서 측정하였으며 접합면 및 파괴면은 SEM과 EDS를 통하여 분석하였다.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.81-81
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• 2009

최근 휴대폰, 노트북 등과 같은 소형 멀티미디어 기기의 사용이 증가함에 따라 전자 패키징 산업은 경박단소화를 요구하고 있습니다. 더불어 전기적 신호의 손실을 줄이기 위해 전기, 전자산업체에서는 가볍고 굴곡성이 우수한 연성인쇄회로기판(Flexible Printed Circuit Board, FPCB)과 가격이 싸고 신뢰성이 입증된 경성인쇄회로기판(Rigid Printed Circuit Board, RPCB)의 전극간 접합에 많은 관심을 보이고 있습니다. 기존에 연성인쇄회로기판과 경성인쇄회로기판을 접합하는 방식으로는 connector를 이용한 체결법이 사용되고 있지만 완성품의 부피가 커지고 자동화 공정이 힘들며 I/O 개수가 제한적이어서 신호전달에 취약한 단점이 있습니다. 또한, 최근 FPCB를 RPCB에 접합하는데 interconnection으로 이방성 도전 필름(Anisotropic conductive film, ACF) 또는 비전도성 필름(Non-conductive film)이 널리 사용되고 있습니다. 하지만 필름의 가격이 비싸고, 낮은 전기 전도도를 보이며, 신뢰성 특성이 낮다는 단점을 가지고 있습니다. 본 실험에서는 기존의 connector 방식과 접착 필름을 이용한 방식을 대체하기 위하여 솔더를 interlayer로 이용하여 열과 압력으로 접합하는 방법에 대하여 연구하였습니다. 실험에 사용된 솔더의 조성은 Sn-3.0Ag-0.5Cu (in wt%)이고, RPCB와 FPCB의 표면처리는 ENIG로 하였습니다. 접합 온도와 접합 시간에 따라 최적의 접합 조건을 도출하고자 하였고, 접합된 시편을 가지고 신뢰성 테스트를 진행하였습니다. $85^{\circ}C$/85% 고온고습 시험과 고온 방치 시험을 통하여 접합부의 신뢰성을 테스트 하였고, 90도 Peel test로 기계적 접합 강도를 측정하였고, 파괴 단면을 Scanning Electron Microscopy (SEM), Energy-dispersive spectroscopy (EDS), X-ray photoelectron spectroscopy (XPS)로 분석하였습니다.