• Journal of the Korean Wood Science and Technology
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• v.37 no.4
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• pp.357-363
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• 2009

This study was carried out to investigate whether adhesive used in manufacturing glulam can be used to bond wood and GFRP, when considering working process and economical efficiency. The six different glulams were manufactured, changing the adhesives and the mixing ratios of the adhesives, and investigated by the block shear test and the delamination of the water soaking or boiling water soaking. The three glulams were manufactured, using the resocinol resin based adhesive, the PVAc resin based adhesive and the epoxy resin adhesive, and the other three glulams, using the adhesives mixing resocinol resin and PVAc resin. The block shear strength is higher than $7.1N/mm^2$ in all types, which is standard of KS F3021. However, in the wood failure the block shear strength was the highest as 65.9% in the PVAc. The delamination of glulams glued with PVAc adhesive, which was 1.08% in water soaking and 4.16% in boiling water soaking, was lower than 5.00% which is the standard of KS F 3021, and the adhesive strength is good. In glulams glued with only resocinol resin adhesive, the wood layers were good as 1.26% in the water soaking delamination and 0.00% in the boiling water soaking delamination. The GFRP layers were not good as 21.85% in the water soaking delamination but were good as 1.45% in the boiling water soaking delamination.

• The Journal of Korean Academy of Prosthodontics
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• v.46 no.2
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• pp.148-156
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• 2008

Statement of problems: Self-etch adhesives exhibit some clinical benefits such as ease of manipulation and reduced technique-sensitivity. Nevertheless, some concern remains regarding the bonding effectiveness of self-etch adhesives to enamel, in particular when so-called 'mild' self-etch adhesives are employed. This study compared the microtensile bond strengths to ground enamel of the two-step self-etch adhesive Clearfil SE Bond (Kuraray) to the three-step etch-and- rinse adhesive Scotchbond Multi-Purpose (3M ESPE) and the one-step self-etch adhesive iBond (Heraeus Kulzer). Purpose: The purpose of this study was to determine the effect of a preceding phosphoric acid conditioning step on the bonding effectiveness of a two-step self-etch adhesive to ground enamel. Material and methods: The two-step self-etch adhesive Clearfil SE Bond non-etch group, Clearfil SE Bond etch group with prior 35% phosphoric acid etching, and the one-step self-etch adhesive iBond group were used as experimental groups. The three-step etch-and-rinse adhesive Scotchbond Multi-Purpose was used as a control group. The facial surfaces of bovine incisors were divided in four equal parts cruciformly, and randomly distributed into each group. The facial surface of each incisor was ground with 800-grit silicon carbide paper. Each adhesive group was applied according to the manufacturer's instructions to ground enamel, after which the surface was built up using Light-Core (Bisco). After storage in distilled water at $37^{\circ}C$ for 1 week, the restored teeth were sectioned into enamel beams approximately 0.8*0.8mm in cross section using a low speed precision diamond saw (TOPMET Metsaw-LS). After storage in distilled water at $37^{\circ}C$ for 1 month, 3 months, microtensile bond strength evaluations were performed using microspecimens. The microtensile bond strength (MPa) was derived by dividing the imposed force (N) at time of fracture by the bond area ($mm^2$). The mode of failure at the interface was determined with a microscope (Microscope-B nocular, Nikon). The data of microtensile bond strength were statistically analyzed using a one-way ANOVA, followed by Least Significant Difference Post Hoc Test at a significance level of 5%. Results: The mean microtensile bond strength after 1 month of storage showed no statistically significant difference between all adhesive groups (P>0.05). After 3 months of storage, adhesion to ground enamel of iBond was not significantly different from Clearfil SE Bond etch (P>>0.05), while Clearfil SE Bond non-etch and Scotchbond Multi-Purpose demonstrated significantly lower bond strengths (P<0.05), with no significant differences between the two adhesives. Conclusion: In this study the microtensile bond strength to ground enamel of two-step self-etch adhesive Clearfil SE Bond was not significantly different from three-step etch-and-rinse adhesive Scotchbond Multi-Purpose, and prior etching with 35% phosphoric acid significantly increased the bonding effectiveness of Clearfil SE Bond to enamel at 3 months.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.9
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• pp.1408-1414
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• 2004

The use of flip-chip technology has many advantages over other approaches for high-density electronic packaging. ACF (anisotropic conductive film) is one of the major flip-chip technologies, which has short chip-to-chip interconnection length, high productivity, and miniaturization of package. In this study, thermal fatigue lift of ACF bonding flip-chip package has been predicted. Elastic and thermal properties of ACF were measured by using DMA and TMA. Temperature dependent nonlinear hi-thermal analysis was conducted and the result was compared with Moire interferometer experiment. Calculated displacement field was well matched with experimental result. Thermal fatigue analysis was also conducted. The maximum shear strain occurs at the outmost located bump. Shear stress-strain curve was obtained to calculate fatigue life. Fatigue model for electronic adhesives was used to predict thermal fatigue life of ACF bonding flip-chip packaging. DOE (Design of Experiment) technique was used to find important design factors. The results show that PCB CTE (Coefficient of Thermal Expansion) and elastic modulus of ACF material are important material parameters. And as important design parameters, chip width, bump pitch and bump width were chose. 2$^{nd}$ DOE was conducted to obtain RSM equation far the choose 3 design parameter. The coefficient of determination ($R^2$) for the calculated RSM equation is 0.99934. Optimum design is conducted using the RSM equation. MMFD (Modified Method for feasible Direction) algorithm is used to optimum design. The optimum value for chip width, bump pitch and bump width were 7.87mm, 430$\mu$m, and 78$\mu$m, respectively. Approximately, 1400 cycles have been expected under optimum conditions. Reliability analysis was conducted to find out guideline for control range of design parameter. Sigma value was calculated with changing standard deviation of design variable. To acquire 6 sigma level thermal fatigue reliability, the Std. Deviation of design parameter should be controlled within 3% of average value.

• The Journal of Advanced Prosthodontics
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• v.8 no.4
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• pp.251-258
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• 2016

PURPOSE. This study was undertaken to investigate whether use of an adhesive penetration enhancer, dimethyl sulfoxide (DMSO), improves bond stability of fiber posts to root dentin using two two-step etch-and-rinse resin cements. MATERIALS AND METHODS. Forty human maxillary central incisor roots were randomly divided into 4 groups after endodontic treatment and post space preparation, based on the fiber post/cement used with and without DMSO pretreatment. Acid-etched root dentin was treated with 5% DMSO aqueous solution for 60 seconds or with distilled water (control) prior to the application of Excite DSC/Variolink II or One-Step Plus/Duolink for post cementation. After micro-slicing the bonded root dentin, push-out bond strength (P-OBS) test was performed immediately or after 1-year of water storage in each group. Data were analyzed using three-way ANOVA and Student's t-test (${\alpha}$=.05). RESULTS. A significant effect of time, DMSO treatment, and treatment${\times}$time interaction were observed (P<.001). DMSO did not affect immediate bonding of the two cements. Aging significantly reduced P-OBS in control groups (P<.001), while in DMSO-treated groups, no difference in P-OBS was observed after aging (P>.05). CONCLUSION. DMSO-wet bonding might be a beneficial method in preserving the stability of resin-dentin bond strength over time when fiber post is cemented with the tested etch-and-rinse adhesive cements.

• Restorative Dentistry and Endodontics
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• v.46 no.4
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• pp.55.1-55.9
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• 2021

Objectives: The purpose of this systematic review was to collect and discuss the technique of adhesive systems application on dentin substrate under electric current. Materials and Methods: The first search strategy was based on data available at PubMed, LILACS, Scielo, Scopus, and Cochrane Library, using a combination of descriptors such as "dentin bond agents OR adhesive system AND electric current OR electrobond" or "dentin bonding agents OR dentin bonding agent application OR adhesive system AND electric current OR electrobond", with no limit regarding the publication year. The second search strategy was based on the articles' references found previously. An additional search strategy was applied that concerned the proposed theme in the SBU-UNICAMP (Unicamp's Library System Institutional Repository). Results: Twelve studies published between 2006 and 2020 were found. The analyses of the selected studies showed that the use of electric current during adhesive systems application on dentin, whether conventional or self-conditioning, increases resinous monomer infiltration in the dentin substrate, which improves the hybridization processes and the bond strength of the restorative material to dentin. Conclusions: Despite the favorable results related to the use of this technique, there is still no specific protocol for the application of adhesive systems under electric current.

• Journal of the korean academy of Pediatric Dentistry
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• v.34 no.4
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• pp.579-589
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• 2007

The objective of this study was to compare the shear bond strengths of five adhesive systems to the enamel and dentin of primary and permanent teeth. Fifty noncarious primary and fifty permanent teeth were collected and stored in an 0.1% thymol solution at room temperature after extraction. The tested adhesives were: Adper Scotchbond Multi-purpose Plus Adhesive (SM) Adper Single bond 2 (SB), Clearfil SE Bond (SE), Adper Prompt L-Pop (PL), GBond (GB). For the shear bonding test, the labial and lingual surfaces of primary and permanent teeth were used. To obtain a flat surface, the labial and lingual surfaces of the teeth were sanded on $SiO_2$ with number 600 grit and then divided into 20 groups of 10 surfaces each. All samples were theromocycled in water $5^{\circ}C$ and $55^{\circ}C$ for 1000 cycles. The results were as follows: 1. For primary enamel, shear bond strengths of SM and SB were significantly higher than that of SE and also SM, SB, and PL were higher than GB(p<0.05). 2. For primary dentin, there were no significant differences among the shear bond strengths of any other bonding systems except difference between SE and GB. 3. For permanent enamel, SB showed significantly higher mean shear bond strength than those of any other bonding systems(p<0.05). 4. For permanent dentin, SM showed significantly higher mean shear bond strength than that of PL and GB(p<0.05). 5. Between the primary enamel and dentin, there were significant differences in SM, SB, and GB, whereas there was statistically significant difference in PL between the permanent enamel and dentin(p<0.05). 6. Between the primary and permanent teeth on enamel, there were no significant differences among all bonding systems, whereas there were statistically significant differences in SM and SB between the primary and permanent teeth on dentin(p<0.05).

• Restorative Dentistry and Endodontics
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• v.36 no.5
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• pp.409-418
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• 2011

Objectives: The purpose of this study was to compare the microshear bond strength (${\mu}$SBS) and bonding interfaces of two-step total-etching and self-etching adhesive systems to three etch types of dentin either the acid etched, laser etched or laser and acid etched. Materials and Methods: The occlusal dentinal surfaces of thirty human molars were used. They were divided into six groups: group 1, 37% $H_3PO_4$ + Single Bond 2 (3M ESPE); group 2, Er:YAG laser (KEY Laser 3, KaVo) + Single Bond 2; group 3, Er:YAG laser + 37% $H_3PO_4$ + Single Bond 2; group 4, Clearfil SE Primer + Bond (Kuraray); group 5, Er:YAG laser + Clearfil SE Bond; group 6, Er:YAG laser + Clearfil SE Primer + Bond. The samples were subjected to ${\mu}$SBS testing 24 hr after bonding. Also scanning microscopic evaluations were made on the resin-dentin interfaces of six specimens. Results: The ${\mu}$SBS of group 2 was significantly lower than that of groups 1 and 3 in Single Bond 2 (p < 0.05). There were significant differences among the uSBS of groups 4, 5, and 6 in Clearfil SE Bond (p < 0.05). Very short and slender resin tags were observed in groups 2 and 5. Long and slender resin tags and lateral branches of tags were observed in groups 3 and 6. Conclusions: Treatment of dentin surface using phosphoric acid or self-etching primer improved the adhesion of Er:YAG lased dentin.

• The korean journal of orthodontics
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• v.27 no.5 s.64
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• pp.839-852
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• 1997

It has been submitted that different ion solutions containing sulfate induce crystal growth and might substitute conventional acid etching for pretreatment of enamel in orthodontic bonding(${\AA}rtun$ et al., Am. J. Orthod. 85, 333, 1984). This investigation was designed to evaluate the relevance of crystal growth on the enamel surface as an alternative to conventional acid etching in direct bonding of orthodontic brackets. Annexing Li2SO4, MgSO4, K2SO4 respectively in the solution with $25\%$ polyacrylic md 0.3M sulfuric acids were employed to enhance the crystal growth. Human bicuspids were treated with various parameters as combinations of crystal growth and glass ionomer cement, crystal growth and orthodontic resin, acid etching and orthodontic resin for an investigative purpose. Crystal growth solution containing MgSO4 showed the highest shear bond strength(15.6MPa) within the groups of bonding brackets with glass ionomer cement(p<0.01). Bonding with glass ionomer cement on the surface of crystal growth demonstrated higher shear bond strength than with orthodontic resin(p<0.001). Bonding with glass ionomer cement on the surface treated with crystal growth solution containing MgSO4 or K2SO4 was not different shear bond strength statistically from bonding with orthodontic resin on the acid-etched surface. It suggests that bonding brackets with glass ionomer cement on the surface treated with crystal growth solution containing MgSO4 or K2SO4 is a potential alternative to bonding with resin on the acid etched sufrace.

• International Journal of Precision Engineering and Manufacturing
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• v.2 no.3
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• pp.5-10
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• 2001

Due to the development of high-strength fibers and adhesives, it is now possible to repair cracked metallic plates by bonding reinforced patches to the plate over the crack. In this study, pre-cracked aluminum 6061-T6 alloy plates repaired with bonded carbon/epoxy composite patch are applied to investigate the effect of various patch shapes on the tensile strength and the fatigue behavior of the structure. A non-patch-boned cased and 2 type-50$\times$50, 40$\times$20 mm-composite patch-bonded cases were tested to obtain fracture loads and fatigue crack growth rate. The results showed that the patch-bonded repair improves the static strength by 17% and the fatigue life by 200% compared to non-repaired case. It means that patch-boned repair is more effective in the fatigue life. It was also revealed that the patching method along crack growth direction is more efficient in cost and weight reduction. By observing the fractography, patch-bonded repair specimens demonstrated zigzag fracture patterns compared with the non-patched specimens, which shows a typical ductile fracture.

• Structural Monitoring and Maintenance
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• v.7 no.3
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• pp.233-259
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• 2020

Using bonded fiber-reinforced polymer laminates for strengthening wooden structural members has been shown to be an effective and economical method. In this research, properties of suitable composite materials (sika wrap), adhesives and two ways of strengthening beams exposed to bending moment are presented. Passive or slack reinforcement is one way of strengthening. The most effective way of such a strengthening was to place reinforcement laminates in the stretched part of the wooden beam (lower part in our case), in order to investigate the effectiveness of externally bonding FRP to their soffits. The model is based on equilibrium and deformations compatibility requirements in and all parts of the strengthened beam, i.e., the wooden beam, the sika wrap composite plate and the adhesive layer. The theoretical predictions are compared with other existing solutions. This research is helpful for the understanding on mechanical behaviour of the interface and design of the composite-wooden hybrid structures. The results showed that the use of the new strengthening system enhances the performance of the wooden beam when compared with the traditional strengthening system.