• Title/Summary/Keyword: Bonded interface

Search Result 418, Processing Time 0.04 seconds

Effect of Bonding Misfit on Single Crystallization of Transient Liquid Phase Bonded Joints of Ni Base Single Crystal Superalloy (단결정 Ni기 초내열합금 액상확산접합부 단결정화에 미치는 접합방위차의 영향)

  • 김대업
    • Journal of Welding and Joining
    • /
    • v.20 no.5
    • /
    • pp.93-98
    • /
    • 2002
  • The effect of bonding misfit on single crystallization of transient liquid phase (TLP) bonded joints of single crystal superalloy CMSX-2 was investigated using MBF-80 insert metal. The bonding misfit was defined by (100) twist angle (rotating angle) at bonded interface. TLP bonding of specimens was carried out at 1523K for 1.8ks in vacuum. The post-bond heat treatment consisted of the solution and sequential two step aging treatment was conducted in the Ar atmosphere. The crystallographic orientation analysis across the TLP bonded joints was conducted three dimensionally using the electron back scattering pattern (EBSP) method. EBSP analyses f3r the bonded and post bonded heat treated specimens were conducted. All bonded joints had misorientation centering around the bonded interface for as-bonded and post-bond heat treated specimens with rotating angle. The average misorientation angle between both solid phases in bonded interlayer was almost identical to the rotating angle at bonded interface. HRTEM observation revealed that the atom arrangement of both solid phases in bonded interlayer was quite different across the bonded interface. It followed that grain boundary was formed in bonded interface. It was confirmed that epitaxial growth of the solid phase occurred from the base metal substrates during TLP bonding and single crystallization could not be achieved in joints with rotating angle.

EFFECTS OF INTERFACE CRACKS EMANATING FROM A CIRCULAR HOLE ON STRESS INTENSITY FACTORS IN BONDED DISSIMILAR MATERIALS

  • CHUNG N.-Y.;SONG C.-H
    • International Journal of Automotive Technology
    • /
    • v.6 no.3
    • /
    • pp.293-303
    • /
    • 2005
  • Bonded dissimilar materials are being increasingly used in automobiles, aircraft, rolling stocks, electronic devices and engineering structures. Bonded dissimilar materials have several material advantages over homogeneous materials such as high strength, high reliability, light weight and vibration reduction. Due to their increased use it is necessary to understand how these materials behave under stress conditions. One important area is the analysis of the stress intensity factors for interface cracks emanating from circular holes in bonded dissimilar materials. In this study, the bonded scarf joint is selected for analysis using a model which has comprehensive mixed-mode components. The stress intensity factors were determined by using the boundary element method (BEM) on the interface cracks. Variations of scarf angles and crack lengths emanating from a centered circular hole and an edged semicircular hole in the Al/Epoxy bonded scarf joints of dissimilar materials are computed. From these results, the stress intensity factor calculations are verified. In addition, the relationship between scarf angle variation and the effect by crack length and holes are discussed.

Influence of Circular Hole for Fracture Criteria of Interface Crack in Bonded Dissimilar Materials (이종접합 계면균열의 파괴기준에 대한 원공의 영향)

  • 정남용
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
    • /
    • 1999.10a
    • /
    • pp.301-306
    • /
    • 1999
  • Application of bonded dissimilar materials in various industries are increasing. When these materials are used in structures, it needs to investigate strength evaluation applying fracture mechanics. Al/Epoxy bonded dissimilar materials with an interface crack and an interface crack emanating from an edge semicircular hole were prepared for the static tests so that experiment of fracture toughness were carried out. Stress intensity factors of interface cracks in bonded dissimilar materials were computed with boundary element method(BEM) and the fracture criteria of mixed mode crack were analyzed. From the results, the fracture criteria and the method of strength evaluation by the fracture toughness in Al/ Epoxy bonded dissimilar materials were proposed.

  • PDF

Evaluation Method of Interface Strength in Bonded Dissimilar Materials of AU/Epxy (Al/ Epoxy 이종 접합체에 대한 계면강도의 평가방법)

  • Chung, Nam-Yong
    • Transactions of the Korean Society of Mechanical Engineers A
    • /
    • v.26 no.11
    • /
    • pp.2277-2286
    • /
    • 2002
  • The application of bonded dissimilar materials to industries as automobiles, aircraft, rolling stocks, electronic devices and engineering structures is increasing gradually because these materials, compared to the homogeneous materials, have many advantages for material properties. In spite of such wide applications of bonded dissimilar materials, the evaluation method of quantitative strength considering the stress singularities for its bonded interface has not been established clearly. In this paper, the stress singularity for Bctors and the stress intensity factors were analyzed by boundary element method(BEM) for the scarf joints of Al/Epoxy with and without a crack, respectively. From static fracture experiments of the bonded scarf joints, a fracture criterion and a evaluation method of interface strength in bonded dissimilar materials were proposed and discussed.

Prediction Fracture Strength on Adhesively Bonded scarf Joints in Dissimilar Materials (이종재료의 경사접착이음에 대한 파괴강도의 예측)

  • 정남용
    • Journal of the Korean Society of Manufacturing Technology Engineers
    • /
    • v.4 no.4
    • /
    • pp.50-60
    • /
    • 1995
  • Recently advantages joining dissimiliar materials and light weight material techniques have led to increasing use of structural adhesives in the various industries. Stress singulartiy occurs at the interface edges of adhesively bonded dissimilar materials. So it is required to analyze its stress singularity at the interface edges of adhesively bonded joints indissimilar materials. In this paper, the analysis method of stress singularity is studied in detail. Also, effects of the stress singularity at the interface edge of adhesively bonded scarf joints in combinations of dissimilar materials are investigated by using 2-dimensional elastic program of boundary element method. As the results, the strength evaluation method of adhesively bonded dissimilar materials using the stress singularity factor, $\Gamma$,is very useful. The fracture criterion, method of strength evaluation and prediction of fracture strength by the stress singularity factor on the adhesively bonded dissimilar materials are proposed.

  • PDF

Establishment of fracture Criterion for Mixed Mode in Bonded Dissimilar Materials (이종 접합체에 대한 혼합모드 파기기준의 설정)

  • 정남용
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
    • /
    • 1998.10a
    • /
    • pp.254-260
    • /
    • 1998
  • Application of bonded dissimilar materials in various industries are increasing. When these materials are used in structures, it needs to investigate strength evolution applying fracture mechanics. Al/Epoxy bonded dissimilar materials with an interface crack and an interface crack emanating from an edge semicircular hole were prepared for the static tests so that experiment of fracture toughness were carried out. Stress intensity factors of interface cracks in bonded dissimilar materials were computed with boundary element method(BEM) and the fracture criterion of mixed mode crack were analyzed. From the results, the fracture criterion and the method of strength evolution by the fracture toughness in Al/Epoxy bonded dissimilar materials were proposed.

  • PDF

Analysis of Stress Singularity for the Excess Adhesive of Interface in Adhesively Bonded Joint (접착이음의 계면덧살에 대한 응력특이성 해석)

  • Chung, Nam-Yong;Park, Cheol-Hee
    • Journal of the Korean Society of Manufacturing Technology Engineers
    • /
    • v.21 no.3
    • /
    • pp.439-445
    • /
    • 2012
  • The stress singularity for the excess adhesive on interface of adhesively bonded joint was investigated by using the 2-dimensional elastic boundary element method (BEM). To establish a reasonable strength evaluation method and a fracture criterion for the excess adhesive of interface in adhesively bonded joint, it is necessary to evaluate fracture parameters with various bonding conditions. Under the variations of adhesively bonded thickness (h) and diameter (d) for the excess adhesive, a stress analysis was performed, and from the results, the stress singularity index (${\lambda}$) and the stress singularity factor (${\Gamma}$) were calculated. The variations have a great influences on the stress singularity for the excess adhesive of interface in adhesively bonded joint, and the ${\Gamma}$ is reduced as the "h" and "d" increase.

Establishment of Fracture Criteria for Mixed Mode in Bonded Dissimilar Materials with an Crack Emanating from an Edge Semicircular Hole (이종 접합체의 원공에서 파생하는 균열에 대한 혼합모드 파괴기준의 설정)

  • Jeong, Nam-Yong;Song, Chun-Ho
    • Transactions of the Korean Society of Mechanical Engineers A
    • /
    • v.25 no.6
    • /
    • pp.907-915
    • /
    • 2001
  • Application of bonded dissimilar materials in many industries are increasing. When these materials are to be used in structures, it needs to evaluate the failure strength applying fracture mechanics. Al/Epoxy bonded dissimilar materials with an interface crack and an interface crack emanating from an edge semicircular hole were prepared, experiment of fracture toughness were carried out. Stress intensity factors of interface cracks in bonded dissimilar materials were computed with boundary element method(BEM) and the fracture criteria of mixed mode crack were analyzed. From the results, the fracture criteria and the method of strength evaluation by the fracture toughness in Al/Epoxy bonded dissimilar materials were proposed.

Evaluation of Fracture Toughness on Interface Cracks in Bonded Components of Dissimilar Materials (이종 접합부재의 계면균열 파괴인성의 평가)

  • Chung, Nam-Yong;Lee, Myung-Dae;Park, Chul-Hee
    • Proceedings of the KSME Conference
    • /
    • 2003.04a
    • /
    • pp.346-351
    • /
    • 2003
  • In this paper, an evaluation method of fracture toughness on interface cracks has been investigated under various mixed-mode conditions of the bonded scarf joints. Two types of the bonded scarf joints with an interface crack were prepared to analyze the stress intensity factors using boundary element method(BEM) and to perform the fracture toughness test. From the results of fracture toughness experiments and BEM analysis, an evaluation method of fracture toughness on interface cracks in the bonded components of dissimilar materials has been proposed and discussed.

  • PDF

An Evaluation Method of fracture Toughness on Interface Cracks in Bonded Dissimilar Materials (이종 접합체의 계면균열에 대한 파괴인성의 평가방법)

  • 정남용
    • Transactions of the Korean Society of Automotive Engineers
    • /
    • v.11 no.4
    • /
    • pp.110-116
    • /
    • 2003
  • In this paper, an evaluation method of fracture toughness on interface cracks has been investigated under various mixed-mode conditions of the bonded scarf joints. Two types of the bonded scarf joints with an interface crack were prepared to analyze the stress intensity factors using boundary element method(BEM) and to perform the fracture toughness test. From the results of fracture toughness experiments and BEM analysis, an evaluation method of fracture toughness on interface cracks in the bonded dissimilar materials has been proposed and discussed.