• Title/Summary/Keyword: Bond Stresses

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A Study on the Bond-Behavior of Bonded Concrete Overlays (접착식 콘크리트 덧씌우기 포장의 부착거동 연구)

  • Kim, Young-Kyu;Lee, Seung-Woo;Han, Seung-Hwan
    • International Journal of Highway Engineering
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    • v.14 no.5
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    • pp.31-45
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    • 2012
  • PURPOSES: In Korea, rapid maintenance of distressed concrete pavement is required to prevent traffic jam of the highway. Asphalt concrete overlay has been used as a general maintenance method of construction for aged concrete pavement. AC overlay on existing concrete pavements experience various early distresses such as reflection crack, pothole and rutting, due to different physical characteristics between asphalt overlay and existing concrete pavement. Bonded concrete overlay(BCO) is a good alternative since it has advantages that can reduce various distresses during the service life since overlay material has similar properties with existing concrete pavements. Recently, BCO which uses the ultra rapid harding cement has been applied for maintenance of highway. BCO has advantage of structural performance since it does monolithic behave with existing pavement. Therefore, it is important to have a suitable bond strength criteria for securing performance of BCO. Bond strength criteria should be larger than normal tensile stress and horizontal shear stress occurred by traffic and environmental loading at bond interface. Normal tensile stress and horizontal shear stress need to estimated for the establishment of practical bond strength criteria. METHODS: This study aimed to estimate the bond stresses at the interface of BCO using the three dimensional finite element analysis. RESULTS: As a result of this study, major failure mode and maximum bond stress are evaluated through the analysis of normal tensile stress and horizontal shear stress for various traffic and environmental load conditions. CONCLUSIONS: It was known that normal tensile stresses are dominated by environmental loading, and, horizontal shear stresses are dominated by traffic loading. In addition, bond failure occurred by both of normal tensile stresses and horizontal shear stresses; however, normal tensile stresses are predominated over horizontal shear stresses.

Analysis of thermal stresses developed in plasma sprayed layer (플라즈마 용사층에 발생하는 응력해석)

  • 배강열;김희진
    • Journal of Welding and Joining
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    • v.8 no.4
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    • pp.58-68
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    • 1990
  • The formation of thermal stresses by plasma spraying is generally considered as adverse. Therefore, the knowledge of stress distribution in the deposited layer during and after plasma spraying will be of special interest. In this study finite difference heat transfer analysis and finite element stress analysis were carried out to predict the change of stress distribution in the plasma coated layer with the variations of preheat temperature, number of scan, particle size, and bond coat. The results of the numerical analysis were as follows: 1) Transient stresses developed in the coated layer were up to the level of yiedl strength at the temperature. 2) The tensile stresses were developed in the deposited layer and the surface of the substrate, but the compressive stresses were developed in the rest of the substrate. 3) Transient and residual stresses were significantly affected by the preheat temperature. 4) The variations of temperature of powder particle and number of torch scan changed tensile stress distribution, but made no difference on the magnitude of the stresses. 5) Bond coated layer reduced the stree level of deposited layer.

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Numerical Simulation of Effects of TGO Growth and Asperity Ratio on Residual Stress Distributions in TC-BC-TGO Interface Region for Thermal Barrier Coatings (열차폐 코팅의 TGO 성장과 형상비에 따른 TC-BC-TGO 계면에서의 잔류응력 변화에 대한 유한요소해석)

  • Jang, Jung-Chel;Choi, Sung-Churl
    • Journal of the Korean Ceramic Society
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    • v.43 no.7 s.290
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    • pp.415-420
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    • 2006
  • The residual stresses in the interface region of the Thermal Barrier Coating (TBC)/Thermally Grown Oxide (TGO)/Bond Coat (BC) were calculated on the TBC-coated superalloy samples using a Finite Element Method (FEM). It was found that the stress distribution of the interface boundary was dependent upon mainly the geometrical shape or its aspect ratio and the thickness of TGO layer, which was formed by growth and swelling behavior of oxide layer. Maximum compressive residual stress in the TBC/TGO interface is higher than that of the TGO/bond coat interface, and the tensile stress had nothing to do with change of an aspect ratio. The compressive residual stresses in the TBC/TGO and TGO/bond coat interface region increased gradually with the TGO growth.

A Study on the Effect of the Thickness of Bond Coating on the Thermal Stresses of a Sprayed Thermal Barrier Coating (접착층의 두께가 용사 열차폐 코팅의 열응력에 미치는 영향에 관한 연구)

  • 김형남
    • Journal of Welding and Joining
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    • v.19 no.2
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    • pp.221-227
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    • 2001
  • Based on the principle of complementary energy, an analytical method is developed which focuses on the end effects for determining thermal stress distributions in a three-layered beam. This method gives the stress distributions which completely satisfy the stress-free boundary conditions. A numerical example is given in order to verify this method. The results show that the present analytical solutions have the values of stress in excellent agreement with the solutions derived by other investigators. Using this method, the effects of the thickness of bond coat on the thermal stresses of a typical sprayed thermal barrier coating, which consists of IN738LC substrate, MCrAIY bond coat and ZrO$_2$-8wt%Y$_2$O$_3$top coat, were investigated.

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Characteristics of Bond Strength with Measuring Methods of Concrete (시험방법에 따른 신ㆍ구 콘크리트의 부착강도 특성)

  • 장흥균;김성환;홍창우;윤경구
    • Proceedings of the Korea Concrete Institute Conference
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    • 2003.05a
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    • pp.597-600
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    • 2003
  • The development and maintenance of a sound bond are an essential requirements of concrete repair and replacement. The bond property of a bonded overlay to its substrate concrete during the lifetime is one of the most important performance requirements which should be quantified. A standard or a verified bond strength measurement method is required at field for screening, selecting materials and quality control for overlay or repair materials. This study compares the nipple pipe direct tensile test, flexural adhesion test, and core pull-off test with their test results. Substantial differences in the failure stresses of three test methods were attributed to their different geometries and loading conditions. From these comparison and investigation, core pull-off test was relatively good because the coefficient of variation values were about 2%. It would be suitable for use in-situ because of its simplicity and accuracy.

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An Experimental Study for the Bond Performance of the Epoxy-coated Reinforcement in Marine Concrete Structures (해양 콘크리트 구조물에서 에폭시 도막철근의 부착성능에 관한 연구)

  • 조병완;유태호
    • Proceedings of the Korea Concrete Institute Conference
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    • 1996.10a
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    • pp.122-126
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    • 1996
  • In recent years, plenty of problems in the large-scaled bridges, piers…have been reported to the public due to the severe environment factors. The use of Epoxy-Coated reinforcement against salt and sulfate corrosion is considered as a reasonable solution and tested to study the bond performance between the thickness of coating and bond stresses. The results are that the strength of bond was decreased by 10 to 13 percent in the case of 100$\mu\textrm{m}$ of coating thickness and by 15 to 25 percent in the case of 200$\mu\textrm{m}$ to 300$\mu\textrm{m}$ and significantly fell down when the thickness was above 300$\mu\textrm{m}$. Accordingly, a 200$\mu\textrm{m}$ coating-thickness to the reinforcement is suggested to maintain the acceptable bond mechanism and goes well with the ASTM(item NO.A775) and those of Korean Concrete Institute.

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Fracture and Residual Stresses in $Metal/Al_2O_3-SiO_2$ System

  • Soh, D.;Korobova, N.
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2003.11a
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    • pp.308-312
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    • 2003
  • The packaging of the integrated circuits requires knowledge of ceramics and metals to accommodate the fabrication of modules that are used to construct subsystems and entire systems from extremely small components. Composite ceramics ($Al_2O_3-SiO_2$) were tested for substrates. A stress analysis was conducted for a linear work-hardening metal cylinder embedded in an infinite ceramic matrix. The bond between the metal and ceramic was established at high temperature and stresses developed during cooling to room temperature. The calculations showed that the stresses depend on the mismatch in thermal expansion, the elastic properties, and the yield strength and work hardening rate of the metal. Experimental measurements of the surface stresses have also been made on a $Cu/Al_2O_3-SiO_2$ ceramic system, using an indentation technique. A comparison revealed that the calculated stresses were appreciably larger than the measured surface stresses, indicating an important difference between the bulk and surface residual stresses. However, it was also shown that porosity in the metal could plastically expand and permit substantial dilatational relaxation of the residual stresses. Conversely it was noted that pore clusters were capable of initiating ductile rupture, by means of a plastic instability, in the presence of appreciable tri-axiality. The role of ceramics for packaging of microelectronics will continue to be extremely challenging.

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Review on Water Vapor Diffusion through Wood Adhesive Layer

  • Omar Saber ZINAD;Csilla CSIHA
    • Journal of the Korean Wood Science and Technology
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    • v.52 no.4
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    • pp.301-318
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    • 2024
  • Contrary to other materials like metals, glass, etc., wood continuously interacts with the environment, increasing and decreasing its moisture content according to the humidity of the air and changing its dimensions by swelling or shrinking. Water diffusion through laminated solid wood is crucial in wood bonding processes. The adhesive layer might block the diffusion if the water vapor diffusion is perpendicular to the bond line. As a result of this blockage, different proportions of deformation appear on the two sides of the bond line, which causes stresses in the bonded assembly. The question arises of how long the bonded structure will keep its integrity due to moisture diffusion blockage, inevitable tensions appearing in the glue line, and how these stresses could be avoided. With cross laminated timber (CLT) solid wood panel production, this question gains new importance. Despite the relevance, only a limited number of publications are available. Comprehensive research would also be necessary considering both the molecular structure and diffusion properties of the adhesive adjusted to the wood species (covering possible substituting wood species, too). Overall, this review serves as a resource for enhancing our understanding of water vapor diffusion through wood adhesive layers and provides insights that have implications for reducing stresses in bonded wood assemblies and the performance of the bonded group over time. Furthermore, identifying knowledge gaps is necessary to establish the basis for investigating the diffusion property of CLT panels.

Investigation of the effects of connectors to enhance bond strength of externally bonded steel plates and CFRP laminates with concrete

  • Jabbar, Ali Sami Abdul;Alam, Md Ashraful;Mustapha, Kamal Nasharuddin
    • Steel and Composite Structures
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    • v.20 no.6
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    • pp.1275-1303
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    • 2016
  • Steel plates and carbon-fiber-reinforced polymer (CFRP) laminates or plates bonded to concrete substrates have been widely used for concrete strengthening. However, this technique cause plate debonding, which makes the strengthening system inefficient. The main objective of this study is to enhance the bond strength of externally bonded steel plates and CFRP laminates to the concrete surface by proposing new embedded adhesive and steel connectors. The effects of these new embedded connectors were investigated through the tests on 36 prism specimens. Parameters such as interfacial shear stress, fracture energy and the maximum strains in plates were also determined in this study and compared with the maximum value of debonding stresses using a relevant failure criterion by means of pullout test. The study indicates that the interfacial bond strength between the externally bonded plates and concrete can be increased remarkably by using these connectors. The investigation verifies that steel connectors increase the shear bond strength by 48% compared to 38% for the adhesive connectors. Thus, steel connectors are more effective than adhesive connectors in increasing shear bond strength. Results also show that the use of double connectors significantly increases interfacial shear stress and decrease debonding failure. Finally, a new proposed formula is modified to predict the maximum bond strength of steel plates and CFRP laminates adhesively glued to concrete in the presence of the embedded connectors.

An experimental investigation on effect of elevated temperatures on bond strength between externally bonded CFRP and concrete

  • Attari, Behzad;Tavakkolizadeh, Mohammadreza
    • Steel and Composite Structures
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    • v.32 no.5
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    • pp.559-569
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    • 2019
  • The bond strength between composite laminates and concrete is a key factor that controls the behavior of concrete members strengthened with fiber reinforced polymer (FRP) sheets, which can be affected by several parameters such as thermal stresses and surface preparation. This article presents the result of an experimental study on the bond strength between FRP sheets and concrete at ambient temperature after specimens had been exposed to elevated temperatures of up to $200^{\circ}C$. For this purpose, 30 specimens of plain concrete with dimensions of $150{\times}150{\times}350mm$ were prepared. Three different conventional surface preparation methods (sandblasting, wire brushing and hole drilling) were considered and compared with a new efficient method (fiber implantation). Deformation field during each experiment was monitored using particle image velocimetry. The results showed that, the specimens which were prepared by conventional surface preparation methods, preserved their bond integrity when exposed to temperature below glass transition temperature of epoxy resin (about $60^{\circ}C$). Beyond this temperature, the bond strength and stiffness decreased significantly (about 50%) in comparison with control specimens. However, the specimens prepared by the proposed method displayed higher bond strengths of up to 32% and 90% at $25^{\circ}C$ and $200^{\circ}C$, respectively.