• Transactions of the Korean Society of Mechanical Engineers A
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• v.29 no.11 s.242
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• pp.1542-1550
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• 2005

This paper presents the numerical procedure for calculating non-uniform residual stresses based on relieved displacements obtained from incremental hole drilling. The relationship between the in-plane displacement produced by introducing a blind hole and the corresponding residual stress is established. Finite element calculations are described to evaluate the relieved coefficients required for the determination of non-uniform residual stresses. Validity of the proposed method has been tested through three axisymmetric test examples and two three-dimensional examples. As a result of . simulation on the test examples, it is found that this numerical procedure is well adopted to measuring non-uniform residual stress in the full hole depth range of the hole diameter from the surface. The accuracy of the hole drilling method with displacement measurement is discussed, comparing tile method with strain measurement

• Journal of Welding and Joining
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• v.15 no.2
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• pp.81-88
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• 1997

The residual stresses produced by a circumferential weld between axisymmetric cylinders are one of the most important problems concerning buckling strength, fatigue strength, stress corrosion cracking in shell structures, and arc quite different from those due to a butt weld between flat plates. This paper presents experimental studies on weld cylinder models of various heat inputs and thin cylinder diameters by blind hole drilling method. As a result, it is certified that weld residual stress (axial stress and hoop stress) is larger, as heat input and shell cylinder diameter are larger, and that experimental results show good agreement with the result of preceding researchers.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.10
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• pp.14-22
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• 2010

The most costly and time-consuming process in the fabrication of today's multi-layer circuit board is drilling interconnection holes between adjacent layers and via holes within a layer. Decreasing size of via holes being demanded and growing number of via holes per panel increase drilling costs. Component density and electronic functionality of today's multi-layer circuit boards can be improved with the introduction of cost-effective, variable depth laser drilled blind micro via holes, and interconnection holes. Laser technology is being quickly adopted into the circuit board industry but can be accelerated with the introduction of a true production laser drilling system. In order to get optimized condition for drilling to FPCB (Flexible Printed Circuit Board), we use various drill pattern as drill step. For productivity, we investigate drill path optimization method. And for the precise drilling the thermal drift of scanner and temperature change of scan system are tested.

• Transactions of the Korean Society of Mechanical Engineers
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• v.16 no.9
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• pp.1632-1642
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• 1992

When a blind hole of small diameter is drilled in the field of residual stress, strain relieved around the hole is function of magnitude of stress, patterns of stress distribution and hole geometry of diameter and depth. Relieved strain coefficients can be calculated from FEM analysis of relieved strain and actual stress. These relieved strain coefficients make it possible to measure residual stress which vary along the depth in the subsurface of stressed material. In this study, the calibration tests of residual stress measurement are carried out by drilling a hole incrementally on the cantilever or on the tensile test bar. Residual stresses can be determined from measured strains around a shallow hole by application of power series method. For the sake of reliable measurement of residual stress, much efforts should be done to measure relieved strains and hole depth more accurately comparing with conventional procedures of gage subject to the external load. Otherwise linear equations converting strains into stresses may yield erratic residual stresses because of ill-conditions of linear equations. With accurate measurements of relieved strains, residual stress even if varying along the depth can be measured. It is also possible to measure residual stress in the thin film of material by drilling a shallow hole.

• Journal of the Society of Naval Architects of Korea
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• v.35 no.4
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• pp.55-64
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• 1998

Using blind hole drilling method the residual stresses and welding deflections are measured for the cylindrical shell with various heat inputs and cylinder diameters. As a result, it is verified that the axial and hoop residual stresses which are generated near the weld part of cylinders are increased, as the heat inputs and cylinder diameters are increased. And experimental results show good agreements with those of precedent researchers. In this paper, it is validated that dominant parameters, heat input Q and the dimension of cylinder h/D have some effects on the magnitude and distribution of axial and hoop residual stresses and welding deflections. The empirical equations of residual stresses and welding deflections are made by using multiple linear regression with experimental results.