• Journal of Energy Engineering
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• v.24 no.2
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• pp.17-21
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• 2015

Restriction orifices in the feed and bleed circuit of nuclear power plant are designed using computer program capable of handling multiple hole cascade orifice assembly. Single hole stages of orifice assembly are alternated with multihole stages where necessary. The distance between stages is such that it allows full pressure recovery. The minimum static pressure is higher than vapor pressure at the operating temperature so that cavitation does not occur. Piping sizes are reviewed and increased if necessary to improve rigidity.

• Journal of Korean Neurosurgical Society
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• v.53 no.6
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• pp.380-382
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• 2013

We report a case of fatal duret hemorrhage (DH) in a patient with acute tentorial subdural hematoma and bilateral chronic subdural hematoma along the cerebral hemispheres. Preoperative CT angiography (CTA) revealed prominent parenchymal enhancement in the ventral pontomesencephalic area. After burr-hole drainage, a large hemorrhage developed in this area. The parenchymal enhancement in the CTA may reflect the pontomensencephalic perforating vessel injury, and may be a sign of impending DH of acute transtentorial downward herniation. Previous use of aspirin and warfarin might have potentiated the process of DH and increase the extent of the bleed.

• New & Renewable Energy
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• v.16 no.4
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• pp.41-48
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• 2020

This study performed a single hole operation method using a balancing well-cross-mixed underground heat exchanger, and conducted thermal performance studies of an SCW-type underground heat exchanger using a two-well. The study attempted to change the existing operating method of the two adjacent SCW underground heat exchangers with one ball each. The SCW-type geothermal heat exchanger is considered to enable up to 20% of bleed discharge at maximum load, which makes groundwater usage unequal. The efficiency factor of the geothermal system was improved by constructing the discharged water by cross-mixing two balancing wells to prevent the discharge of groundwater sources and keep the temperature of the underground heat exchanger constant. As a result of the cooling and heating operation with the existing SCW heat exchange system and the balancing well-cross-mixed heat exchange system, the measured performance coefficient improved by 23% and 12% in cooling and heating operations, respectively. In addition, when operating with a balanced cross-mixing heat exchange system, it has been confirmed that the initial basement temperature is constant with a standard deviation of 0.08 to 0.12℃.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.7-11
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• 2013

As thermosonic ball bonding is developed for more and more advanced applications in the electronic packaging industry, the control of process stresses induced on the integrated circuits becomes more important. If Cu bonding wire is used instead of Au wire, larger ultrasonic levels are common during bonding. For advanced microchips the use of Cu based wire is risky because the ultrasonic stresses can cause chip damage. This risk needs to be managed by e.g. the use of ultrasound during the impact stage of the ball on the pad ("pre-bleed") as it can reduce the strain hardening effect, which leads to a softer deformed ball that can be bonded with less ultrasound. To find the best profiles of ultrasound during impact, a numerical model is reported for ultrasonic bonding with capillary dynamics combined with a geometrical model describing ball deformation based on volume conservation and stress balance. This leads to an efficient procedure of ball bond modelling bypassing plasticity and contact pairs. The ultrasonic force and average stress at the bond zone are extracted from the numerical experiments for a $50{\mu}m$ diameter free air ball deformed by a capillary with a hole diameter of $35{\mu}m$ at the tip, a chamfer diameter of $51{\mu}m$, a chamfer angle of $90^{\circ}$, and a face angle of $1^{\circ}$. An upper limit of the ultrasonic amplitude during impact is derived below which the ultrasonic shear stress at the interface is not higher than 120 MPa, which can be recommended for low stress bonding.