• Transactions of the Korean Society of Machine Tool Engineers
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• v.12 no.1
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• pp.16-23
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• 2003

Keeping the layer thickness constant is very essential for improving the shape accuracy in the stereolithography process. The layer thickness is created by recoating process, and also affected by recoating parameters such as blade speed and thickness. The created layer in this process can determine the whole accuracy of the entire parts. The aim of this paper is to improve the accuracy of the layer thickness by adjusting the recoating process parameters. Several experiments with different recoating conditions are Performed to find the optimal recoating parameters that produce the most accurate layer thickness. The effective recoating method is suggested by measuring and analyzing the cured layer thickness.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.27 no.8
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• pp.1309-1316
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• 2003

The general dicing process cuts a semiconductor wafer to lengthwise and crosswise direction by using a rotating circular diamond blade. But products with inferior quality are produced under the influence of several parameters in dicing process such as blade, wafer, cutting water and cutting conditions. Moreover we can not apply this dicing method to GaN wafer, because the GaN wafer is harder than the other wafer such as SiO2, GaAs, GaAsP, and AlGaAs. In order to overcome this problem, development of a new dicing process and determination of dicing parameters are necessary. This paper describes a new wafer dicing method using fixed diamond scriber and precision servo mechanism and determination of several parameters - scribing depth, scribing force, scriber inclined angle, scribing speed, and factor for scriber replacement - for a new dicing machine using scriber.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.2
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• pp.218-225
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• 2003

The general dicing process cuts a semiconductor wafer to lengthwise and crosswise direction by using a rotating circular diamond blade. However, inferior goods may be made under the influence of several parameters in dicing process such as blade, wafer, cutting water and cutting conditions. Moreover we can not apply this dicing method to a GaN wafer, because the GaN wafer is harder than other wafers such as SiO$_2$, GaAs, GaAsP, and AlGaAs. In order to overcome this problem, development of a new dicing process and determination of dicing parameters are necessary. This paper describes determination of several parameters - scribing depth, scribing force, scriber inclined angle, scribing speed, and factor for scriber replacement - for a new dicing machine using a scriber.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.164-167
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• 2002

The general dicing process cuts a semiconductor wafer to lengthwise and crosswise direction by using a rotating circular diamond blade. But inferior goods are made under the influence of several parameters in dicing process such as blade, wafer, cutting water and cutting conditions. Moreover we can not applicable this dicing method to GaN wafer, because the GaN wafer is harder than the other wafer such as SiO$_2$, GaAs, CaAsP, and AlCaAs. In order to overcome this problem, development of a new dicing process and determination of dicing parameters are necessary. This paper describes determination of several parameters - scribing depth, scribing force, scriber inclined angle, scribing speed, and factor for scriber replacement - for a new dicing machine using scriber.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.48 no.6
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• pp.411-418
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• 2020

In this paper, approximation and optimization methods are proposed for the structural performance of the composite fan blade. Using these methods, we perform the optimal design of the stacking sequence to maximize stiffnesses without changing the mass and the geometric shape of the composite fan blade. In this study, the lamination parameters are introduced to reduce the design variables and space. From the characteristics of lamination parameters, we generate response surface model having a high fitness value. Considering the requirements of the optimal stacking sequence, the multi-objective optimization problem is formulated. We apply the two-step optimization method that combines gradient-based method and genetic algorithm for efficient search of an optimal solution. Finally, the finite element analysis results of the initial and the optimized model are compared to validate the approximation and optimization methods based on the lamination parameters.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.26 no.11
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• pp.1552-1558
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• 2002

The blade leading edge is modified to control the secondary flow generated in the turbine cascade with fence by intensifying the suction side branch of the horseshoe vortex. The incompressible Navier-Stokes equations are numerically solved with a high Reynolds number k-$\varepsilon$ turbulence closure model for investigating the vortical flows in the turbine cascade. The computational results of total pressure loss coefficients in the wake region are first compared with experiments for validation. The structure and strength of the passage vortex near the suction surface are examined by testing various geometrical parameters of the turbine blade leading edge.

• Proceedings of the KSME Conference
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• 2000.11b
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• pp.428-433
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• 2000

The characteristics of unsteady heat transfer and boundary layer flow in the SSME turbine rotor passage are investigated with LRN $k-{\varepsilon}$ turbulence model. The unsteady flow and heat transfer in a rotor blade passage as a result of wake/blade interaction is modeled by the inviscid/boundary-layer flow approach. The relevant governing equations are discretized to a system of finite different equations by means of a BTBCS implicit method. These equations have been solved numerically, for the velocity and temperature fields using TDMA method. Heat flux on the blade surface and flow parameters in the rotor passage are calculated with wake interaction. Numerical results show that velocity, pressure, turbulent kinetic energy and heat flux on the blade surface are varied periodically by wake passing.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2001.04a
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• pp.101-106
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• 2001

In order to establish the optimum process parameters and diamond saw blade composition for machining natural stone, the chip formation process and the wear process must be understood. Diamond saw blade is one of the most effective, versatile, and extensively used methods of processing rock and other hard materials, such as granite, marble, concrete and asphalt. For many years, it has been known that chip thickness is one of the most significant in the understanding of the sawing process, and other variables such as force and power have been correlated with it. In this study, mathematical relations of a material chipped by a single grit of the saw blade will be undertaken. The material chipping geometries have been mathematically defined and derived as maximum chip thickness.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.24 no.5
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• pp.374-380
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• 2014

This article proposes a design guideline to reduce squeal noise generated by an automobile wiper blade. In order to explain the squeal noise phenomenon, a source of squeal noise is experimentally investigated using a rotating disk equipment, and then a single-degree-of-freedom stick-slip vibration model is established for a blade tip. Based on analytical results, we discuss a tendency of the squeal noise for various physical parameters.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.14 no.9 s.90
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• pp.819-826
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• 2004

A multi-step optimum strategy for the selection of the locations and directions of strain gauges is proposed in this paper to capture at best the modal response of blade in a series of modes on fan blades. It is consist of three steps including two pass reduction step, genetic algorithm and fine optimization to find the locations-directions of strain gauges. The optimization is based upon the maximum signal-to-noise ratio(SNR) of measured strain values with respect to the inherent system measurement noise, the mispositioning of the gauge in location and gauge failure. Optimal gauge positions for a fan blade is analyzed to prove the effectiveness of the multi-step optimum methodology and to investigate the effects of the considering parameters such as the mispositioning level, the probability of gauge failure, and the number of gauges on the optimal strain gauge position.