• Electrical & Electronic Materials
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• v.8 no.2
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• pp.204-210
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• 1995

The characteristics of the internal circuits and the load capacitance should be included to optimize the size of BiCMOS buffer. In order to get the optimum size and delay time of the BiCMOS buffer, new size plane is suggested. By using the size plane, the optimum characteristics of CMOS buffer according to the number of stages can be obtained. From this method, delaytime, .tau.$_{D}$, is obtained 2.39 nsec with $V_{\var}$=5V, $C_{L}$=5pF, W=30.mu.m and $A_{e}$=135.mu. $m^{2}$.>..>...>.

• Journal of electromagnetic engineering and science
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• v.15 no.4
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• pp.232-238
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• 2015

This work describes the development of a D-band (110-170 GHz) signal source based on a SiGe BiCMOS technology. This D-band signal source consists of a V-band (50-75 GHz) oscillator, a V-band amplifier, and a D-band frequency doubler. The V-band signal from the oscillator is amplified for power boost, and then the frequency is doubled for D-band signal generation. The V-band oscillator showed an output power of 2.7 dBm at 67.3 GHz. Including a buffer stage, it had a DC power consumption of 145 mW. The peak gain of the V-band amplifier was 10.9 dB, which was achieved at 64.0 GHz and consumed 110 mW of DC power. The active frequency doubler consumed 60 mW for D-band signal generation. The integrated D-band source exhibited a measured output oscillation frequency of 133.2 GHz with an output power of 3.1 dBm and a phase noise of -107.2 dBc/Hz at 10 MHz offset. The chip size is $900{\times}1,890{\mu}m^2$, including RF and DC pads.