• Title/Summary/Keyword: Beam Manufacturing Path

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Solid Freeform Fabrication of Metal Prototype Using Direct Metal Shaping Process (직접식 금속 적층공정을 이용한 금속 시제품 제작)

  • Kim, Jae-Do;Park, Jin-Yong;Cho, Myeong-Woo
    • Journal of the Korean Society for Precision Engineering
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    • v.17 no.10
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    • pp.56-62
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    • 2000
  • A fast and precise technique to make 3-dimensional object which is called direct metal shaping process is processed. It is very useful technique in design and inspection. Using this developed system, a solid object is made. In experiment, test parts are built by varying three factors, laser power, scan path, scan speed. This process used device, which is different from the widely used in rapid prototyping in that powder feeding device is used. Spraying powder directly at the focused laser beam and then three dimensional object is made by the deposit of melted metal powder. The optimum scanning path is found to be zigzag path, which had little thermal affection on base metal. As a result of these experiments, it was found that optimum scanning speed is 15mm/sec laser power is 50W. This constructed 3-dimensional object could be used in mold manufacturing directly.

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Development of a flexible composite based on vulcanized silicon casting with bismuth oxide and characterization of its radiation shielding effectiveness in diagnostic X-ray energy range and medium gamma-ray energies

  • Ibrahim Demirel;Haluk Yucel
    • Nuclear Engineering and Technology
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    • v.56 no.7
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    • pp.2570-2575
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    • 2024
  • The study aims to develop a novel, lead-free, flexible and lightweight composite shielding material against ionizing radiation. For this, it was used bismuth oxide (Bi2O3) in RTV-2 silicon matrix. The shielding tests were carried out in both diagnostic X-ray energies and intermediate gamma-ray energy range of up to 662 keV to determine the radiation attenuation properties of this material in terms of attenuation ratio, half value layer, tenth value layer, mean free path and lead equivalency of samples in weight of 30%, 40%, 50% in Bi2O3. In the diagnostic X-ray energy range, half value layer, tenth value layer and lead equivalency (in mm Pb) of the produced samples were measured at 80 and 100 kVp narrow beam conditions according to the requirements of EN IEC 61331-1 standard. The results show that lead equivalent values of the produced novel sheets was measured to be 0.16 mm Pb, corresponding to a 6 mm thickness of the flexible sample when it contains 30% wt. Bi2O3 in RTV matrix. The experimental findings for durability and flexibility also indicated that this new RTV-based flexible, lead -free shielding composite can be used safely for especially for manufacturing aprons, garments and thyroid guards used in mammography, radiology, nuclear medicine and dental applications in practice.

Laser-induced chemical vapor deposition of micro patterns for TFT-LCD circuit repair (레이저 국소증착을 이용한 TFT-LCD 회로수정 패턴제조)

  • Park Jong-Bok;Jeong Sungho;Kim Chang-Jae;Park Sang-Hyuck;Shin Pyung-Eun;Kang Hyoung-Shik
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.06a
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    • pp.657-662
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    • 2005
  • In this study, the deposition of micrometer-scale metallic interconnects on LCD glass for the repair of open-circuit type defects is investigated. Although there had been a few studies Since 1980 s for the deposition of metallic interconnects by laser-induced chemical vapor deposition, those studies mostly used continuous wave lasers. In this work, a third harmonic Nd:YLF laser (351nm) of high repetition rates, up to 10 KHz, was used as the illumination source and $W(CO)_6$ was selected as the precursor. General characteristics of the metal deposit (tungsten) such as height, width, morphology as well as electrical properties were examined for various process conditions. Height of the deposited tungsten lines ranged from 35 to 500 nm depending on laser power and scan speed while the width was controlled between $3\~50{\mu}$ using a slit placed in the beam path. The resistivity of the deposited tungsten lines was measured to be below 1 $O\cdot{\mu}m$, which is an acceptable value according to the manufacturing standard. The tungsten lines produced at high scan speed had good surface morphology with little particles around the patterns. Experimental results demonstrated that it is likely that the deposit forms through a hybrid process, namely through the combination of photolytic and pyrolytic mechanisms.

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Laser-induced chemical vapor deposition of tungsten micro patterns for TFT-LCD circuit repair (레이저 국소증착을 이용한 TFT-LCD회로 수정5 미세 텅스텐 패턴 제조)

  • Park Jong-Bok;Kim Chang-Jae;Park Sang-Hyuck;Shin Pyung-Eun;Kang Hyoung-Shik;Jeong Sung-Ho
    • Journal of the Korean Society for Precision Engineering
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    • v.22 no.8 s.173
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    • pp.165-173
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    • 2005
  • This paper presents the results for deposition of micrometer-scale metal lines on glass for the development of TFT-LCD circuit repair-system. Although there had been a few studies in the late 1980's for the deposition of metallic interconnects by laser-induced chemical vapor deposition, those studies mostly used continuous wave lasers. In this work, a third harmonic Nd:YLF laser (351nm) of high repetition rates, up to 10 KHz, was used as the illumination source and W(CO)s was selected as the precursor. General characteristics of the metal deposit (tungsten) such as height, width, morphology as well as electrical properties were examined for various process conditions. Height of the deposited tungsten lines ranged from 35 to 500 m depending on laser power and scan speed while the width was controlled between 50um using a slit placed in the beam path. The resistivity of the deposited tungsten lines was measured to be below $1{\Omega}{\cdotu}um$, which is an acceptable value according to the manufacturing standard. The tungsten lines produced at high scan speed had good surface morphology with little particles around the patterns. Experimental results demonstrated that it is likely that the deposit forms through a hybrid process, namely through the combination of photolytic and pyrolytic mechanisms.