• Journal of the Korean Geotechnical Society
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• 제37권11호
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• pp.37-49
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• 2021

Micropiles are widely used in construction field to enhance bearing capacity and reduce settlement of existing foundation. It has various benefits such as low construction expense, simple installation process, and small construction equipment. Recently, new microple equipped with the base expansion structure at the end has been developed to improve the foundation bearing capacity. The improvement of load capacity can be conceptually achieved by expanding the base expansion structure when a load is applied to the micropile. However, the expansion mechanism of the base expansion structure and the improvement of load capacity of the micropile were not yet experimentally validated. Therefore, in this study, a series of centrifuge model tests was performed to evaluate the effect of the base expansion structure on the improvement of load capacity. Two types of soil, sand and weathered rock, were prepared and the loading tests were performed using the real micropile with the base expansion structure. During the tests, the earth pressures surrounding the base expansion structure were monitored. As a result, when a load of 30 kN was applied to the micropile, the increase in the ratio of the horizontal to vertical pressure increment (∆σ_h/∆σ_𝜈) ranged from 0.4 to 0.58 in sand and ∆σ_h/∆σ_𝜈 = 0.19 in weathered rock, respectively. Therefore, it can be concluded that the increase in the horizontal earth pressure adjacent to the base expansion structure will improve the bearing capacity of the micropile.

• Journal of the Korean Geotechnical Society
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• 제37권2호
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• pp.19-31
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• 2021

Micropiles are cast-in-place piles with small diameters. The advantage of micropile is low construction expense and simple procedures, so it is widely applied to existing buildings and structures for the reinforcement of foundation and seismic performances. The base expansion structure has been developed following the original mechanism of horizontal expansion steps under compressive loading. This kind of structure can be installed at the pile end to improve the bearing capacity by tip area enlargement and horizontal force increment to the pile surface area. However, 'Micropile with base expansion structure' cannot be put into practical use, because detailed verification for the developed technique has not been conducted so far. In this research, 3-D numerical analysis was conducted to figure out the bearing mechanism of base expansion micropile and to verify the bearing capacity improvement compared to the general micropiles. 3-D modelling of micropile with base expansion structure was carried out and input parameter was determined. Bearing mechanism induced by base expansion structure was analyzed by lab-scale modelling, and bearing capacity improvement was verified by field-scale analysis.

• Journal of the Korean Geotechnical Society
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• 제38권9호
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• pp.53-67
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• 2022

Micropiles are cast-in-place-type piles with small diameters. They are widely used for the foundation reinforcement of existing buildings and structures because this technique is easy to construct and economic. A base expansion structure is developed following the mechanism of radial expansion at the pile tip under compression. Numerical analysis, durability tests, and centrifuge tests have been conducted using the base expansion structure. In this study, three-dimensional numerical modeling was performed to describe the behavioral mechanism of the base expansion structure using steel bar penetration under compressive loading, and numerical analyses using centrifuge test conditions were performed for the comparative studies. Additionally, the base structure was modified based on the results of lab-scale analyses, and the bearing capacities of micropiles were compared using field-scale numerical analyses under various ground conditions.

• Journal of the Korean Geotechnical Society
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• 제39권4호
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• pp.31-44
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• 2023

A base expansion micropile was developed to improve the bearing capacity of the micropile, which bears a simple device installed at the pile base. Under an axial load, this base expansion structure radially expands at the pile tip and attaches itself around ground, compressing the boring wall in the construction stage. In this study, conventional and base expansion micropiles were constructed in the weathered rock where micropiles are commonly installed. Further, field load tests were conducted to verify the bearing capacity enhancement effect. From the load test results, it was revealed that the shaft resistance of base expansion micropiles was about 12% higher than that of conventional micropiles. The load transfer analysis results also showed that compared to conventional micropiles, the unit skin friction and unit end bearing of base expansion micropiles were 15.4% and 315.1% higher, respectively, in the bearing zone of the micropile.

• The Transactions of the Korean Institute of Electrical Engineers A
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• 제48권6호
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• pp.800-806
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• 1999

This paper proposes IIKBAG(Intelligent Interlocking Knowledge Base Generator) which can build automatically the interlocking knowledge base utilized as the real-time interlocking strategy of the electronic interlocking system in order to enhance it's reliability and expansion. The IIKBAG consists of the inference engine and the knowledge base. The former has an auto-learning function which searches all the train routes for the given station model based on heuristic search technique while dynamically searching the model, and then generates automatically the interlocking patterns obtained from the interlocking relations of signal facilities on the routes. The latter is designed as the structure which the real-time expert system embedded on IS(Interlocking System) can use directly in order to enhances the reliability and accuracy. The IIKBAG is implemented in C computer language for the purpose of the build and interface of the station structure database. And, a typical station model is simulated to prove the validity of the proposed IIKBAG.

• Journal of the East Asian Society of Dietary Life
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• 제25권6호
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• pp.1029-1040
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• 2015

Effects of punching and drying process on quality of Yukwa were determined. Lightness (L) of Yukwa dough with punching was higher than that with no punching. Air cell distribution of Yukwa dough was fine with higher punching. Microstructure of Yukwa dough showed a broken surface structure with increasing punching. Hardness and adhesiveness of Yukwa dough decreased after 5 min of punching and then increased with higher punching. Expansion ratio of Yukwa base with punching at 155 rpm for 5 min was highest among the samples. Appearance of Yukwa base with no punching showed a poor shape and cross section, whereas Yukwa base with punching at 95 rpm for 10 min showed the best appearance and cross section and Yukwa base with punching at 155 rpm for 5 min also showed good appearance. The moisture content of Yukwa Bandegi after 24 hr of drying was 14.93%. Microstructure of Yukwa Bandegi showed a broken surface structure and empty spaces with increased drying time. Expansion ratio of Yukwa base with 24 hr of drying at $40^{\circ}C$ was highest among the samples. Overall, optimum punching conditions were 10 min of punching at 95 rpm or 5 min of punching at 155 rpm and optimum drying condition was 24 hr of drying at $40^{\circ}C$.

• The Bulletin of The Korean Astronomical Society
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• 제46권1호
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• pp.38.3-38.3
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• 2021

We are developing an optomechanical design of infrared telescope for the CubeSat and Unmanned Aerial Vehicle (UAV) which adapts the Linear Astigmatism Free- Three Mirror System in the confocal off-axis condition. The small entrance pupil (diameter of 40 mm) and the fast telescope (f-number of 1.9) can survey large areas. The telescope structure consists of three mirror modules and a sensor module, which are assembled on the base frame. The mirror structure has duplex layers to minimize a surface deformation and physical size of a mirror mount. All the optomechanical parts and three freeform mirrors are made from the same material, i.e., aluminum 6061-T6. The Coefficient of Thermal Expansion matching single material structure makes the imaging performance to be independent of the thermal expansion. We investigated structural characteristics against external loads through Finite Element Analysis. We confirmed the mirror surface distortion by the gravity and screw tightening, and the overall contraction/expansion following the external temperature environment change (from -30℃ to +30℃).

• Geomechanics and Engineering
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• 제32권4호
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• pp.375-385
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• 2023

There are many joint fissures distributed in the engineering rock mass. In the process of geological history, the underground rock mass undergoes strong geological processes, and undergoes complex geological processes such as fracture breeding, expansion, recementation, and re-expansion. In this paper, the damage-stick-slip process (DSSP), an analysis model used for rock mass failure slip, was established to examine the master control and time-dependent mechanical properties of the new and primary fractures of a multi-fractured rock mass under the action of stress loading. The experimental system for the recemented multi-fractured rock mass was developed to validate the above theory. First, a rock mass failure test was conducted. Then, the failure stress state was kept constant, and the fractured rock mass was grouted and cemented. A secondary loading was applied until the grouted mass reached the intended strength to investigate the bearing capacity of the recemented multi-fractured rock mass, and an acoustic emission (AE) system was used to monitor AE events and the update of damage energy. The results show that the initial fracture angle and direction had a significant effect on the re-failure process of the cement rock mass; Compared with the monitoring results of the acoustic emission (AE) measurements, the master control surface, key blocks and other control factors in the multi-fractured rock mass were obtained; The triangular shaped block in rock mass plays an important role in the stress and displacement change of multi-fracture rock mass and the long fissure and the fractures with close fracture tip are easier to activate, and the position where the longer fractures intersect with the smaller fractures is easier to generate new fractures. The results are of great significance to a multi-block structure, which affects the safety of underground coal mining.

• Journal of the Korea Computer Industry Society
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• 제4권10호
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• pp.587-598
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• 2003

This paper construct two-level word similarity relation matrices about title and to scientific treatise. As guide keyword similarity relation matrices which is constructed to co-occurrence frequency base same time keeps recall rater by query expansion by tolerance relation, it is index structure to improve the precision rate by two-level contents base retrieval. Therefore, draw area knowledge through subject analysis and reasoned user's information request and area knowledge to fuzzy logic base. This research is research to improve vocabulary mismatch problem and information expression having essentially on query.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 한국전기전자재료학회 2002년도 하계학술대회 논문집
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• pp.32-35
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• 2002

The work focuses on the development of a Cu lead-frame with a single-sided adhesive tape for cost reduction and reliability improvement of LOC (lead on chip) package products, which are widely used for the plastic-encapsulation of memory chips. Most of memory chips are assembled by the LOC packaging process where the top surface of the chip is directly attached to the area of the lead-frame with a double-sided adhesive tape. However, since the lower adhesive layer of the double-sided adhesive tape reveals the disparity in the coefficient of thermal expansion from the silicon chip by more than 20 times, it often causes thermal displacement-induced damage of the IC pattern on the active chip surface during the reliability test. So, in order to solve these problems, in the resent work, the double-sided adhesive tape is replaced by a single-sided adhesive tape. The single-sided adhesive tape does net include the lower adhesive layer but instead, uses adhesive materials, which are filled in clear holes of the base film, just for the attachment of the lead-frame to the top surface of the memory chip. Since thermal expansion of the adhesive materials can be accommodated by the base film, memory product packaged using the lead-flame with the single-sided adhesive tape is shown to have much improved reliability. Author allied this invention to the Korea Patent Office for a patent (4-2000-00097-9).