• Journal of the Microelectronics and Packaging Society
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• v.11 no.1
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• pp.77-85
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• 2004

To evaluate the effect of plasma cleaning on the soldering reliability the plasma cleaning using Ar-10vol%$H_2$ gas was applied on a UBM(Under Bump Metallization). The UBM consisted of Au/ Cu/ Ni/ Al layers which were deposited on a Si-wafer with 20 nm/ 4 $\mu\textrm{m}$/ 4 $\mu\textrm{m}$/ 0.4 $\mu\textrm{m}$ thickness respectively. Sn-3.5%Ag, Sn-3.5%Ag-0.7%Cu and Sn-37%Pb solder balls sized of 500 $\mu\textrm{m}$ in diameter were used. Solder balls on the UBM were plasma reflowed under Ar-10%$H_2$ plasma (with or without plasma cleaning). They were compared with air reflowed solder balls with flux. The spreading ratios of plasma reflowed solder with plasma cleaning was 20-40% higher than that of plasma reflowed solder without plasma cleaning. The shear strength of plasma reflowed solder with plasma cleaning was about 58-65MPa. It showed 60-80% higher than that of plasma reflowed solder without plasma cleaning and 15-35% higher than that of air reflowed solder. Thus it was believed that plasma cleaning for the UBM using Ar-10vol%$H_2$ gas was considerably effective for the improvement of the strength of solder ball.

• The Journal of Korean Physical Therapy
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• v.14 no.4
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• pp.172-182
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• 2002

Objectives: We did research in the cause of the Pitchers' injury and their recovery process to make a detailed injury list for the purpose of finding the cause of the Korean professional pitchers' injury and its classification. We drew the conclusion through the results as following. Methods: We posed a question to the 80 pitchers playing in the first team of the eight Korean professional baseball team and analyzed the 62 pieces of question paper except the paper having a mistake. We used SAS/PC statistical package in analyzing the data. Results: In the frequency of the pitchers' shoulder injury in the last three years, the injured of all the players were 61.3$\%$ and the injury free players were 28.7$\%$. The cause of the injury was 45.2$\%$ wrong pitching motion, which was the highest value. For the shape of a pain when injured, the reverberation ache feeling when he is hit in the weight commanded an absolute majority as 19.4$\%$. Those who had muscular pain were 17.7$\%$, which was felt mostly at the pitching motion. The most trouble name of the injured shoulder was bicepstendinitis as 16.1$\%$ while the injury of shoulder joint was the lowest as 1.6$\%$. As the most widely used treatment, 25.8 percent of all the players had taken an electronical thraphy after injury. 14.5 percent of the players who had an injury to the shoulder told that they have an operation and 85 percent of them didn't. As a sort of the operation, a repairing of labrum was 44.4 percent, which is the highest value and the 77.8 percent pitchers are performing a normal pitching through rehabilitation after the operation and 22.2 percent of them are undergoing rehabilitation training. Conclusion: The research have shown that the main cause of the injury, concerning the Korean professional pitchers throwing lots of ball in both matches and practices, is overuse syndrome, bad mechanism, muscle weakness and instability of balance. I think that the role of trainer, physical therapy, and team physician taking charge of the players' injury must learn physical test method by heart exactly to check up the state of the injury definitely at the initial phase. Moreover, when the cause of the injury part after a close examination is discovered, the scientific and good surgery is essential to the rehabilitation success and making a classification of shoulder instability is useful to make a operation plan as well as the players' rehabilitation, treatment.

• Korean Journal of Applied Biomechanics
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• v.19 no.1
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• pp.149-157
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• 2009

The purpose of this project was to determine biomechanical differences between Type A(Korean brand) and Type B(world top brand) badminton shoes and to make recommendations to improve the fit and function of Type A badminton shoes. Measurements of shoe shape and dimensions, foot movement within the shoe, cushioning of ground reaction forces, in-shoe pressure and outsole traction were performed. In addition, subjective feedback of the fit and function of the shoes was quantified for 17 recreational badminton players. Type A shoe had a much higher heel and shallower heel cup, so the heel was not secured well in the shoe and the ankle joint was higher off the ground. Foot slippage was up to 40% greater in Type A shoe than Type B shoe. Impact forces and peak pressures under the foot were generally higher with Type A shoe compared to Type B shoe. The flexion axis of Type A shoe occurred in the midfoot, not at the ball of the foot like Type B shoe, where you would want the shoe flexion to occur. In summary, there are several characteristics where A Type shoe and B Type differ. Therefore, a few recommendations are provided to help improve the fit and function of A Type shoe.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.3
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• pp.11-17
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• 2009

The drop impact reliability comes to be important for evaluation of the life time of mobile electronic products such as cellular phone. The drop impact reliability of solder joint is generally affected by the kinds of pad and reflow number, therefore, the reliability evaluation is needed. Drop impact test proposed by JEDEC has been used as a standard method, however, which requires high cost and long time. The drop impact reliability can be indirectly evaluated by using high speed shear test of solder joints. Solder joints formed on 3 kinds of surface finishes OSP (Organic Solderability Preservation), ENIG (Electroless Nickel Immersion Gold) and ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) was investigated. The shear strength was analysed with the morphology change of intermetallic compound (IMC) layer according to reflow number. The layer thickness of IMC was increased with the increase of reflow number, which resulted in the decrease of the high speed shear strength and impact energy. The order of the high speed shear strength and impact energy was ENEPIG > ENIG > OSP after the 1st reflow, and ENEPIG > OSP > ENIG after 8th reflow.