• Journal of Drive and Control
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• v.11 no.4
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• pp.25-31
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• 2014

This paper details application of a DLC(Diamond Like Carbon)-coating to the swash plate and the ball joint of pistons that make sliding contact with the piston shoes of an axial piston pump. This process, aimed to reduce the frictional and leakage power losses of the hydrostatic piston shoe bearings at the low speed range. At lower speeds than 100rpm, the positive effects of the DLC-coating on the power loss reduction of the hydrostatic piston shoe bearings could be confirmed. These effects resulted in little improvement in volumetric efficiency of the test pump, but the mechanical efficiency could be raised by up to 5% at 100rpm; here, the DLC-coated swash plate played a more dominant role than the DLC-coated ball joint.

• Journal of Welding and Joining
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• v.17 no.3
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• pp.90-95
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• 1999

The increase in high speed, multi-function and high I/O pin semiconductor devices highly demands high pin count, very thin, and high density packages. BGA is one of the solutions, but the package has demerits in package reliability, surface mounting problems due to the PCB warpage and solder joint crack related with TCE mismatch between the materials. On this study to verify the thermal fatigue lifetime of the solder joint FEM and experiments were performed after surface mounting BGA with different solder composition and reliability conditions. FEM showed optimum composition of Ag3.2-Sn96.5 and under the composition minimum creep deformation of the solder joint was calculated, and the thermal fatigue lifetime was improved. In view of temperature cycle condition, the conditions of $-65^{\circ}C$to $150^{\circ}C$ showed minimum lifetime and t was 1/3 of $0^{\circ}C$ to $125^{\circ}C$ condition. Test board was prepared and solder joint crack was verified. Until 1000cycle on soder joint crack was observed.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.1
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• pp.55-61
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• 2010

An impact bending test method was used to evaluate the reliability for the solder joint of lead-free solder ball. In order to standardize the test method, the four point impact bending test was applied under the conditions of various frequencies and amounts of +/-amplitude respectively. Effects on the results were analysed. The optimum condition for impact bending test achieved in this study was the frequency of 10 Hz, and the amplitude of (+12/-1)~(+15/-1). 3 kinds of surface finishes Cu-OSP (Organic Solderability Preservative), ENIG (Electroless Nickel Immersion Gold), and ENEPIG (Electroless Nickel, Electroless Palladium, Immersion Gold) were used. Fracture surface showed that cracks were initiated and fractured along the intermetallic layer in the case of surface finishes of Cu-OSP and ENIG, while in the case of ENEPIG the cracks were initiated and propagated in the solder region.

• Transactions of the Korean Society of Mechanical Engineers
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• v.12 no.3
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• pp.426-439
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• 1988

Dynamic properties such as stiffness and damping of mechanical joints are essential for the accurate prediction of the dynamic behaviors of the system and subsequent improvement of the design. So far several techniques, analytical, experimental, or both have been developed. A technique using condensed F.E.M. model and Experimental Modal Analysis is presented to identify the joint structural parameters. First, modal parameters of structure are measured by certain complex frequency obtained from experiment to match with the order of the Experimental Modal Analysis model. Finally by equating the modal parameters obtained from experiment with those of the condensed system, the unknown joint structural parameters can be identified. A simulation study is conducted to investigate the accuracy of technique. The experiments are performed with ball bearings in a rotor bearing system.

• Transactions of the Korean Society of Mechanical Engineers
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• v.18 no.9
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• pp.2234-2244
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• 1994

A process sequence of multi-operation cold forging for actual application in industry is designed with the rigid-plastic finite element method to form a constant velocity joint housing(CVJ housing). The material flow during the CVJ housing forming is axisymmetric until the final forging process for forming of ball grooves. This study treats the deformation as an axisymmetric case. The main objective of the process sequence design is to obtain preforms which satisfy the design criteria of near-net-shape product requiring less machining after forming. The process sequence design also investigates velocity distributions, effective strain distributions and forging loads, which are useful information in the real process design.

• Korean Journal of Computational Design and Engineering
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• v.13 no.3
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• pp.200-208
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• 2008

Total Hip Replacement(THR) is a surgical procedure that replaces a diseased hip joint with a prosthesis. A plastic or metal cup forms the socket, and the head of the femur is replaced by a metal ball on a stem placed inside the femur. Due to the various types and shapes of human hip joint of every individual, a selected commercial implant sometimes may not be the best-fit to a patient, or it cannot be applied because of its discrepancy. Hence extracting geometry parameters of hip joint is one of the most crucial processes in designing custom-made implants. This paper describes the framework of a methodology to extract the geometric parameters of the hip joint. The parameters include anatomical axis, femoral head, head offset length, femoral neck, neck shaft angle, anteversion, acetabulum, and canal flare index. The proposed system automatically recommends the size and shape of a custom-made hip implant with respect to the patient's individual anatomy from 3D models of hip structures. The proposed procedure creating these custom-made implants with some typical examples is precisely presented and discussed in this paper.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2006.05a
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• pp.399-402
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• 2006

The outer race of CV(constant velocity) joint is an important load-supporting automotive part, which transmits torque between the transmission gear box and driving wheel. The outer race is difficult to forge because its shape is very complicated and the required dimensional tolerances are very small. Traditional warm and cold forging methods have their own limitations to produce such a complex shaped part; warm forging requires complex system with relatively higher manufacturing cost, while cold forging is not applicable to materials with limited formability. Therefore, multistage forging may be advantageous to produce complex shaped parts. In order to build a multistage forging system, it is necessary to characterize mechanical properties in response to system design parameters such as temperature, forging speed and reduction. For the analysis of formability of multistage forging process, finite element method(FEM) has been used for the process analysis. As a model case, a constant velocity (CV) joint forging process is analyzed by FEM, since CV joint has a complex shape and also its required dimensional tolerances are very tight. The data acquired by FEM is compared with operational forging data obtained from an industrial production line. Based on this comparative analysis, multistage forging process for CV joints is proposed.

• The Journal of Korea Robotics Society
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• v.8 no.1
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• pp.8-19
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• 2013

One of the important issues for structural and electrical specifications in developing a robot is to determine lengths of links and motor specifications, which need to be appropriate to the purpose of robot. These issues become more critical for a gait rehabilitation robot, since a patient wears the robot. Prior to developing an entire gait rehabilitation robot, designing of a 1DOF assistive knee joint of the robot is considered in this paper. Human gait motions were used to determine an allowable range of knee joint that was rotated with a linear type actuator (ball-screw type) and links. The lengths of each link were determined by using an optimization process, minimizing the stroke of actuator and the total energy (kinetic and potential energy). Kinetic analysis was performed in order to determine maximum rotational speed and maximum torque of the motor for tracking gait trajectory properly. The prototype of 1 DOF assistive knee joint was built and examined with a impedance controller.

• Journal of Ocean Engineering and Technology
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• v.26 no.5
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• pp.18-24
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• 2012

This paper concerned with the behaviour of shaping formation and the erection for SCST structure by cable-tensioning for three kinds of structure models. The joint types of experimental models are ball type joints, bolt type joints with gusset plates, and bolt type joints. The feasibility of the proposed shaping method and the reliability of the established geometric model were confirmed with a nonlinear finite element analysis and an experimental investigation for full size scaled pyramid test model and three kinds of SCST structure models. The characteristic of the behaviour of each joint type is shown in the shaping test for practical design purposes. As a results, the behaviour characteristics of joints is very significant in shaping analysis of space structures. So the joint type should be considered in the design and analysis of the shape formation for space structures. Also, in the special field condition, it could be a fast and economical method for constructing the space structure.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.3
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• pp.45-52
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• 2011

It is known that test methods to evaluate solder joint reliability are die shock test, die shear test, 3points bending test, and thermal shock test. The present study investigated the effects of failure mode on 3 types (as-reflowed, $85^{\circ}C$/85%RH treatment, and $150^{\circ}C$/10hr aging) of solder joints for flip-chip BGA package by using various test methods. The test methods and configurations are reported in detail, i.e. die shock, die shear, 3points bending, and thermal shock test. We focus on the failure mode of solder joints under various tests. The test results indicate that die shock and die shear test method can reveal brittle fracture in flip-chip ball grid array (FCBGA) packages with higher sensitivity.