• Proceedings of the KSME Conference
• /
• 2005.11a
• /
• pp.42.1-42.1
• /
• 2005

• Journal of the Korean Vacuum Society
• /
• v.21 no.6
• /
• pp.287-294
• /
• 2012

In the high vacuum condition of the space, outgassing from any assembly of satellite can contaminate satellites, especially second surface mirror and optical lens, it cause satellite to fail in own missions. Therefore, all unit shall be check for compatibility with vacuum using CVCM (Collected Volatile Condensable Material) and TML (Total Mass Loss) in advance. CVCM and TML of the PZT-5 piezoelectric ceramic vibrator has less than 0.1% and 1.0% respectively. Also, it has less than 500 $ng/cm^2/hr$ of Thermoelectric Quartz Crystal Microbalance for vacuum bake-out test using high temperature(more than $80^{\circ}C$) and high vacuum (less than $5.0{\times}10^{-3}$ Pa). Thus, piezoelectric ceramic vibrator may be employed in the vacuum environments. Finally, it can be confirmed that the characteristics change of the piezoelectric ceramic vibrator is less than 1% under vacuum environments.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2001.04a
• /
• pp.566-569
• /
• 2001

Hot Plate is the major unit that it used to remove damp of wafer surface, to strength adhesion of photoresist(PR) and to bake coated PR in FAB process of semiconductor. It is necessary to guarantee the performance of Hot Plate(HP). Therefore, in this study designed and developed the reliability system of HP to measure and estimated thermal uniformity and flatness in temperature setting amplitude $0~250^{\circ}C$. We developed the techniques that measures and analyzes thermal uniformity using infrared thermal vision, and compensates measuring error of flatness using laser displacement sensor. For measuring flatness, we specially makes the measurement stage of 3 axes which adopts the precision encoder. The allowable error of measuring technique is less than thermal uniformity, $\pm 0.1^{\circ}C$ and flatness, $\pm 1mm$. It is expected that the developed system can measure from $\Phi$210(wafer 8") to $\Phi$356(wafer 12") and also can be used in performance test of the Cool Plate and industrial heater, etc.

• Land and Housing Review
• /
• v.6 no.4
• /
• pp.231-237
• /
• 2015

Recently, It has been much interest in modular housing construction. so, The purpose of this study was to investigate the characteristics of the indoor air quality in modular mock-up housing. We measured indoor air quality(formaldehyde, benzene, toluene, ethylbenzene, xylene, styrene) of two modular mock-up units that built-in furniture is installed and uninstalled. As a result, the pollutants of built-in furniture installed unit were emitted more than built-in furniture uninstalled unit. But after bake-out and ventilation, emission concentrations of two modular mock-up units were similar and were below Indoor Air Quality recommendation standards. Built-in furniture is likely to affect the emission concentration of toluene

• Journal of the Korean Society for Precision Engineering
• /
• v.19 no.8
• /
• pp.180-186
• /
• 2002

Hot Plate is the major unit that it used to remove damp of wafer surface, to strength adhesion of photoresist (PR) and to bake coated PR in FAB process of semiconductor. The badness of Hot Plate (HP) has directly influence upon the performance of wafer, it is necessary to guarantee the performance of HP. In this study, a reliability evaluation system has been designed and developed, which is to measure and to estimate thermal uniformity and flatness of HP in range of temperature 0~$250^\circC$. This system has included the techniques which measures and analyzes thermal uniformity using infrared thermal vision, and which compensates measuring error of flatness using laser displacement sensor For measuring flatness, a measurement stage of 3 axes are developed which adapts the precision encoder. The allowable error of this system in respect of thermal uniformity is less $than\pm0.1^\circC$ and in respect of flatness is less $than\pm$1mm . It is expected that the developed system can measure from $\Phi200mm\;(wafer 8＂)\;to\;\Phi300mm$ (wafer 12＂) and also can be used in performance test of the Cool Plate and industrial heater, etc.