• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.318.2-318.2
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• 2014

The high contact resistance is still one of the major issues to be resolved in CdS/CdTe thin film solar cells. CdTe/Metal Schottky contact induced a high contact resistance in CdS/CdTe solar cells. It has been reported that the work function of CdTe thin film is more than 5.7 eV. There has not been a suitable back contact metal, because CdTe thin film has a high work function. In a few decades, some buffer layer was reported to improve a back contact problem. Buffer layers which are Te, $Sb_2Te_3$, $Cu_2Te$, ZnTe:Cu and so on was inserted between CdTe and metal electrode. A formed buffer layers made a tunnel junction. Hole carriers which was excited in CdTe film by light absorption was transported from CdTe to back metal electrode. In this report, we reported the variation of solar cell performance with different buffer layer at the back contact of CdTe thin film solar cell.

• 한국신재생에너지학회:학술대회논문집
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• 2010.11a
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• pp.53.2-53.2
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• 2010

In this study, we focused on our specialized electrode process for Si back-contact crystalline solar cell. It is different from other well-known back-contact cell process for thermal aspect and specialized process. In general, aluminum makes ohmic contact to the Si wafer and acts as a back surface reflector. And, silver is used for low series resistance metal grid lines. Aluminum was sputtered onto back side of wafer. Next, silver is directly patterned on the wafer by screen printing. The sputtered aluminum was removed by wet etching process after rear silver electrode was formed. In this process, the silver paste must have good printability, electrical property and adhesion strength, before and after the aluminum etching process. Silver paste also needs low temperature firing characteristics to reduce the thermal budget. So it was seriously collected by the products of several company of regarding low temperature firing (below $250^{\circ}C$) and aluminum etching endurance. First of all, silver pastes for etching selectivity were selected to evaluate as low temperature firing condition, electrical properties and adhesive strength. Using the nano- and micron-sized silver paste, so called hybrid type, made low temperature firing. So we could minimize the thermal budget in metallization process. Also the adhesion property greatly depended on the composition of paste, especially added resin and inorganic additives. In this paper, we will show that the metallization process of back-contact solar cell was realized as optimized nano-paste characteristics.

• New & Renewable Energy
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• v.4 no.2
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• pp.74-80
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• 2008

To improve the blue responses of screen-printed single crystalline silicon solar cells, we investigated an emitter etch-back technique to obtain high emitter sheet resistances, where the defective dead layer on the emitter surface was etched and became thinner as the etch-back time increased, resulting in the monotonous increase of short circuit current and open circuit voltage. We found that an optimal etch-back time should be determined to achieve the maximal performance enhancement because of fill factor decrease due to a series resistance increment mainly affected by contact and lateral resistance in this case. To elucidate the reason for the fill factor decrease, we studied the resistance analysis by potential mapping to determine the contact and the lateral series resistance. As a result, we found that the fill factor decrease was attributed to the relatively fast increase of contact resistance due to the dead layer thinning down with the lowest contact resistivity when the emitter was contacted with screen-printed silver electrode.

• 한국신재생에너지학회:학술대회논문집
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• 2008.05a
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• pp.390-393
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• 2008

To improve the blue responses of screen-printed single crystalline silicon solar cells, we investigated an emitter etch-back technique to obtain high emitter sheet resistances, where the defective dead layer on the emitter surface was etched and became thinner as the etch-back time increased, resulting in the monotonous increase of short circuit current and open circuit voltage. We found that an optimal etch-back time should be determined to achieve the maximal performance enhancement because of fill factor decrease due to a series resistance increment mainly affected by contact and lateral resistance in this case. To elucidate the reason for the fill factor decrease, we studied the resistance analysis by potential mapping to determine the contact and the lateral series resistance. As a result, we found that the fill factor decrease was attributed to the relatively fast increase of contact resistance due to the dead layer thinning down with the lowest contact resistivity when the emitter was contacted with screen-printed silver electrode.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.5
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• pp.15-21
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• 2004

In this paper a new structure of BJT is proposed to improve the saturation voltage characteristics so that it can be used to the low power switching devices. In the case of the conventional finger transistor(FT), the saturation voltage is so high that it dose not satisfy the requirements for the low power device. So the other multi base island transistor(MBIT) is suggested and its saturation voltage is so low in the region of low current that it satisfy the requirement for the low power switching devices, but in region of the high current the saturation voltage tends to increase so that it does not satisfy the requirements for the low power switching devices. So in this paper a new structure of folded back electrode transistor(FBET) is proposed and the characteristics is investigated. When the new structure is applied the emitter area is increased by 35 % so the saturation voltage is reduced by 30 % at the low current region and the contact area is increased by 92 % so the saturation voltage is reduced by totally f % at the high current region with the reduction of 30 % by the increase of the emitter area and the reduction of 7 % by the increase of the emitter contact area.

• Archives of Metallurgy and Materials
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• v.65 no.3
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• pp.989-992
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• 2020

In this study, glass frit was coated uniformly on the surface of Al particles instead of adding glass frit to Al powder by simple mixing to form a nano-layer. The influence of the glass-frit coating on the formation of the back-surface field and electrical characteristics of the resulting Al electrode were investigated. Microstructural observations indicated that the glass components were uniformly distributed and the back-surface field layer thickness was more uniform compared to the simply mixed sample. In addition, the sheet resistance was <10 mΩ/□, much lower than the 23 mΩ/□ of the simply mixed Al electrode.

• 한국태양에너지학회:학술대회논문집
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• 2011.11a
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• pp.34-39
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• 2011

Screen printing method is a common way to fabricate the crystalline silicon solar cell with low-cost and high-efficiency. The screen printing metallization use silver paste and aluminum paste for front and rear contact, respectively. Especially the rear contact between aluminum and silicon is important to form the back surface filed (Al-BSF) after firing process. BSF plays an important role to reduces the surface recombination due to $p^+$ doping of back surface. However, Al electrode on back surface leads to bow occurring by differences in coefficient of thermal expansion of the aluminum and silicon. In this paper, we studied the properties of mono crystalline silicon solar cell for rear electrode with aluminum and aluminum-boron in order to characterize bow and BSF of each paste. The 156*156 $m^2$ p-type silicon wafers with $200{\mu}m$ thickness and 0.5-3 ${\Omega}\;cm$ resistivity were used after texturing, diffusion, and antireflection coating. The characteristics of solar cells was obtained by measuring vernier callipers, scanning electron microscope and light current-voltage. Solar cells with aluminum paste on the back surface were achieved with $V_{OC}$ = 0.618V, JSC = 35.49$mA/cm^2$, FF(Fill factor) = 78%, Efficiency = 17.13%.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.538-543
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• 2008

A roller with a shaft and hot oil paths for pressing electrodes of polymer batteries were modeled and analyzed by FEM. There are many hot oil tubes in the roller and shaft, through which $72^{\circ}C$ hot oil flows for heating the surface of a roller and shaft. Thermal deformations and temperatures distributions of the roller and shaft were calculated and a convection boundary condition on surfaces was used. The influence of existence of a groove in the shaft on the flatness of a roller surface caused by thermal deformation was investigated. In addition, the amount of spring-back of electrodes under vacuum pressure and heating was calculated after the hot rolling process. It was shown from this study that the groove in one shaft had a favorable effect on the surface flatness.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.30 no.6
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• pp.366-371
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• 2017

In this paper, we introduce an electrocardiogram (ECG) system designed to solve problems caused by wetgels and motion artifacts in measuring active movement. The system is called a dry-contact ECG and was designed by considering impedance matching between skin and electrode as well as the frictional electricity between electrode and clothes. In order to create the system, we measured impedance on the skin-electrode interface, and the result was applied to the electronic circuit scheme. Moreover, we added an electrode on the back of the measurement electrode to make a flow path to ground the electrical noise. The final ECG circuit and novel electrode were used to detect real human cardiac signals from a subject who was tested while standing still and walking. The signals obtained from the two activities were nicely shaped, without any motion artifact noise. We took electrode size into account in this study because the impedance depended on the area of the electrode. An electrode of 50 mm diameter showed the best curve for the ECG signal without any electrical noise.

• Korean Journal of Materials Research
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• v.20 no.8
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• pp.412-417
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• 2010

Mo thin films were used for the back electrode because of the low resistivity in the Mo/$CuInGaSe_2$ contact in chalcopyrite solar cells. $1\;{\mu}m$ thick Mo thin films were deposited on soda lime glass by varying the Ar pressure with the dc-magnetron sputtering process. The effects of the Ar pressure on the morphology of the Mo back electrode were studied and the relationships between the morphology and electro-optical properties, namely, the resistivity as well as the reflectance of the Mo thin films, were investigated. The resitivity increased from $24\;{\mu}{\Omega}{\cdot}cm$ to $11833\;{\mu}{\Omega}{\cdot}cm$; this was caused by the increased surface defect and low crystallinity as the Ar pressure increased from $3{\times}10^{-3}$ to $3{\times}10^{-2}\;Torr$. The surface morphologies of the Mo thin films changed from somewhat coarse fibrous structures to irregular and fine celled structures with increased surface cracks along the cell boundaries, as the Ar pressure increased from $3{\times}10^{-3}$ to $3{\times}10^{-2}\;Torr$. The changes of reflectances in the visible light range with Ar pressures were mainly attributed to the surface morphological changes of the Mo thin films. The reflectance in the visible light range showed the highest value of 45% at $3{\times}10^{-3}\;Torr$ and decreased to 18.5% at $3{\times}10^{-2}\;Torr$.