• Journal of Mechanical Science and Technology
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• v.16 no.12
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• pp.1664-1672
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• 2002

Gantry mechanisms have been widely used for precision manufacturing and material handling in electronics, nuclear, and automotive industries. Dual-drive servo mechanism is a way to increase control bandwidth, in which two primary axes aligned in parallel are synchronously driven by identical servo motors. With this mechanism, a flexible coupling (compliance mechanism) is often introduced in order to avoid the damage by the servo mismatch between the primary drives located at each side of gantry. This paper describes the design guidelines of the dual-drive servo mechanism with focus on its dynamic characteristics and control ramifications. That is, the effect on the system bandwidth which is critical on the system performance, the errors and torques exerted on guide ways in case of servo mismatch, the vibration characteristics concerned with dynamic error and settling time, and the driving force required at each axis for control are thoroughly investigated.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2001.04a
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• pp.275-280
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• 2001

Recently, the trends of industrial products grow more miniaturization, variety and mass production. Micro drilling which take high precision in cutting work is requested more micro hole and high speed working. Especially, Micro deep hole drilling is becoming more important in a wide spectrum of precision production industries, ranging from the production of automotive fuel injection nozzle, watch and camera parts, medical needles, and thick multi-layered Printed Circuit Boards(PCB) that are demanded for very high density electric circuitry. This paper shows the tool monitoring results of micro drill with tool dynamometer. And additionally, microscope with built-in monitor inspection show the relationship between burr in workpiece and chip form of micro drill machining.

• JSTS:Journal of Semiconductor Technology and Science
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• v.13 no.5
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• pp.451-458
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• 2013

This paper describes a design of LIN MCU using efficient memory accessing architecture which provides concurrent data and address fetch for faster communication. By using slew rate control it can reduce EMI emission while satisfying required communication specifications. To verify the efficiency of the LIN MCU, we developed a SoC and tested for several data packets. Measurements show that this LIN MCU improves network efficiency up to 17.19 % and response time up to 31.26 % for nominal cases. EMI radiation also can be reduced up to 10 dB.

• Journal of Power System Engineering
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• v.18 no.3
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• pp.87-92
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• 2014

This study is aimed at investigating the thermal behavior of immersion-cooled high power LED lighting engines. 3D CFD models have been generated for the numerical analysis. Five cases in terms of the configuration of LED chips have been explored for various passive cooling conditions of the lighting engine, i.e., the natural air convection with a lens, the natural air convection without a lens, the deionized water-immersion cooling condition with a lens. The numerical study reveals that the deionized water-immersion cooled lighting engine has nearly twice better thermal performance than the natural air convection cooled lighting engine containing a lens. The investigation has also demonstrated that the four chips configuration has the better thermal performance than the single chip configuration.

• International journal of advanced smart convergence
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• v.13 no.2
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• pp.25-34
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• 2024

The paper investigates how the semiconductor and electric vehicle industries are addressing safety and security concerns in the era of autonomous driving, emphasizing the prioritization of safety over security for market competitiveness. Collaboration between these sectors is deemed essential for maintaining competitiveness and value. The research suggests solutions such as advanced autonomous driving technologies and enhanced battery safety measures, with the integration of AI chips playing a pivotal role. However, challenges persist, including the limitations of big data and potential errors in semiconductor-related issues. Legacy automotive manufacturers are transitioning towards software-driven cars, leveraging artificial intelligence to mitigate risks associated with safety and security. Conflicting safety expectations and security concerns can lead to accidents, underscoring the continuous need for safety improvements. We analyzed the expansion of electric vehicles as a means to enhance safety within a framework of converging security concerns, with AI chips being instrumental in this process. Ultimately, the paper advocates for informed safety and security decisions to drive technological advancements in electric vehicles, ensuring significant strides in safety innovation.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.25 no.1
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• pp.35-38
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• 2015

LEDs are considered to be an alternative for enhancement of energy efficiency, applied for numerous areas such as display, automotive headlight not only lights. Yellow phosphor is generally utilized with blue LEDs to generate WLED, $Y_3Al_{5}O_{12}:Ce^{3+}$ is typically used as the yellow phosphor. The phosphor, mixed with epoxy resin, has been used by being spread and hardened on the blue LED chip. This paste-based packaging gives rise to problems of degradation of phosphor by heat and decrease of luminous efficiency. Although phosphor plate is used instead of the epoxy-phosphor mixture to solve these problems, loss of luminous efficacy by total internal reflection inside the plate also should be solved. In this study, we coated the side of the plate with silver as one of the solution.

• Journal of Welding and Joining
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• v.34 no.1
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• pp.26-34
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• 2016

Automotive today has been transforming to an electronic product by adopting a lot of convenience and safety features, suggesting that joining materials and their mechanical reliabilities are getting more important. In this study, a Sn-Cu-Cr-Ca solder composition having a high melting temperature ($>230^{\circ}C$) was fabricated and its joint properties and reliability was investigated with an aim to evaluate the suitability as a joining material for electronics of engine room. Furthermore, mechanical properties change under complex environment were compared with several existing solder compositions. As a result of contact angle measurement, favorable spreadability of 84% was shown and the average shear strength manufactured with corresponding composition solder paste was $1.9kg/mm^2$. Also, thermo-mechanical reliability by thermal shock and vibration test was compared with that of the representative high temperature solder materials such as Sn-3.5Ag, Sn-0.7Cu, and Sn-5.0Sb. In order to fabricate the test module, solder balls were made in joints with ENIG-finished BGA and then the BGA chip was reflowed on the OPS-finished PCB pattern. During the environmental tests, resistance change was continuously monitored and the joint strength was examined after tests. Sn-3.5Ag alloy exhibited the biggest degradation rate in resistance and shear stress and Sn-0.7Cu resulted in a relatively stable reliability against thermo-mechanical stress coming from thermal shock and vibration.

• Journal of the Computational Structural Engineering Institute of Korea
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• v.31 no.1
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• pp.17-21
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• 2018

The natural frequency of a laminated cantilever microbeam was studied in the present investigation. The microbeam was made of quartz on a silicon chip, and its top and bottom surfaces were coated with thin(~30nm) gold films. An ultrasonic testing platform was employed to resonate the microbeam, and its time domain signal was optically measured. The natural frequency was quantified through the fast Fourier transform of the waveform, and the result showed good agreement with a theoretical estimation from the classical beam theory. This study is expected to provide a dynamic evaluation technique for micro/nanoscale materials and micromechanical structures.

• Design & Manufacturing
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• v.8 no.2
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• pp.46-49
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• 2014

Silicone is recently used for LED chip lense due to its good thermal stability and optical transmittance. In order to predict residual stress which causes optical briefringence and mechanical warpage of silicone, finite element analysis was conducted for curing process during silicone molding. For analysis of curing process, a dynamic cure kinetics model was derived based on the differential scanning calorimetry(DSC) test and applied to the material properties for finite element analysis. Finite element simulation result showed that the slow cure reduced abrupt reaction heat and it was predicted decrease of the residual stress.

• Journal of the Korean Society of Safety
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• v.19 no.4 s.68
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• pp.135-140
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• 2004

Wear mechanisms may be briefly classified by mechanical, chemical and thermal wear. A plane strain finite element method is used with a new material stress and temperature fields to simulate orthogonal machining with continuous chip formation. Deformation of the workpiece material is healed as elastic-viscoplastic with isotropic strain hardening and the numerical solution accounts for coupling between plastic deformation and the temperature field, including treatment of temperature-dependent material properties. Effect of the uncertainty in the constitutive model on the distributions of strait stress and temperature around the shear zone are presented, and the model is validated by comparing average values of the predicted stress, strain, and temperature at the shear zone with experimental results.