• 제목/요약/키워드: Automatic Assembly Machine

검색결과 55건 처리시간 0.028초

NC선반의 직선 사이클 평면 위치결정 정도 측정에 관한 연구 (A Study on Measurement of Linear Cycle Plane Positioning Accuracy of NC Lathe)

  • 김영석;송인석;정정표;한지희;윤원주
    • 한국공작기계학회논문집
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    • 제12권2호
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    • pp.53-58
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    • 2003
  • It is very important to measure linear cycle plane positioning accuracy of NC lathe as it effects all other parts of machines machined by them in industries. If the plane positioning accuracy of NC lathe is bad, the dimension accuracy and the change-ability of works will be bad in the assembly of machine parts. In this paper, computer software systems are organized to measure linear cycle plane positioning displacement of ATC(Automatic tool changer) on zx plane of NC lathe using two linear scales. And each sets of error data obtained from the test is descriptions to plots and the results of linear cycle plane positioning errors are expressed as nutriments by computer treatment.

Automated machinability checking for sculptured surface manufacture

  • Kim, Kwangsoo;Ko, Byungchul
    • 한국경영과학회:학술대회논문집
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    • 대한산업공학회/한국경영과학회 1992년도 춘계공동학술대회 발표논문 및 초록집; 울산대학교, 울산; 01월 02일 May 1992
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    • pp.299-308
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    • 1992
  • Determining tool-approach directions is an important issue when an effort is made to transfer CAD data into manufacturing automatically. An algorithm is developed to determine whether a given part can be machined on a three-axis milling machine. lf a set of feasible tool-approach directions exists for a sculptured surface, the NC tool path and G-codes for machining the surface on a three-axis milling machine can be generated automatically by an NC tool path generation algorithm. The algorithm can be used for orientation and fixturing of the workpiece for interference free machining. The algorithm can also be applied to checking the translational separability of polyhedral parts in automatic assembly.

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NC 선반에서 직선 사이클 평면 위치결정 정도 측정 시스템의 구성 (The Organization of Measuring Systems of Linear Cycle Plane Positioning Accuracy on NC Lathes)

  • 김영석;김재열;송인석;곽이구;정정표;한지희
    • 한국공작기계학회:학술대회논문집
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    • 한국공작기계학회 2002년도 추계학술대회 논문집
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    • pp.387-392
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    • 2002
  • It is very important to measure linear cycle plane positioning accuracy of NC lathes as they affect those of all other machines machined by them in industries. For example, if the linear cycle plane positioning accuracy of each axes directions is bad, the accuracy of works will be wrong and the change-ability will be bad in the assembly of machine parts. In this paper, computer software systems are organized to measure linear displacements of ATC(Automatic tool changer) of NC lathes using linear scale and time pulses comming out from computer in order to get data at constant time intervals from the sensors. And each sets of error data gotten from the test is expressed to plots by computer treatment and the results of linear cycle plane positioning error motion estimated to numerics by statistical treatments.

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기상측정 및 CAM 자동화를 통한 금형 제작 공정 개선 (Improvement of machining process for mold parts using on-machine measuring system and CAM automation)

  • 박해웅;윤재웅;이춘규
    • Design & Manufacturing
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    • 제16권1호
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    • pp.21-26
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    • 2022
  • In the CNC machining process, problems such as lowering of machine operation rate, setting errors, and machining precision occur due to the increase in setting time and preparation time. These machining errors cause delays in delivery and increase in cost due to an increase in the number of mounting and dismounting of the workpiece, an increase in measurement and reprocessing time, and an increase in the finishing time in the assembly process. Therefore, in this study, by automating the setting of the work piece using OMV (On Machine Verification), which is a meteorological measurement system, the preparation time for machining the work piece and the setting accuracy were improved, the rework rate was reduced, and the mold manufacturing process was shortened. Through the advancement, standardzation, and automation of the mold part manufacturing process, we have improved productivity by minimizing low-value-added repetitive tasks. In addition, the measurement time was reduced by more than 50% and the machining measurement rate was improved by more than 20%, eliminating repetitive work for correcting machining defects, and reducing the work preparation time by more than 15% through automatic setting.

비전을 이용한 펀칭위치 제어 시스템 (Punching Position Control by Vision System)

  • 이성철;이영춘;심기중
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2004년도 추계학술대회 논문집
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    • pp.981-984
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    • 2004
  • This paper is about the development of Automatic FPC punching instrument. FPC(flexible printed circuit) is used to detect the contact position of K/B and button like a cellular phone. Depending on the quality of the printed ink and position of reference punching point to the FPC, the resistance and current are varied to the malfunctioning values. The size of reference punching point is 2mm and the above. Because the punching operation is done manually, the accuracy of the punching degree is varied with operator's condition. Recently, The punching accuracy has deteriorated severely to the 2mm punching reference hall so that assembly of the K/B has hardly done. To improve this manual punching operation to the FPC, automatic FPC punching system is introduced. Precise mechanical parts like a 5-step stepping motor and ball screw mechanism are designed and tested and low cost PC camera is used for the sake of cost down instead of using high quality vision systems for the FA. Test algorithm shows good results to the designed automatic punching system.

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지능적인 이형부품 인식과 비전 정렬 방법에 관한 연구 (A Study on the Intelligent Recognition of a Various Electronic Components and Alignment Method with Vision)

  • 신균섭;김종원
    • 반도체디스플레이기술학회지
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    • 제23권2호
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    • pp.1-5
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    • 2024
  • In the electronics industry, a lot of research and development is being conducted on electronic component supply, component alignment and insertion, and automation of soldering on the back side of the PCB for automatic PCB assembly. Additionally, as the use of electronic components increases in the automotive component field, there is a growing need to automate the alignment and insertion of components with leads such as transistors, coils, and fuses on PCB. In response to these demands, the types of PCB and parts used have been more various, and as this industrial trend, the quantity and placement of automation equipment that supplies, aligns, inserts, and solders components has become important in PCB manufacturing plants. It is also necessary to reduce the pre-setting time before using each automation equipment. In this study, we propose a method in which a vision system recognizes the type of component and simultaneously corrects alignment errors during the process of aligning and inserting various types of electronic components. The proposed method is effective in manufacturing various types of PCBs by minimizing the amount of automatic equipment inserted after alignment with the component supply device and omitting the preset process depending on the type of component supplied. Also the advantage of the proposed method is that the structure of the existing automatic insertion machine can be easily modified and utilized without major changes.

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반도체 소자용 자동 die bonding system의 개발 (Development of automatic die bonder system for semiconductor parts assembly)

  • 변증남;오상록;서일홍;유범재;안태영;김재옥
    • 제어로봇시스템학회:학술대회논문집
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    • 제어로봇시스템학회 1988년도 한국자동제어학술회의논문집(국내학술편); 한국전력공사연수원, 서울; 21-22 Oct. 1988
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    • pp.353-359
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    • 1988
  • In this paper, the design and implementation of a multi-processor based die bonder machine for the semiconductor will be described. This is a final research results carried out for two years from June, 1986 to July, 1988. The mechanical system consists of three subsystems such as bonding head module, wafer feeding module, and lead frame feeding module. The overall control system consists of the following three subsystems each of which employs a 16 bit microprocessor MC 68000 : (i) supervisory control system, (ii) visual recognition / inspection system and (iii) the display system. Specifically, the supervisory control system supervises the whole sequence of die bonder machine, performs a self-diagnostics while it controls the bonding head module according to the prespecified bonding cycle. The vision system recognizes the die to inspect the die quality and deviation / orientation of a die with respect to a reference position, while it controls the wafer feeding module. Finally, the display system performs a character display, image display ans various error messages to communicate with operator. Lead frame feeding module is controlled by this subsystem. It is reported that the proposed control system were applied to an engineering sample and tested in real-time, and the results are sucessful as an engineering sample phase.

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반도체 소자용 자동 Die Bonder 기계장치의 개발 (Development of Die Bonder Machine for Semiconductor Automatic Assembly)

  • 변증남;윤명중;오상록;오영석;서일홍;안태영;권구빈;김제옥;김정덕
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1987년도 전기.전자공학 학술대회 논문집(I)
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    • pp.284-287
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    • 1987
  • In this paper, the design and implementation of a multiprocessor based Die Bonder Machine for the semiconductor will be described. This the partial research result, that is, the 1st year portion of the project to be performed for a period of two years from June, 1986 to May, 1988. The mechanical system consists of the following three subsystems : (i) transfer head unit, (ii) die feeding XY-table unit, and (iii) plunge up unit. The overall control system is designed to be essentially a master-slave type in which each slave is functionally fixed in view of software and also the time shared common bus structure with hardwired bus arbitration scheme is utilized, the control system consists of the following three subsystems each of which employs a 16 bits microprocessor MC 68000 : (i) die bonder processor controller, (ii) visual recognition/inspection and display system, (iii) the servo control system. It is reported that the proposed control system were applied to Working Sample and tested in real system, and the results are successful as a working sample phase.

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로봇 매니퓰레이터의 자세 보정을 위한 카메라 모델링 (Camera Modeling for Kinematic Calibration of a Robot Manipulator)

  • 왕한흥;장영희;김종수;이종붕;한성연
    • 한국공작기계학회:학술대회논문집
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    • 한국공작기계학회 2002년도 춘계학술대회 논문집
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    • pp.179-183
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    • 2002
  • This paper presents a new approach to the calibration of a SCARA robot orientation with a camera modeling that accounts for major sources of camera distortion, namely, radial, decentering, and thin prism distortion. radial distortion causes an inward or outward displacement of a given Image point from its ideal location. Actual optical systems are subject to various degrees of decentering, that is, the optical centers of lens elements are not strictly collinear. Thin prism distortion arises from imperfection in lens design and manufacturing as well as camera assembly It is our purpose to develop the vision system for the pattern recognition and the automatic test of parts and to apply the line of manufacturing.

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뉴럴네트워크를 이용한 카메라 보정기법 개발 (Development of Camera Calibration Technique Using Neural-Network)

  • 장영희
    • 한국공작기계학회:학술대회논문집
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    • 한국공작기계학회 1997년도 추계학술대회 논문집
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    • pp.225-229
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    • 1997
  • This paper describes the camera calibration based-neural network with a camera modeling that accounts for major sources of camera distortion, namely, radial, decentering, and thin prism distortion. Radial distortion causes and inward or outward displacement of a given image point from its ideal location. Actual optical systems are subject to various degrees of decentering, that is, the optical centers of lens elements are not strictly collinear. Thin prism distortion arises from imperfection in lens design and manufacturing as well as camera assembly. It is our purpose to develop the vision system for the pattern recognition and the automatic test of parts and to apply the line of manufacturing. The performance of proposed camera calibration is illustrated by simulation and experiment.

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