• Title/Summary/Keyword: Auger depth profile

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Laser induced dry etching of GaAs (레이저유기에 의한 GaAs의 건식에칭)

  • Park, Se-Ki;Lee, Choen;Choi, Won-Chel;Kim, Moo-Sung;Min, Suk-Ki;Ahn, Byung-Sung
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1995.05a
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    • pp.58-61
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    • 1995
  • Instead of using CCl$_4$CCl$_2$F$_2$ gases, we used a alternative reaction gas of CFCs which we have developed, for the experiment of laser induced dry etching of laser induced dry etching of GaAs, and compared with the etch profile of a usual reation gas. Laser powers(power density) on the sample surface were varied from 100 mW(12.7 MW/$\textrm{cm}^2$) to 210mW(27 MW/$\textrm{cm}^2$) The laser beam was scanned over the sample by moving the cell with a speed raging from 8.3$\mu\textrm{m}$/sec and the gas pressure also was varied form 260 Torr to 760 Torr, High etching rates up to 136 $\mu\textrm{m}$/sec and an aspect ratio of 2.6 have been achieved by single scan of laser beam. The chemical compositions of the reaction products deposited on the etched groove were measured by Auger electron spectroscopy(AES) Etch profiles, including depth and width were observed by scanning electron microscopy(SEM)

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The properties and effects of the electrodeposited CdTe compound film on the porous silicon (다공질규소에 전착된 CdTe 화합물 박막의 특성과 효과)

  • 김영유;이춘우;류지욱;홍사용;박대규;육근철
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.9 no.1
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    • pp.89-93
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    • 1999
  • The properties and effects of the electrodeposited CdTe compound film on the porous silicon. To find ways to achieve good mechanical contact on the nanostructure porous silicon layer while keeping the interface transparent, we tried to electrodeposit a CdTe compound film on the porous silicon surface. The CdTe compound film was fabricated with -2.3V vs. Ag/AgCl potential difference in the electrolyte solution containing 1M of $CdSO_4$and 1 mM of $TeO_4$. X-ray diffraction results confirmed the existence of CdTe compound film on the porous silicon surface. Auger depth profile showed that Cd and Te were uniformly distributed up to a 80 nm distance from the surface. The photoluminescence of the sample with a CdTe compound film was weaker in intensity than that without the film and the maximum wavelength was shifted to the higher energy. These results indicate that the contacting CdTe compound film was infiltrated to the nanostructure of porous silicon.

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Applications of Ar Gas Cluster Ion Beam Sputtering to Ta2O5 thin films on SiO2/Si (100)

  • Park, Chanae;Chae, HongChol;Kang, Hee Jae
    • Proceedings of the Korean Vacuum Society Conference
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    • 2015.08a
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    • pp.119-119
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    • 2015
  • Ion beam sputtering has been widely used in Secondary Ion Mass Spectrometry (SIMS), X-ray Photoelectron Spectroscopy (XPS), and Auger Electron Spectroscopy (AES) for depth profile or surface cleaning. However, mainly due to severe matrix effects such as surface composition change from its original composition and damage of the surface generated by ion beam bombardment, conventional sputtering skills using mono-atomic primary ions with energy ranging from a few hundred to a thousand volts are not sufficient for the practical surface analysis of next-generation organic/inorganic device materials characterization. Therefore, minimization of the surface matrix effects caused by the ion beam sputtering is one of the key factors in surface analysis. In this work, the electronic structure of a $Ta_2O_5$ thin film on $SiO_2/Si$ (100) after Ar Gas Cluster Ion Beam (GCIB) sputtering was investigated using X-ray photoemission spectroscopy and compared with those obtained via mono-atomic Ar ion beam sputtering. The Ar ion sputtering had a great deal of influence on the electronic structure of the oxide thin film. Ar GCIB sputtering without sample rotation also affected the electronic structure of the oxide thin film. However, Ar GCIB sputtering during sample rotation did not exhibit any significant transition of the electronic structure of the $Ta_2O_5$ thin films. Our results showed that Ar GCIB can be useful for potential applications of oxide materials with sample rotation.

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A Study on Ion Exchange Method for Effective Ag Doping of Sputtering-Deposited CdTe Thin Film (스퍼터링 증착한 CdTe 박막의 효과적인 Ag 도핑을 위한 이온 교환법 연구)

  • Kim, Cheol-Joan;Park, Ju-Sun;Lee, Woo-Sun
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.60 no.6
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    • pp.1169-1174
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    • 2011
  • CdTe thin-film solar cell technology is well known that it can theoretically improve its conversion efficiency and manufacturing costs compared to the conventional silicon solar cell technology, due to its optical band gap energy (about 1.45eV) for solar energy absorption, high light absorption capability and low cost requirements for producing solar cells. Although the prior studies obtained the high light absorption, CdTe thin film solar cell has not been come up to the sufficient efficiency yet. So, doping method was selected for the improvement of the electrical characteristics in CdTe solar cells. Some elements including Cu, Ag, Cd and Te were generally used for the p-dopant as substitutional acceptors in CdTe thin film. In this study, the sputtering-deposited CdTe thin film was immersed in $AgNO_3$ solution for ion exchange method to dope Ag ions. The effects of immersion temperature and Ag-concentration were investigated on the optical properties and electrical characteristics of CdTe thin film by using Auger electron spectroscopy depth-profile, UV-visible spectrophotometer, and a Hall effect measurement system. The best optical and electrical characteristics were sucessfully obtained by Ag doping at high temperature and concentration. The larger and more uniform diffusion of Ag ions made increase of the Ag ion density in CdTe thin film to decrease the series resistance as well as mede the faster diffusion of light by the metal ions to enhance the light absorption.

Adhesion Enhancement of Thin Film Metals on Polyimide Substrates by Bias Sputtering

  • Kim S. Y.;Jo S. S.;Kang J. S.;Kim Y. H.
    • Journal of the Microelectronics and Packaging Society
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    • v.12 no.3 s.36
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    • pp.207-212
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    • 2005
  • Al, Ti, Ta, and Cr thin films were deposited on a polyimide substrate using DC magnetron sputter to study the adhesion characteristics of metal films on polyimide substrates, while RF bias of 0 - 400 W was applied to the substrate during DC sputtering. The adhesion strength was evaluated using a 90-degree peel test. The peel tests showed that the adhesion strength was enhanced by applying the RF bias to the substrate in all specimens. Scanning electron microscopy and Auger depth profile of the fractured surfaces indicate that the polyimide underwent cohesive failure during peeling and heavy deformation was also observed in the metal films peeled from the polyimide substrate when the RF bias applied during the deposition. Cross-sectional transmission electron microscopy revealed that the metal/polyimide interface was not clear and complicated. This complicated interface, likely formed due to the RF bias applied to the substrate, was attributed to the adhesion enhancement observed during the bias sputtering.

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MOCVD Deposition of AlN Thin Film for Packaging Materials

  • Chang-Kyu, Ahna;Seung-Chul Choi;Seong-Hoon Cho;Sung-Hwan Han;Je-Hong Kyoung
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2000.04a
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    • pp.118-118
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    • 2000
  • New single-source precursor, [AlCI3:NH2tBu] was synthesized for AlN thin f film processing with AICI3 (Aluminum Chloride) and tBuNH2 (tert-butylamine). AlN thin films for packaging aspplication were deposited on sapphire substrate by a atmosph하ie-pressure MOCVD. In most of other study methyl-based AI precursors w were used for source, But herein Aluminum Chloride was used for as AI source i in order to prevent the carbon contamination in the films and stabilize the p precursor. New precursor showed the very high gas vapor pressure so it allowed to m make the film under atmospheric-pressure and get the high purified film. High q quality AlN thin film was obtained at 700 to $900^{\circ}C$. The new precursor was p purified by a sublimation technique and help to fabricate high purity film. It s showed high vapor pressure, which is able to a critieal factor for the high purity a and atmospheric CVD of AlN. High Quality AIN thin film was obtained at $700-900^{\circ}C$. The AIN film was characterized by RBS

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Microstructures and Electrical Properties of Thick PZT Films with Thickness Variation Fabricated by Multi-coating Method (Multi-coating법으로 제조된 두꺼운 PZT막의 두께 변화에 따른 미세구조 및 전기적 특성)

  • Park, Jun-Sik;Jang, Yeon-Tae;Park, Hyo-Deok;Choe, Seung-Cheol;Gang, Seong-Gun
    • Korean Journal of Materials Research
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    • v.12 no.3
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    • pp.211-214
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    • 2002
  • Properties of 52/48 PZT films with various thicknesses for piezoelectric micro-electro mechanical systems (MEMS) devices fabricated by multi-coating method on $Pt(3500{\AA})/Ti(400{\AA})/SiO_2(3000{\AA})/Si$(525$\mu\textrm{m}$) substrates were investigated. PZT films were deposited by spin-coating process at 3500 rpm for 30 sec, followed by pyrolysis at 45$0^{\circ}C$ for 10 min producing the thickness of about 120nm. These processes were repeated 4, 8, 12, 16 and 20 times in order to have various thicknesses, respectively. Finally, they were crystallized at $650^{\circ}C$ for 30 min. All thick PZT films showed dense and homogeneous surface microstructures. Thick PZT films showed crystalline structures of random orientations with increasing thickness. Dielectric constants of thick PZT films were increased with increasing film thickness and reached 800 at 100kHz for 2.3$\mu\textrm{m}$ thick PZT film. $P_r\; and\; E_c$ of 2.3$\mu\textrm{m}$ thick PZT films were about 20$\mu$C/$\textrm{cm}^2$ and 63kV/cm. Depth profile analysis by Auger Electron Spectroscopy (AES) of 4800 $\AA$ thick PZT film showed the formation of the perovskite phase on Pt layer by Pb diffusion behavior. It was considered that Pb-Pt intermediate layer promoted PZT (111) columnar structures.

Changes in Interface Properties of TCO/a-Si:H Layer by Zn Buffer Layer in Silicon Heterojunction Solar Cells (실리콘 이종접합 태양전지의 Zn 확산방지층에 의한 TCO/a-Si:H 층간의 계면특성 변화)

  • Tark, Sung-Ju;Son, Chang-Sik;Kim, Dong-Hwan
    • Korean Journal of Materials Research
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    • v.21 no.6
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    • pp.341-346
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    • 2011
  • In this study, we inserted a Zn buffer layer into a AZO/p-type a-si:H layer interface in order to lower the contact resistance of the interface. For the Zn layer, the deposition was conducted at 5 nm, 7 nm and 10 nm using the rf-magnetron sputtering method. The results were compared to that of the AZO film to discuss the possibility of the Zn layer being used as a transparent conductive oxide thin film for application in the silicon heterojunction solar cell. We used the rf-magnetron sputtering method to fabricate Al 2 wt.% of Al-doped ZnO (AZO) film as a transparent conductive oxide (TCO). We analyzed the electro-optical properties of the ZnO as well as the interface properties of the AZO/p-type a-Si:H layer. After inserting a buffer layer into the AZO/p-type a-Si:H layers to enhance the interface properties, we measured the contact resistance of the layers using a CTLM (circular transmission line model) pattern, the depth profile of the layers using AES (auger electron spectroscopy), and the changes in the properties of the AZO thin film through heat treatment. We investigated the effects of the interface properties of the AZO/p-type a-Si:H layer on the characteristics of silicon heterojunction solar cells and the way to improve the interface properties. When depositing AZO thin film on a-Si layer, oxygen atoms are diffused from the AZO thin film towards the a-Si layer. Thus, the characteristics of the solar cells deteriorate due to the created oxide film. While a diffusion of Zn occurs toward the a-Si in the case of AZO used as TCO, the diffusion of In occurs toward a-Si in the case of ITO used as TCO.

Studies on the properties of electrochromic films and the effect of migration barrier (Electrochromic 막의 특성과 물질이동 방지막의 효과에 대한 연구)

  • 황하룡;백지흠;허증수;이덕동;임정옥;장동식
    • Journal of the Korean Vacuum Society
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    • v.9 no.3
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    • pp.221-226
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    • 2000
  • After manufacturing the electrochromic device (structure: ITO glass/$WO_3$/electrolyte/$V_2O_5$/ITO;glass) by using of sol-gel process and evaporation, optical properties and migration effect were investigated. The result shows that electrochromic device with heat treated (at water vapor ambient, $500^{\circ}C$, 1 hour) sol-gel coated $WO_3$ and $V_2O_5$ films had the highest transmittance variance. Electrochromic devices are based on the reversible insertion of guest atoms into structure of the host solid. But after cyclic operation, we find that the tungsten in $WO_3$ film and the indium in ITO film were migrated with each other. For the purpose of blocking migration, tungsten barrier film is inserted between ITO and $WO_3$ film. The result of cyclic voltamogram and the Auger depth profile show that the peak separation of cyclic voltamogram is reduced to below 1/10 and we could effectively block the indium and tungsten migration that is caused by flow of Li ions.

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Comparison of characteristics of IZO-Ag-IZO and IZO-Au-IZO multilayer electrodes for organic photovoltaics

  • Jeong, Jin-A;Choi, Kwang-Hyuk;Park, Yong-Seok;Park, Ho-Kyun;Kim, Han-Ki
    • Proceedings of the Korean Vacuum Society Conference
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    • 2010.02a
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    • pp.131-131
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    • 2010
  • We compared the electrical, optical, structural, and interface properties of indium zinc oxide (IZO)-Ag-IZO and IZO-Au-IZO multilayer electrodes deposited by linear facing target sputtering system at room temperature for organic photovoltaics. The IZO-Ag-IZO and IZO-Au-IZO multilayer electrodes show a significant reduction in their sheet resistance (4.15 and 5.49 Ohm/square) and resistivity ($3.9{\times}10^{-5}$ and $5.5{\times}10^{-5}$Ohm-cm) with increasing thickness of the Ag and Au layers, respectively. In spite of its similar electrical properties, the optical transmittance of the IZO-Ag-IZO electrode is much higher than that of the IZO-Au-IZO electrode, due to the more effective antireflection effect of Ag than Au in the visible region. In addition, the Auger electron spectroscopy depth profile results for the IZO/Ag/IZO and IZO/Au/IZO multilayer electrodes showed no interfacial reaction between the IZO layer and Ag or Au layer, due to the low preparation temperature. To investigate in detail the Ag and Au structures on the bottom IZO electrode with increasing thickness, a synchrotron x-ray scattering examination was employed. Moreover, the OSC fabricated on the IZO-Ag-IZO electrode shows a higher power conversion efficiency (3.05%) than the OSC prepared on the IZO-Au-IZO electrode (2.66%), due to its high optical transmittance in the wavelength range of 400-600 nm, which is the absorption wavelength of the P3HT:PCBM active layer.

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