• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2008.10a
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• pp.619-621
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• 2008

Organic field-effect transistors (OFETs) are of interest for use in widely area electronic applications. We fabricated a copper phthalocyanine (CuPc) based field-effect transistor with different metal electrode. The CuPc FET device was made a top-contact type and the substrate temperature was room temperature. The source and drain electrodes were used an Au and Al materials. The CuPc thickness was 40nm, and the channel length was $50{\mu}m$, channel width was 3mm. We observed a typical current-voltage (I-V) characteristics in CuPc FET with different electrode materials.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.506-507
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• 2008

Organic field-effect transistors (OFETs) are of interest for use in widely area electronic applications. We fabricated a copper phthalocyanine (CuPc) based field-effect transistor with different metal electrode. The CuPc FET made a top-contact type and the substrate temperature was room temperature. The source and drain electrodes were used an Au and Al materials. The CuPc thickness was 40nm, and the channel length was $50{\mu}m$, channel device was width was 3mm. We observed a typical current-voltage (I-V) characteristics in CuPc FET with different electrode materials.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.04b
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• pp.12-13
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• 2008

Organic field-effect transistors (OFETs) are of interest for use in widely area electronic applications. We fabricated a copper phthalocyanine (CuPc) based field-effect transistor with different metal electrode. The CuPc FET device was made a top-contact type and the substrate temperature was room temperature. The source and drain electrodes were used an Au and Al materials. The CuPc thickness was 40nm, and the channel length was $50{\mu}m$, channel width was 3mm. We observed a typical current-voltage (I-V) characteristics in CuPc FET with different electrode materials.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.494-495
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• 2007

Organic field-effect transistors (OFETs) are of interest for use in widely area electronic applications. We fabricated a copper phthalocyanine (CuPc) based field-effect transistor with different metal electrode. The CuPc FET device was made a top-contact type and the substrate temperature was room temperature. The source and drain electrodes were used an Au and Al materials. The CuPc thickness was 40nm, and the channel length was $50{\mu}m$, channel width was 3mm. We observed a typical current-voltage (I-V) characteristics in CuPc FET with different electrode materials.

• Journal of the Korean Ceramic Society
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• v.40 no.5
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• pp.447-454
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• 2003

Samples were prepared by the solid-state reaction method. The nominal composition of the samples was B $i_{1.84}$P $b_{0.34}$S $r_{1.91}$C $a_{2.03}$C $u_{3.06}$ $O_{10+{delta}$ prepared from powder of B $i_2$ $O_3$, PbO, SrC $O_3$, CaC $O_3$, and CuO. They were pulverized, mixed with AgO, A $u_2$ $O_3$and MgO of 50 wt%. Finally, they were sintered at 820 to 85$0^{\circ}C$ in air. The structural characteristics, the microstructure of surface and the critical temperature with respect to the each samples were analyzed by XRD, $T_{c}$, SEM and EDS respectively. It was found that the the critical temperature of the silver oxide additive samples (99.58 K) is higher than those of gold or magnesium oxides additive samples, but all those values are lower than that of pure Bi-2223 phase. The microstructure of surface showed the tendency which the AgO additive samples become more minuteness than A $u_2$ $O_3$ and MgO additive samples.s.samples.s.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.1
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• pp.35-39
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• 2011

Shearing characteristics of Sn-3.0wt%Ag-0.5wt%Cu ball for standardization of high speed shear test were investigated. The solder ball of 450 ${\mu}m$ in diameter was reflowed at $245^{\circ}C$ on FR4 PCB (Printed Circuit Board) to prepare a sample for the high-speed shear test. The metal pads on the PCB were OSP (Organic Solderability Preservative, Cu pad) and ENIG (Electroless Nickel/Immersion Gold, i.e CulNi/Au). Shearing speed was varied from 0.5 to 3.0 m/s, and tip height from 10 to 135 ${\mu}m$. As experimental results, for the OSP pad, a ductile fracture increased with tip height, and it decreased with shearing speed. In the case of ENIG pad, the ductile fracture increased with the tip height. The tip height of 10 ${\mu}m$ (2% of solder ball diameter) was unsuitable since the fracture mode was mostly pad lift. Shear energy increased with increasing shearing tip height from 10 to 135 ${\mu}m$ for both of OSP and ENIG pads.

• Proceedings of the KIEE Conference
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• 2001.11a
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• pp.9-11
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• 2001

차세대 고속 DRAM기술에 사용될 금속인 Cu의 확산 방지막(diffusion harrier) 물질로는 Ta 또는 W 같은 Refractory metal 이 융점(melting point)이 높고 저항값이 낮아 많이 연구 보고되고 있으나, 본 논문에서는 초고주파 소자에서 Au의 확산 방지 막으로 많이 사용되고 있으며. 선택적 증착이 용이한 Pt과 Ni를 MOS 소자의 Cu 확산 방지 막으로 적용하며 어닐링한 후 소자의 게이트 산화막 누설전류($I_{leak}$), 그리고. Si/$SiO_2$ 계면의 trap density 등의 변이를 측정하여 Cu가 소자의 특성 열화에 미치는 영향을 연구하였다. 실험 결과 Pt/Ti($200{\AA}/100{\AA}$)를 적용한 경우 소자 측성 열화가 가장 적었으며. 이는 Copper의 확산 방지막으로 Pt/Ti를 사용하여 전기적 특성 및 계면 특성을 개선시킬 수 있음을 보여 주었다. 이는 SIMS Profile을 통해서도 확인하였다.

• Journal of Technologic Dentistry
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• v.28 no.1
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• pp.27-41
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• 2006

The physical property and phase transformation in a commercial dental casting high gold alloy was investigated as a function of ageing temperature and time using microvickers hardness tester, X-ray diffraction, optical and electron microscopy and EPMA analyser. 1. With increasing ageing time, the hardness of solution-treated gold alloys increased slowly at the initial stage of ageing treatment at an ageing temperature of $300{\sim}400^{\circ}C$, and it reached a maximum value of hardness at the medium stage. Finally, it decreased gradually during further ageing. The maximum value of hardness at was similar with that of the conventional materials and suitable for using as the crown & bridge. 2. During isothermal ageing at a temperature range of $300{\sim}400^{\circ}C$, three phases consisting of the Au-rich ${\alpha}_1$phase with a face-centered cubic structure, the Pt3Zn ${\alpha}_2$phase with an ordered AuCu3(L12) type(f.c.c.) and the Pt-rich ${\alpha}_3$phase with face-centered cubic structure in solution-treated gold alloys were transformed into different three phases consisting of the ${\alpha}_1$phase, the ${\alpha}_3$phase and the PtZn $\beta$phase with an ordered AuCu I(L10) type. 3. The hardening of gold alloys was attributed to the lattice strains of the matrix resulting from the transformation of the ${\alpha}_2$phase to the $\beta$phase. 4. The softening of gold alloys during over-ageing was attributed to the coarsening of the nodules consisting of the $\beta$phase and ${\alpha}_1$matrix.

• Bulletin of the Korean Chemical Society
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• v.25 no.7
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• pp.1019-1024
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• 2004

The present paper is focused on simultaneous sorption concentration of gold (III) and silver (I) from thiocyanate solutions using high-selective anion exchanger AN-25 and subsequent separation of these ions at various concentrations of thiocarbamide (eluent). As a result, silver (I) ions are completely eluted from AN-25 and gold (III) ions remain in the resin phase and can be determined directly in the solid phase by diffuse reflection spectroscopy. It is proposed to use the sorption-spectroscopic method for Au(III) determination in aqueous solutions. The calibration curve is linear in the concentration range of 1-19 mg/L (sample volume is 10.0 mL) and the detection limit is 0.05 ${\mu}g/mL$. The presence of Cu(II), Co(II), Fe(II) do not hinder this determination. Au(III) was determined in industrial solutions.

• Economic and Environmental Geology
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• v.54 no.6
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• pp.753-765
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• 2021

The Dongwon Au-Ag deposit is located within the Paleozoic Taebaeksan province, Okcheon belt. Mineral paragenesis can be divided into two stages (stage I, ore-bearing quartz veins; stage II, barren carbonate veins) by major tectonic fracturing. Stage I, at which the precipitation of major ore minerals occurred, is further divided into three substages(early, middle and late) with paragenetic time based on minor fractures and discernible mineral assemblages: early, marked by deposition of pyrite with minor magnetite, pyrrhotite and arsenopyrite; middle, characterized by introduction of electrum and base-metal sulfides with minor sulfosalts; late, marked by argentite, Cu-As (and/or Sb) and Ag-Sb sulfosalts with base-metal sulfides. Fluid inclusion data show that stage I ore mineralization was deposited between initial high temperatures (≥430℃) and later lower temperatures (≤230℃) from fluids with salinities between 6.0 to 0.4 wt. percent equiv. NaCl. The relationship of salinity and homogenization temperature suggest that ore mineralization at Dongwon was deposited mainly due to fluid boiling, cooling and dilution via influx of cooler, more dilute meteoric waters. Changes in stage I vein mineralogy reflect decreasing temperature and fugacity of sulfur by evolution of the Dongwon hydrothermal system with increasing paragenetic time. The Dongwon deposit may represents a Korean-type and/or Au-Ag type mesothermal/epithermal gold-silver deposit.