• 대한치과기공학회지
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• 제20권1호
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• pp.37-49
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• 1998

실용치과재료로 사용되고 있는 Ag-Pd-Cu 3 원계 합금의 시효석출과정을 Pd 및 Cu의 용질 농도의 조성비가 약 1.7인 합금과 이 합금에서 2wt%Au의 첨가합금에 미치는 영향을 조사 분석하여 아래와 같은 결론을 얻었다. Ag-25Pd-15Cu 3원 합금은 ${\alpha}$의 단일상에서 ${\alpha}_1$ (Cu-rich), ${\alpha}_2$(Ag-rich) 및 PdCu 규칙상에 의해서 경화반응이 진행되며 연속승온시효에 의하면 $100{\sim}300^{\circ}C$의 저항증가와 $300{\sim}500^{\circ}C$의 저항감소라고 하는 2단계 변화에 의해서 경화곡선이 얻어졌다. 또한 본 합금의 시효과정은 ${\alpha}{\to}{\alpha}+{\alpha}_2+PdCu{\to}{\alpha}_1+{\alpha}_2+PdCu$이고 2상분리 반응에 경화되며 최고경화는 ${\alpha}_1,\;{\alpha}_2$ 및 PdCu 규칙상의 혼합영역에서 나타났다. 이들 석출반응은 입계반응이고 반응의 진행과 함께 경도값은 상승하고 경화촉진에 기여하였다. 또한 Nodule은 미세한 lamella조직을 나타내고 이들 ${\alpha}_2$와 PdCu상과의 미세한 혼합상의형성이 시효경화에 기여하는 주된 원인이 되었다. 과시효는 lamella의 조대화와 PdCu상의 ${\alpha}2$상으로의 용해에 따른 정량적 감소에 대응하였다. 석출상은 thin lamella구조의 잘 방위된 미세한 판상석출물로서 이들 미세 판상석출물은 AuCu($L1_0$)type의 face-centered tetragonal(fct)의 초격자구조였다. 규칙화된 미세한 판상석출물은 stair-step mode로서 twinning에 의해 형성되며 이것은 시효에 의해 $L1_0$ type의 PdCu 규칙상과 같은 초격자 형성시 정방비틀림 때문이라고 생각된다. 이들 twinning lamella는 귀금속원소에 의해 형성된 $L1_0$ type의 PdCu 규칙상과 같기 때문에 이들 합금의 부식저항에도 기여하였다. Ag-25Pd-15Cu합금은 전반적으로 양호한 내식성을 나타내며 Pd.Cu=1인 합금에서보다도 Pd함량이 높은 Pd/Cu=1.7에서 내식성이 보다 우수한 것은 Pd 함량이 내식성에 기여하였고 2%Au의 첨가에 의해서 부식성을 개선할 수 있었다.

• 한국전기전자재료학회논문지
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• 제16권7호
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• pp.627-633
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• 2003

The effects of alloying-element additions to Ag sheath on thermal conductivity and mechanical properties of Bi-2223 superconductor tapes have been evaluated. In order to evaluate the effects of sheath alloys and their configuration on the properties of tape, various combinations of Ag and Ag alloys were selected as the inner and outer sheath. Thermal conductivity of the tapes was evaluated by using thermal integral method at 10 ∼120 K. It was observed that the addition of Mg, Sb, and Au to Ag sheath significantly decreased the thermal conductivity at low temperature probably due to the alloying effect. Specifically, the thermal conductivity of AgMg, AgSb, and AgAu at 40 K were 411.4, 142.3, and 109.7 W/(m·K), respectly, which is about 2∼9 times lower than that of Ag (1004.6 W/(m·K)). In addition, the thermal conductivity of alloy-sheathed tape was significantly dependent on their thermal conductivities of constituent sheath materials. The mechanical properties of alloy-sheathed tapes were also evaluated. Yield strength and tensile strength were improved but workability decreased for alloy-sheathed tapes.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 추계 기술심포지움 논문집
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• pp.57-57
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• 2000

본 논문에서는 MCM 및 패키지의 Lid로 사용되는 합금인 Kovar (Fe-Ni-Co alloy) 와 LTCC (Low Temperature Co-fired Ceramics) 간의 Brazing 특성을 연구하였다. 기존에 사용되고 있는 알루미나 패키지의 경우, 주로 80$0^{\circ}C$ 이상의 온도에서 Brazing을 실시하고 있으며, 조성은 Ag-Cu 계열을 사용하고 있다. 하지만, LTCC 의 경우, 소결온도가 85$0^{\circ}C$ 내외로서 기존의 방법을 그대로 적용하기는 어려움이 있다. 또한 Brazing 특성에 따른 접착 강도는 Brazing Alloy 의 영향뿐만 아니라 LTCC 와 전도체 전극사이의 Metallization 에 크게 영향을 받는다. 따라서, 본 논문에서는 Brazing Alloy의 종류 (Ag-Cu, Au-Sn) 및 Brazing 조건에 따른 Brazing 특성뿐만 아니라, 전도체 전극내 유리질 함량에 따른 Brazing 특성을 평가하여 LTCC/Kovar 간의 최적의 Brazing 조건을 구현하고자 하였다.

• 한국전기전자재료학회논문지
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• 제13권8호
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• pp.711-717
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• 2000

Effect of alloying element additions to Ag on thermal conductivity electrical conductivity and mechanical properties of sheath materials for BSCCO tapes has been characterized. The thermal conductivity at low temperature range(10~300K) of Ag alloys were evaluated by both direct and indirect measurement techniques and compared with each other. It was observed that thermal conductivity decreased with increasing the content of alloying elements such as Au, Pd and Mg. Thermal conductivity of pure Ag at 30 K was measured to be 994.0 W/m.K on the other hand the corresponding values of A $g_{0.9995}$/M $g_{0.0005}$, A $g_{0.974}$/A $u_{0.025}$/M $g_{0.001}$, A $g_{0.973}$/Au.0.025//M $g_{0.002}$, and A $g_{0.92}$/P $d_{0.06}$/M $g_{0.02}$ were 342.6, 62.1, 59.2, 28.9 W/m.K respectively indicating 3 to 30 times lower than that of pure Ag. In addition alloying element additions to Ag improved mechanical strength while reduced elongation probably due to the strengthening mechanisms by the presence of additive atoms.s.

• 대한치과재료학회지
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• 제43권4호
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• pp.317-322
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• 2016

The effect of ice-quenching after degassing on the hardness change during simulated porcelain firing in a metal-ceramic Pd-Au-Ag alloy was investigated by means of hardness test, field emission scanning electron microscopic observations, and X-ray diffraction analysis. The hardness decreased by ice-quenching after degassing, which was induced by the homogenization of the ice-quenched specimen. The decreased hardness by ice-quenching after degassing was recovered from the 1st opaque stage which was the first stage of the remaining firing process for bonding porcelain. The microstructural change showed that the increase in hardness during the remaining firing process was caused by precipitation. The ice-quenching after degassing did not affect the hardness change during the subsequent porcelain firing process.

• 대한치과재료학회지
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• 제42권2호
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• pp.95-106
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• 2015

Hardening mechanism associated with post-firing heat treatment of softening heat treated and then firing simulated Pd-Ag-Au alloy for bonding porcelain was examined by observing the change in hardness, crystal structure and microstructure. By post-firing heat treatment of as-cast, solution treated and pre-firing heat treated specimens at $650^{\circ}C$ after casting, the hardness value increased within 10 minutes. Then, hardness consistently increased until 30 minutes, and gap of hardness value among the specimens was reduced. The increase in hardness after post-firing heat treatment was caused by grain interior precipitation in the matrix. The softening heat treatment did not affect the increase in hardness by post-firing heat treatment. The precipitated phase from the parent Pd-Ag-Au-rich ${\alpha}$ phase with face-centered cubic structure by post-firing heat treatment was $Pd_3$(Sn, In) phase with face-centered tetragonal structure, which has lattice parameters of $a_{200}=4.0907{\AA}$, $c_{002}=3.745{\AA}$. From above results, appropriate post-firing heat treatment in order to support the hardness of Pd-Ag-Au metal substructure was expected to bring positive effects to durability of the prosthesis.

• 대한치과재료학회지
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• 제44권3호
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• pp.197-206
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• 2017

본 연구에서는 포세린 소성과정 동안 금속하부구조물의 경도가 하강하는 문제점을 개선하기 위해 모의소성 시 산화처리 단계에서 서냉(bench cooling) 대신 급랭(ice-quenching)으로 합금을 냉각시킴으로써 나머지 소성단계 동안 경화효과를 얻을 수 있을 것으로 예측하고, 이를 확인하기 위해 실험을 진행하였다. 본 연구에서는 Pd-Ag-Sn-Au계 금속-세라믹용 합금을 사용하여 실험을 진행하여 다음과 같은 결과를 얻었다. 산화처리 후 stage 0으로 냉각한 시편과 산화처리 후 급랭한 시편을 glaze까지 모의소성한 결과, 두 시편 모두 소성 첫 단계에서 경도가 상승한 후 지속적으로 경도가 하강하였으나, 산화처리 후 급랭한 시편의 최종 경도가 더 높게 나타났다. 소성 첫 단계에서 일어난 경도의 상승은 면심입방구조의 Pd-Ag-rich 기지에서 면심정방구조의 Pd3(Sn, Ga, In)상의 석출로 인해 기지와 석출물간의 계면에 생성된 격자변형에 기인하였다. 모의소성과정에 따른 경도의 하강은 석출물이 조대화됨에 따라 석출물과 기지사이의 계면의 면적이 감소되어 격자 뒤틀림이 해소된 것에 기인하였다.

• 대한치과보철학회지
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• 제29권3호
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• pp.111-119
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• 1991

This study was performed to investigate the effect of gold electrodepositoin on porcelain color of palladium-silver alloy. The specimens were made by firing porcelain on the metal plates cast respectively in Au-Pt alloy, and Pd-Ag alloy. In the case of Pd-Ag alloy specimens, porcelain were fired under three different conditions of the metal plate: 1) without gold coating, 2) firing opaque beforehand on one side, gold coating on the other side, 3) gold coating on both sides of the metal plate. Color change was measured with fiber-optic colorimeter(Model TC-6FX, Tokyo Denshoku Co., Japan). The obtained results were as follows: 1. In the group of firing opaque beforehand on one side and gold coating on the other side, there was no significant differences in their color in comparison to the color of the control group of the Au-Pt alloys. 2. In the group of gold coating on both sides on metal plate, there were no significant differences except their value to the group of firing poaque beforehand on one side and gold coating on the other side.

• Corrosion Science and Technology
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• 제6권6호
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• pp.304-307
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• 2007

As to the reflection electrode of LCD (liquid crystal displays), silver-copper-gold alloy (hereafter, it is called as ACA (Ag98%, Cu1%, Au1%)) is an effective material of which weathering resistance can be improved more compared with pure silver. However, there is a problem that gold remains on the substrate as residues when ACA is etched in cerium ammonium nitrate solution or phosphoric acid. Gold can not be etched in these etchants as readily as the other two alloying elements. Gold residue has actually been removed physically by brushing etc. This procedure causes damage to the display elements. Another etchant of iodine/potassium iodide generally known as one of the gold etchants can not give precise etch pattern because of remarkable difference in etching rates among silver, copper and gold. The purpose of this research is to obtain a practical etchant for ACA alloy. The results are as follows. The cyanogen complex salt of gold generates when cyanide is used as the etchant, in which gold dissolves considerably. Oxygen reduction is important as the cathodic reaction in the dissolution of gold. A new etchant of sodium cyanide / potassium ferricyanide whose cathodic reduction is stronger than oxygen, can give precise etch patterns in ACA alloy swiftly at room temperature.

• 대한치과보철학회지
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• 제39권4호
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• pp.417-432
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• 2001

The pcf metal primers on the bond strength and durability of 4-META/MMA-TBB resins adhered to an Au-Ag-Pd alloy. For this study, the specimens were divided into 8 groups as follows: Thermocyle 0 : (1) control group : sandblast, (2) Group I : sandblast + Cesead Opaque Primer; (3) Group II : sandblast + Metal Primer; (4) Group III : sandblast + V-Primer; Thermocyle 10,000 (5) control sandblast: (6) Group I : sandblast + Cesead Opaque Primer: (7) Group II : sandblast + Metal Primer; (8) Group III sandblast + V-Primer. The shear bond strength was determined using an Instron were observed with the use of scanning electron microscope. Finally, the strengths of bonded joints were evaluated with regard to their adherence energy using a wedge test. The results obtained were as follows ; (1) The shear bond strength of 4-META/MMA-TBB resin to the Au-Ag-Pd alloy was significantly improved in all the groups treated with the primers (p<0.05). (2) Regardless of the adhesive primers used, a significant difference was observed in the bond strength of the thermocycle 0 groups and 10,000 groups (p<0.05). (3) Both before and after thermocycling, the strongest bond strength between the resin an the alloy was obtained after treatment with a metal primer containing MEPS (p<0.05). (4) In the wedge test, the adherence energies of the control group and Group III decreased more rapidly than those of Group I and II during the 2nd day of storage in water.