• Journal of Broadcast Engineering
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• v.21 no.3
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• pp.357-368
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• 2016

In DAB+, HE-AAC v2 codec is applied for the fixed rate transmission of audio stream. In case that xHE-AAC codec including USAC, a more efficiency is expected when the variable frame is used in a given same bandwidth compared to the fixed frame transmission. For this to be realized, audio streams need to be multiplexed in a sub-channel before transmission, then a method is required to identify the border of each audio frames. In this paper, the toggled sync byte and additional identification field being sequentially placed between AU borders are proposed in order to deal with the AU border identification. In addition, the Reed-Solomon based error correction code which is compliant to DAB+ is proposed.

• Carbon letters
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• v.25
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• pp.1-13
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• 2018

Gold functionalized graphene oxide (GOAu) nanoparticles were reinforced in acrylonitrile-butadiene rubbers (NBR) via solution and melt mixing methods. The synthesized NBR-GOAu nanocomposites have shown significant improvements in their rate of curing, mechanical strength, thermal stability and electrical properties. The homogeneous dispersion of GOAu nanoparticles in NBR has been considered responsible for the enhanced thermal conductivity, thermal stability, and mechanical properties of NBR nanocomposites. In addition, the NBR-GOAu nanocomposites were able to show a decreasing trend in their dielectric constant (${\varepsilon}^{\prime}$) and electrical resistance on straining within a range of 10-70%. The decreasing trend in ${\varepsilon}^{\prime}$ is attributed to the decrease in electrode and interfacial polarization on straining the nanocomposites. The decreasing trend in electrical resistance in the nanocomposites is likely due to the attachment of Au nanoparticles to the surface of GO sheets which act as electrical interconnects. The Au nanoparticles have been proposed to function as ball rollers in-between GO nanosheets to improve their sliding on each other and to improve contacts with neighboring GO nanosheets, especially on straining the nanocomposites. The NBR-GOAu nanocomposites have exhibited piezoelectric gauge factor (${GF_{\varepsilon}}^{\prime}$) of ~0.5, and piezo-resistive gauge factor ($GF_R$) of ~0.9 which clearly indicated that GOAu reinforced NBR nanocomposites are potentially useful in fabrication of structural, high temperature responsive, and stretchable strain-sensitive sensors.

• Korean Journal of Metals and Materials
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• v.48 no.11
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• pp.1041-1046
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• 2010

The reactions between a Sn-3.0Ag-0.5Cu solder alloy and electroless Ni/electroless Pd/immersion Au (ENEPIG) surface finishes with various Pd layer thicknesses (0, 0.05, 0.1, 0.2, $0.4{\mu}m$) were examined for the effect of the Pd layer on the massive spalling of the $(Cu,Ni)_6Sn_5$ layer during reflow at $235^{\circ}C$. The thin layer deposition of an electroless Pd (EP) between the electroless Ni ($7{\mu}m$) and immersion Au ($0.06{\mu}m$) plating on the Cu substrate significantly retarded the massive spalling of the $(Cu,Ni)_6Sn_5$ layer during reflow. Its retarding effect increased with an increasing EP layer thickness. When the EP layer was thin (${\leq}0.1{\mu}m$), the retardation of the massive spalling was attributed to a reduced growth rate of the $(Cu,Ni)_6Sn_5$ layer and thus to a lowered consumption rate of Cu in the bulk solder during reflow. However, when the EP layer was thick (${\geq}0.2{\mu}m$), the initially dissolved Pd atoms in the molten solder resettled as $(Pd,Ni)Sn_4$ precipitates near the solder/$(Cu,Ni)_6Sn_5$ interface with an increasing reflow time. Since the Pd resettlement requires a continuous Ni supply across the $(Cu,Ni)_6Sn_5$ layer from the Ni(P) substrate, it suppressed the formation of $(Ni,Cu)_3Sn_4$ at the $(Cu,Ni)_6Sn_5/Ni(P)$ interface and retarded the massive spalling of the $(Cu,Ni)_6Sn_5$ layer.

• Korean Journal of Remote Sensing
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• v.23 no.4
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• pp.287-295
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• 2007

A mineral potential map showing the distributions of potential areas for exploration of undiscovered mineral deposits is a kind of predictive thematic maps. For any predictive thematic maps to show reasonably significant prediction results, validation information on prediction capability should be provided in addition to spatial locations of high potential areas. The objective of this paper is to apply prediction rate curves to the estimation of prediction probability of future discovery. A case study for Au-Ag mineral potential mapping using geochemical data sets is carried out to illustrate procedures for estimating prediction probability and for an interpretation. Through the case study, quantitative information including prediction rates and probability obtained by prediction rate curves was found to be very important for the interpretation of prediction results. It is expected that such quantitative validation information would be effectively used as basic information for cost analysis of exploration and environmental impact assessment.

• The Journal of the Acoustical Society of Korea
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• v.35 no.6
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• pp.473-479
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• 2016

We report a highly selective and sensitive 200 MHz Surface Acoustic Wave (SAW) sensor that can detect cyanide ion in aqueous solution using surface immobilized thioester molecules in combination with gold nanoparticles (AuNPs). To construct the sensor device, a monolayer of thioester compound was immobilized on the SAW sensor surface. At the sensor surface, hydrolysis of thioester group by nucleophilic addition of cyanide occurred and the resulting free thiol unit bound to AuNP to form thiol-AuNP conjugate. For the signal enhancement, gold staining signal amplification process was introduced subsequently with gold (III) chloride trihydrate and reducing agent, hydroxylamine hydrochloride. The SAW sensor showed a detection ability of $17.7{\mu}M$ for cyanide in aqueous solution and demonstrated a saturation behavior between the frequency shift and the concentration of cyanide ion. On the other hand, our SAW sensor had no activities for other anions such as fluoride ion, acetate ion and sulfate ion, moreover, no significant interference observed by other anions. Finally, all the experiments were carried out in-house developed sensor and fluidics modules to obtain highly reproducible results.

• Journal of Technologic Dentistry
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• v.21 no.1
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• pp.15-26
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• 1999

This study was carried out by observing to composition of oxide on the surface of dental porcelain low gold alloy with various Indium additions according to the degassing and analysing the change composition of additional elements In on diffusion behaviors of Porcelain-matal surface. The specimens used were Au-Pd-Ag alloys by small indium addition. These specimens were treated for 10min at $1000^{\circ}C$ in vacuum condition. To investigate the microsturcture of oxidized alloy surface, SEM and EDAX were used, and EPMA were used to investigate the diffusion behaviors of porcelain-metal surface. X-ray diffraction were used to observe the morphological changes in the oxidation zone. The results of this study were obtained as follows ; 1) The hardness of alloy increased with increasing amount of In addition. 2) The formation of oxidation increased with increasing In content after heat treatment. 3) Diffusion of indium elements increased with increasing In content in metal-porcelain surface after firing. 4) The oxidations of alloy surface were mainly $In_2O_3$.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.9-15
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• 2018

This paper shows the principles and characteristics of the transient liquid phase (TLP) bonding technology for power modules packaging. The power module is semiconductor parts that change and manage power entering electronic devices, and demand is increasing due to the advent of the fourth industrial revolution. Higher operation temperatures and increasing current density are important for the performance of power modules. Conventional power modules using Si chip have reached the limit of theoretical performance development. In addition, their efficiency is reduced at high temperature because of the low properties of Si. Therefore, Si is changed to silicon carbide (SiC) and gallium nitride (GaN). Various methods of bonding have been studied, like Ag sintering and Sn-Au solder, to keep up with the development of chips, one of which is TLP bonding. TLP bonding has the advantages in price and junction temperature over other technologies. In this paper, TLP bonding using various materials and methods is introduced. In addition, new TLP technologies that are combined with other technologies such as metal powder mixing and ultrasonic technology are also reviewed.

• Proceedings of the Korea Air Pollution Research Association Conference
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• 2003.05b
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• pp.225-226
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• 2003

최근 인간의 생활환경에 존재하는 유해가스 및 대기 환경에 대한 관심이 고조되면서 환경유해가스를 손쉽게 감지할 수 있는 센서의 필요성이 중요하게 인식되고 있다. 그 중 암모니아 가스는 생활환경 내에 존재하는 악취성분일 뿐만 아니라 냉각기의 냉매로 사용되는 가스로서 대기 중 허용농도가 50 ppm으로 알려져 있다. 본 연구에서는 프린트스크린 인쇄법을 이용하여 SnO$_2$를 모물질로 하여 귀금속 산화물인 Pt와 Au를 첨가한 암모니아 반도체 가스센서를 제조하여 그 감도 및 SO$_2$, NOx, CH$_4$, NH$_3$, 에 대한 선택성을 분석하였다. (중략)

• Preventive Nutrition and Food Science
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• v.17 no.1
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• pp.64-70
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• 2012

Bacilli with fibrinolytic activities were isolated from traditionally-prepared Meju and some of these strains showed strong antifungal activities. One isolate, MJ1-4, showed the strongest antifungal activity. MJ1-4 and other isolates were identified as B. amyloliquefaciens strains by recA gene sequencing and RAPD-PCR results. B. amyloliqufaciens MJ1-4 efficiently inhibited an Aspergillus spp.-producing aflatoxin B1 ($AFB_1$) and a Penicillium spp.-producing ochratoxin (OTA) in addition to other fungi. Antifungal activity of B. amyloliquefaciens MJ1-4 culture reached its maximum (40 AU/mg protein) in LB or TSB medium around 48 hr at $37^{\circ}C$. Antifungal activity of the concentrated culture supernatant was not decreased significantly by protease treatments, implying that the antifungal substance might not be a simple peptide or protein. Considering its antifungal and fibrinolytic activities together, B. amyloliquefaciens MJ1-4 can serve as a starter for fermented soyfoods such as Cheonggukjang and Doenjang.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.15 no.1
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• pp.89-94
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• 2016

This study investigates the durability of the radiator and cooler of a laptop through a thermal analysis. In the result of this study, the maximum deformation happened at the part holding up the support stand at the radiator and cooler. The maximum thermal stress of the cooler was 60.939 Mpa, as low as that of the radiator. In addition, the safety factor of the cooler was 1.64 times as high as that of the radiator. The radiator of the laptop was less durable than the cooler. The result of this study could help with designing a laptop model with a durable radiator and cooler.