• Journal of Powder Materials
• /
• v.11 no.3
• /
• pp.193-201
• /
• 2004

1960년 Au-Si계 합금에서 처음으로 비정질상이 급속 응고법에 의해 보고된 이래/sup 1)/ 지난 40년 간 많은 합금계에서 비정질상이 보고되어졌다. 대표적으로 Fe-, Ni-, Co기 합금 등 많은 합금계에서 비정질상이 보고되었으나, 비정질상의 형성을 위해서는 약 105 K/s이상의 높은 냉각속도를 필요로 하였다. 1980년대 수백 K/s의 낮은 냉각속도 하에서도 비정질상이 형성될 수 있는 다원계 합금(multi-component alloy)이 Mg-Ln-(Ni, Cu, Zn), Ln-Al-TM 합금에서 보고되어 졌으나 많은 관심을 받지 못하다가 1993년 Zr-Ti-Ni-Cu-Be 합금에서 수 ㎝ 크기의 비정질합금 제조가 보고되면서 전 세계적으로 많은 관심을 받게 되었다. Zr-Ti-Ni-Cu-Be계 벌크 비정질 합금이 보고된 후 Zr-(Nb,Pd)-Al-TM, Pd-Cu-Ni-P, Fe-Co-Zr-Mo-W-B, Ti-Zr-Ni-Cu-Sn등 여러 합금계에서 벌크 비정질 합금이 보고되었다. (중략)

• Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
• /
• 2001.02a
• /
• pp.92-94
• /
• 2001

We investigated quench recovery characteristics of Au/YBCO thin film meander lines. YB$a_{2}$$Cu_{3}$ $O_{7}$films were coated in-situ with a gold layer and patterned into 2 mm wide meander lines by photolithography. The limiters were tested with simulated fault currents at various source voltages. Resistance decreased first slowly and then rapidly to zero. Resistance vs. time curves for different source voltages fell on top of each other when translated horizontally. The slowly varying portion of data fell on straight lines of a slope on a semi-log scale at all source voltages. A heat balance equation reflecting heat loss from meander lines to surroundings explains these results quantitatively.

• Progress in Superconductivity
• /
• v.9 no.2
• /
• pp.188-192
• /
• 2008

We investigated the size effect on quench development in $Au/YBa_2Cu_3O_7$ (YBCO) thin film meander lines on sapphire substrates. The meander lines were fabricated by patterning YBCO films coated with gold layers. The lines were subjected to simulated AC fault current, and immersed in liquid nitrogen during the experiment. After the initial rapid rise, the resistance increased moderately and then slowly. In 4 inch-diameter meander lines, the period during which the resistance increased moderately was considerably longer than in 2 inch-diameter line. Moderate increase of resistance was originated from quench propagation. The film temperature was about 180 K at the point when the propagation was completed. The rate of resistance increase after the quench completion was not affected by the film size.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2012.02a
• /
• pp.536-536
• /
• 2012

나노와이어는 센서, 메모리소자, 태양전지등과 같은 다양한 소자로 응용이 되고 있다. Bottom-up 방법으로 길러진 나노와이어들을 금속전극 위에 정렬 및 접합시킬 때, 나노와이어와 금속전극간의 기계적 접합강도와 안정적인 전기적 특성이 매우 중요하다. 본 연구에서는 열압착 공정과 솔더전극(Cr/Au/In/Au, Cr/Cu/In/Au)을 사용함으로써, 나노와이어를 금속전극에 압입시켜 강한 기계적 접합강도와 안정적인 전기적 특성을 얻을 수 있는 공정을 제안하였다. 나노와이어와 금속 전극간의 접합부 분석을 위해 scanning electron microscopy (SEM)와 transmission electron microscopy (TEM)을 이용하였으며, 기계적 특성은 lateral force microscopy (LFM), 전기적 특성은 semiconductor analyzer (Keithley 4200-SCS)를 사용하여 측정하였다. 접합강도 측정결과 lateral force가 나노와이어에 가해질 때 나노와이어가 파괴되는 힘에서도 나노와이어와 금속전극간의 접합부파괴가 일어나지 않았다. 또한 나노와이어와 금속전극간의 전기적 접촉특성은 안정적인 ohmic contact을 이루었다.

• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2011.05a
• /
• pp.187-187
• /
• 2011

지르코니아 ($ZrO_2$) 표면에 금속 (Au)으로 표면 코팅한 후 Ti-6Al-4V와 진공 브레이징 접합을 행하였다. 표면에 코팅한 Au 층의 영향을 비교 분석하기 위하여 Au를 코팅하지 않은 지르코니아도 모재로 사용하였다. 접합소재로는 Ag-Cu-Ti계 active filler를 사용하였다. $ZrO_2$/Ti-6Al-4V 브레이징 결과, active filler는 양측 모재 표면에 wetting 되었으며, Ti-6Al-4V 내부로 filler 확산으로 인하여 두 모재의 direct joint가 관찰되었다. 접합 계면 사이에 접합부 결함은 관찰되지 않았다.

• Korean Journal of Materials Research
• /
• v.10 no.12
• /
• pp.799-806
• /
• 2000

Cu$_{6}$Sn$_{5}$-dispersed 63Sn-37Pb solder bumps of 760$\mu\textrm{m}$ size were fabricated on Au(0.5$\mu\textrm{m}$)/Ni(5$\mu\textrm{m}$)/Cu(27$\pm$20$\mu\textrm{m}$) BGA substrates by screen printing process, and their shear strength were characterized with variations of dwell time at reflow peak temperature and aging time at 15$0^{\circ}C$ . With dwell time of 30 seconds at reflow peak temperature, the solder bumps with Cu$_{6}$Sn$_{5}$ dispersion exhibited higher shear strength than the value of the 63Sn-37Pb solder bump. With increasing the dwell time longer than 60 seconds, however the shear strength of the Cu$_{6}$Sn$_{5}$-dispersed solder bumps became lower than that the 63Sn-37Pb solder bumps. The failure surface of the solder bumps could be divided into two legions of slow crack propagation and critical crack propagation. The shear strength of the solder bumps was inversely proportional to the slow crack propagation length, regardless of the dwell time at peak temperature, aging time at 150 $^{\circ}C$ and the volume fraction of Cu$_{6}$Sn$_{5}$ dispersion.> 5/ dispersion.

• Korean Chemical Engineering Research
• /
• v.49 no.6
• /
• pp.720-725
• /
• 2011

Gold catalysts supported on metal-oxides were prepared by co-precipitation using the various metal nitrates and chloroauric acid as precursors, and effect of water addition on the catalytic activity in CO oxidation was investigated. Among the various supported gold catalysts, Au/$Co_{3}O_{4}$ and Au/ZnO catalysts showed the excellent activity for CO oxidation. Water in the reactant gas had a negative effect on the oxidation activity over Au/$Co_{3}O_{4}$ catalysts and a positive effect on that over Au/ZnO, which means the activity depends strongly on the nature of support. It was also confirmed that no significant change in the particle size of gold was observed after reaction both in dry and wet conditions. This fact suggested that the deactivated catalyst due to a carbonate species could be regenerated by water addition in the reactant gas.

• Journal of Surface Science and Engineering
• /
• v.36 no.5
• /
• pp.386-392
• /
• 2003

The electroplating process for a solder bump which can be applied for a flip chip was studied. Si-wafer was used for an experimental substrate, and the substrate were coated with UBM (Under Bump Metallization) of Al(400 nm)/Cu(300 nm)Ni(400 nm)/Au(20 nm) subsequently. The compositions of the bump were Sn-Cu and eutectic Sn-Pb, and characteristics of two bumps were compared. Experimental results showed that the electroplated thickness of the solders were increased with time, and the increasing rates were TEX>$0.45 <\mu\textrm{m}$/min for the Sn-Cu and $ 0.35\mu\textrm{m}$/min for the Sn-Pb. In the case of Sn-Cu, electroplating rate increased from 0.25 to $2.7\mu\textrm{m}$/min with increasing current density from 1 to 8.5 $A/dm^2$. In the case of Sn-Pb the rate increased until the current density became $4 A/dm^2$, and after that current density the rate maintains constant value of $0.62\mu\textrm{m}$/min. The electro plated bumps were air reflowed to form spherical bumps, and their bonded shear strengths were evaluated. The shear strength reached at the reflow time of 10 sec, and the strength was of 113 gf for Sn-Cu and 120 gf for Sn-Pb.

• Journal of Magnetics
• /
• v.11 no.1
• /
• pp.36-42
• /
• 2006

In this report, we demonstrate a comprehensive analysis of the effects of Au addition on the microstructure and magnetic properties of $Fe_{73.5}Si_{13.5}B_{9}Nb_{3}Au_1$ Finemet-type alloy. It was found that the as-quenched alloys were the amorphous state and turned into nanocrystalline state under heat treatments. The DSC analysis indicates that the sharply exothermal peak corresponding to the crystallization of the $\alpha-Fe(Si)$ was observed at $547-579^{\circ}C$ depending on the heating rates, which is little higher than that of original Finemet (542-$570{^{\circ}C}$, respectively). Besides, the thermomagnetic result confirmed that the full substitution of Cu by Au with the single phase structure in the M(T) curve along cooling cycle. Ultrasoft magnetic properties of the nanocrystallized samples were significantly enhanced by the proper annealing such as the increase of permeability and the decrease of the coercivity. The optimum annealing condition was found at the annealing temperature of $540^{\circ}C$ and the increase of the annealing time up to 90 min.

• Journal of Welding and Joining
• /
• v.21 no.7
• /
• pp.59-64
• /
• 2003

Microstructure and shear strength of Sn-Zn lead-free solders and Au/Ni/Cu UBM joint under thermal aging conditions was investigated. The samples were aged isothermally at 10$0^{\circ}C$ and 15$0^{\circ}C$ for 300, 600, and 900 hours. The IMCs(Intermetallic Compound) at the interface between solder and UBM were examined by FESEM and TEM. The results showed that the shear strength was decreased with aging time and temperature. The solder ball with high activated RA flux had about 8.2% higher shear strength than that of RMA flux. Poor wetting and many voids were observed in the fractured solder joint with of RMA flux. The decreased shear strengths were caused by IMC growth and Zn grain coarsening. Zn reacted with Au and then was transformed to the $\beta$ -AuZn compound. Although AuZn grew first, $r-Ni_5Zn_{21}$ compounds were formed with aging time. The layers indicated by $Ni_5Zn_{21}(1)$, (2), and (3) were formed with the thickness of ∼0.7 ${\mu}{\textrm}{m}$, ∼4 ${\mu}{\textrm}{m}$, and ∼2 ${\mu}{\textrm}{m}$, respectively.