• Journal of Welding and Joining
• /
• v.20 no.1
• /
• pp.91-96
• /
• 2002

Three different kinds of substrate used in this study : bare Cu, electroless Ni/Cu substrate with a Nilayer thickness of $5\mu\textrm{m}$, immersion Au/electroless Ni/Cu substrate with the Au and Ni layer of $0.15\mu\textrm{m}$ and $5\mu\textrm{m}$ thickness, respectively. The wettability and interfacial tension between various substrate and Sn-3.5Ag solder were examined as a function of soldering temperature, types of flux. The wettability of Sn-3.5Ag solder increased with soldering temperature and solid content of flux. The wettability of Sn-3.5Ag solder was affected by the substrate metal finish used, i.e., nickel, gold and copper. Intermetallic compound formation between liquid solder and substrate reduced the interfacial energy and decreased wettability.

• Resources Recycling
• /
• v.10 no.5
• /
• pp.29-35
• /
• 2001

This study was carried out to recover gold, silver and valuable metals from the printed circuit boards (PCBs) of waste computers. PCBs samples were crushed under 1 mm by a shredder and separated into 30% conducting and loft nonconducting materials by an electrostatic separator. The conducting materials contained valuable metals which were then used as feed materials for magnetic separation. 42% of magnetic materials from the conducting materials was removed by magnetic separation as nonvaluable materials and the others, 58% of non magnetic materials, was used as leaching samples containing 0.227 mg/g Au and 0.697 mg/g Ag. Using the materials of leaching from magnetic separation, more than 95% of copper, iron, zinc, nickel and aluminium was dissolved in 2.0M sulfuric acid solution, added with 0.2M hydrogen peroxide at $85^{\circ}C$. Au and Ag were not extracted in this solution. On the other hand, more than 95% of gold and 100% of silver were leached by the selective leaching with a mixed solvent (0.2M($NH_4$)$_2$$S_2$$O_3$,0.02M $CuSO_4$,0.4M $NH_4$OH). Finally, the residues were reacted with a NaCl solution to leach Pb whereas sulfuric acid was used to leach Sn. Recoveries reached 95% and 98% in solution, respectively.

• Resources Recycling
• /
• v.27 no.5
• /
• pp.14-22
• /
• 2018

In this study, scarp of PCB containing copper and precious metals was manufactured as an anode, and electrorefining experiments were conducted on change of $H_2SO_4$ concentration and current density. Through electrolytic refining experiments, the concentration of Cu and slime recovered from each electrode was analyzed, element behavior was confirmed, and current efficiency was also calculated. As the $H_2SO_4$ concentration was increased, the current efficiency and the purity of Cu decreased, but the precious metals in the anode slime were maximally concentrated with 2.0 M $H_2SO_4$. In addition, as the current density was increased, the current efficiency decreased and the purity of Cu showed a tendency to increase, and the precious metals in the anode slime were maximally concentrated with $300A/m^2$. As a result of the pilot scale experiments, the Au content was 8,705 mg/kg, the Ag content was 35,092 mg/kg in the anode slime. As compared with the initial content, Au was concentrated 16 times and Ag concentrated 14 times.

• Journal of Conservation Science
• /
• v.37 no.5
• /
• pp.451-463
• /
• 2021

In this study we conducted component analyses of portable XRF detectors using four Au-Cu alloy standard samples to improve their accuracy by drawing up a calibration curve based on ICP-OES standard values. The portable XRF analysis found absolute errors of 0.3 to 3.7 wt% for Au and 0.2 to 8.2 wt% for Cu, confirming that the error range and standard deviation differed from one detector to another. Furthermore, the calibration curve improved their accuracy, such that the relative error rates of Au and Cu decreased from 9.8% and 14% to 3.5% and 3.7%, respectively. Accordingly, an experiment to confirm the calibration curve was conducted using unknown samples, finding that the measured values of the unknown samples fell on the calibration curve. Therefore, to accurately analyze the components of metal cultural heritage items, it is necessary to prepare a calibration curve for each element after checking whether the detector is suitable for the artifact.

• Korean Journal of Metals and Materials
• /
• v.48 no.11
• /
• pp.1041-1046
• /
• 2010

The reactions between a Sn-3.0Ag-0.5Cu solder alloy and electroless Ni/electroless Pd/immersion Au (ENEPIG) surface finishes with various Pd layer thicknesses (0, 0.05, 0.1, 0.2, $0.4{\mu}m$) were examined for the effect of the Pd layer on the massive spalling of the $(Cu,Ni)_6Sn_5$ layer during reflow at $235^{\circ}C$. The thin layer deposition of an electroless Pd (EP) between the electroless Ni ($7{\mu}m$) and immersion Au ($0.06{\mu}m$) plating on the Cu substrate significantly retarded the massive spalling of the $(Cu,Ni)_6Sn_5$ layer during reflow. Its retarding effect increased with an increasing EP layer thickness. When the EP layer was thin (${\leq}0.1{\mu}m$), the retardation of the massive spalling was attributed to a reduced growth rate of the $(Cu,Ni)_6Sn_5$ layer and thus to a lowered consumption rate of Cu in the bulk solder during reflow. However, when the EP layer was thick (${\geq}0.2{\mu}m$), the initially dissolved Pd atoms in the molten solder resettled as $(Pd,Ni)Sn_4$ precipitates near the solder/$(Cu,Ni)_6Sn_5$ interface with an increasing reflow time. Since the Pd resettlement requires a continuous Ni supply across the $(Cu,Ni)_6Sn_5$ layer from the Ni(P) substrate, it suppressed the formation of $(Ni,Cu)_3Sn_4$ at the $(Cu,Ni)_6Sn_5/Ni(P)$ interface and retarded the massive spalling of the $(Cu,Ni)_6Sn_5$ layer.

• Proceedings of the Korean Biophysical Society Conference
• /
• 2003.06a
• /
• pp.75-75
• /
• 2003

We report here the results on N-acetyl-N'-dimethylamide of proline (Ac-Pro-NM $e_2$) calculated using the ab initio molecular orbital method with the self-consistent reaction field (SCRF) theory at the HF level with the 6-31+G(d) basis set to investigate the conformational preference of polyproline depending on the cis/trans peptide bonds and down/up puckerings along the backbone torsion angle $\square$ in the gas phase, chloroform, and water. In the gas phase, Ac-Pro-NM $e_2$ has seven local minima of tFd, tFu, cFd, cFu, cAu, tAu, and cAd conformations. In particular, polyproline conformations tFd, tFu, cFd, and cFu are found to be more stable than $\square$-helical conformations cAu, tAu, and cAd. In contrast, Ac-Pro-NHMe has seven local minima of tCd, tCu, cBd, cAu, tAu, cFd, and cFu conformations. Conformations tCd and tCu are found to be most stable, which is ascribed to the intramolecular hydrogen bond between C=O of acetyl group and $N^{~}$ H of N'-methyl amide group. The stability of the cFd conformation (i.e., the polyproline I structure) in chloroform is somewhat increased, relative to that in water, although tFd and tFu conformations (i.e., the polyproline II structure) are dominate both in chloroform and water. The population of backbone conformations feasible in chloroform and water is consistent with the experiments. This work is supported by a Korea Research Foundation Grant (KRF-2002-041-C00129).

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2003.04a
• /
• pp.203-205
• /
• 2003

레이저 다이오드를 p-side-down 방식으로 본딩하기 위하여 AuSn 솔더합금을 증착한 후 온도와 압력, 시간을 변화시켜 본딩상태를 조사하였다. CuW위에 adhsion layer와 확산방지층을 각각 $500{\AA}$과 $2000{\AA}$을 증착하였으며 솔더층으로 AuSn을 $2.6{\mu}m$ 증착 하였다. 열처리는 질소 분위기에서 행하였으며, 표면의 거칠기는 AFM으로 측정하였다.

• Nuclear Engineering and Technology
• /
• v.54 no.3
• /
• pp.959-964
• /
• 2022

Lead is an important material, both for fusion or fission reactors. The cross sections of natural lead should be validated because lead is a main component of lithium-lead modules suggested for fusion power plants and it directly affects the crucial variable, tritium breeding ratio. The presented study discusses a validation of the lead transport libraries by dint of the activation of carefully selected activation samples. The high emission standard ²⁵²Cf neutron source was used as a neutron source for the presented validation experiment. In the irradiation setup, the samples were placed behind 5 and 10 cm of the lead material. Samples were measured using a gamma spectrometry to infer the reaction rate and compared with MCNP6 calculations using ENDF/B-VIII.0 lead cross sections. The experiment used validated IRDFF-II dosimetric reactions to validate lead cross sections, namely ¹⁹⁷Au(n, 2n)¹⁹⁶Au, ⁵⁸Ni(n,p)⁵⁸Co, ⁹³Nb(n, 2n)^92mNb, ¹¹⁵In(n,n')^115mIn, ¹¹⁵In(n,γ)^116mIn, ¹⁹⁷Au(n,γ)¹⁹⁸Au and ⁶³Cu(n,γ)⁶⁴Cu reactions. The threshold reactions agree reasonably with calculations; however, the experimental data suggests a higher thermal neutron flux behind lead bricks. The paper also suggests ²⁵²Cf isotropic source as a valuable tool for validation of some cross-sections important for fusion applications, i.e. reactions on structural materials, e.g. Cu, Pb, etc.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.18 no.4
• /
• pp.608-613
• /
• 2017

We proposed a pyrometallurgical process to achieve gold alloy with an Au content of more than 80wt% from low grade (<35wt%) gold alloys. We performed the heat treatment at a temperature of $1200^{\circ}C$ for 5 hrs using Au35wt%-Ag5wt%-Cu60wt% gold alloys mixed with 1/2 weighed PbO and CaO flux by varying the ratio of PbO/(PbO+CaO) from 0 to 1. We investigated the change in content of the samples with energy dispersive X-ray spectroscopy (EDS) and time of flight secondary ion mass spectrometry (ToF-SIMS). The EDS results showed that the Au content increased from 35.0wt% in the PbO-only sample to 86.7wt% (in the PbO/(PbO+CaO) 1:1 sample), while the other samples achieved more that 84wt%. In addition, the 2/3 flux ratio sample showed the lowest Ag loss into the flux. In the ToF-SIMS results, the PbO only and CaO only fluxes had Au+ peak intensities of 349 and 37, respectively. Although the CaO-only flux might be more favorable considering the loss of Au into the flux, we concluded that the amount of Au lost into the flux could be ignored. Our results imply that that the pyrometallurgical process using a mixed flux is an effective hydrometallurgical process.

• The Journal of Korean Academy of Prosthodontics
• /
• v.23 no.1
• /
• pp.39-59
• /
• 1985

The purpose of this study was to investigate how gap distances of 0.13mm, 0.15mm, 0.20mm, and 0.30mm affects solder joint strength from gold alloys and nickel-chromium base alloys and to examine the composition of solder gold, the solder joint of gold alloys and nickel-chromium base alloys. The tensile test specimens were prepared in the split stainless steel mold with a half dumbbell shape 2.5mm in diameter and l2mm in length. 6 pairs of specimens of each gap distance group of gold alloys and nickel-chromium base alloys were made and 48 pairs of all specimens were soldered with solder gold of 666 fineness. All soldered specimens were machined to a uniform diameter and then a tensile load was applied at a cross-head speed of 0.10mm/min using Instron Universal Testing Machine, Model 1115. The fractured specimens at solder gold of solder joint fracture with each gap distance of 0.13mm, 0.15mm, 0.20mm, and 0.30mm were examined under the Scanning Electron Microscope, JSM-35c and the composition of solder gold, the solder joint of gold alloys and nickel-chromium base alloys was analyzed by Electron Probe Micro Analyzer. The results of this study were obtained as follows: 1. In case of soldering of gold alloys, the tensile strength between gold alloys showed $37.33{\pm}2.52kg/mm^2$ at 0.13, $39.14{\pm}3.35kg/mm^2$ at 0.15mm, $43.76{\pm}2.97kg/mm^2$ at 0.20mm, and $49.18{\pm}4.60kg/mm^2$ at 0.30mm. There was statistically significant difference at each gap distance, and so the greater increase of gap distance showed the greater tensile strength. 2. In case of soldering of nickel-chromium base alloys, the tensile strength between nickel-chromium base alloys showed $34.84{\pm}4.26kg/mm^2$ at 0.13mm, $37.25{\pm}2.49kg/mm^2$ at 0.15mm, $42.91{\pm}4.32kg/mm^2$ at 0.20mm, and $46.93{\pm}4.21kg/mm^2$ at 0.30mm. There was not statistically significant difference only between 0.13mm and 0.15mm and bet ween 0.20 mm and 0.30mm, but generally the greater increase of gap distance showed the greater tensile strength. 3. The greater increase of gap distance shoed less porosities in solder gold at solder joint fracture. 4. In solder gold Au, Cu, Ag, Zn, and Sn were composed and Au and Cu were mostly distributed uniformly. 5. In solder joints of solder gold and gold alloys Au, Cu, Ag, Zn, and Sn were composed in solder gold and Au, Cu, Ag, Pt, and Pd were composed in gold alloys. Au and Cu of solder gold and gold alloys were mostly distributed uniformly and the diffusion of other elements except Pt and Pd around the solder joint was not almost found. In solder joints of solder gold and nickel-chromium base alloys Au, Cu, Ag, Zn, and Sn were composed in solder gold and Ni, Cr, and Al were composed in nickel-chromium base alloys. Au and Cu of solder gold and Ni and Cr of nickel-chromium base alloys were mostly distributed uniformly and the diffusion of other elements except Cr around the solder joint was not almost found.