• Journal of Powder Materials
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• v.30 no.4
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• pp.318-323
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• 2023

The thermoelectric effect, which converts waste heat into electricity, holds promise as a renewable energy technology. Recently, bismuth telluride (Bi2Te3)-based alloys are being recognized as important materials for practical applications in the temperature range from room temperature to 500 K. However, conventional sintering processes impose limitations on shape-changeable and tailorable Bi₂Te₃ materials. To overcome these issues, three-dimensional (3D) printing (additive manufacturing) is being adopted. Although some research results have been reported, relatively few studies on 3D printed thermoelectric materials are being carried out. In this study, we utilize extrusion 3D printing to manufacture n-type Bi_1.7Sb_0.3Te₃ (N-BST). The ink is produced without using organic binders, which could negatively influence its thermoelectric properties. Furthermore, we introduce graphene oxide (GO) at the crystal interface to enhance the electrical properties. The formed N-BST composites exhibit significantly improved electrical conductivity and a higher Seebeck coefficient as the GO content increases. Therefore, we propose that the combination of the extrusion 3D printing process (Direct Ink Writing, DIW) and the incorporation of GO into N-BST offers a convenient and effective approach for achieving higher thermoelectric efficiency.

• Bulletin of the Korean Chemical Society
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• v.19 no.12
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• pp.1283-1293
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• 1998

A solid state chemical approach to discover new mateials with enhanced thermoelectric properties is described. The aim is to construct three-dimensional bismuth chalcogenide framework structures which contain tonically interacting alkali or alkaline earth atoms. The alkali atoms tend to have soft "rattling" type phonon modes which result in very low thermal conductivity in these materials. Another desirable feature in this class of compounds is the low crystal symmetry and narrow band-gaps. Several promising materials such as BaBiTe3, KBi6.33S10, K2Bi8S13, β-K2Bi8Se13, K2.5Bi8.5Se14, Ba4Bi6Se13, Eu2Pb2Bi6Se13, Al1+xPb4-2xSb7+xSe15 (A=K, Rb), and CsBi4Te6 are described.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.161-161
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• 2010

InAsSb alloy system 은 HgCdTe 를 대체하는 적외선 광소자 및 검출기 등에 응용이 가능한 유망한 물질이지만 정확한 유전함수 및 전이점의 연구는 미흡한 실정이다. 본 연구에서는 타원 편광 분석법을 이용하여 1.5 ~ 6 eV 의 분광 영역에서 As 조성비를 각기 (x = 0, 0.127, 0.337, 0.491, 0.726 및 1.00) 다르게 한 $InAs_xSb_{1-x}$ alloy의 유전함수를 측정하였다. 또한 표면에 자연산화막을 제거하기 위하여 Methanol 과 DI Water 로 표면을 세척 한 후 $NH_4OH$, Br in Methanol, HCl 등으로 적절한 화학적 에칭을 하여 산화막을 제거함으로서 순수한 InAsSb 의 유전함수를 측정할 수 있었다. 측정된 InAsSb 유전함수를 Standard analytic critical point line shape 방법으로 As 조성비에 따른 에너지 전이점을 얻을 수 있었다. 또한 얻어진 에너지 전이점 값을 이용하여 linear augmented Slater-type orbital 방법으로 전자 밴드 구조 계산을 하였고, 이를 바탕으로 $E_0$, $E_1$, $E_2$ 전이점 지역의 여러 전이점 ($E_1$, $E_1+\Delta_1$, $E_0'$, $E_0'+\Delta_0'$, $E_2$, $E_2+\Delta_2$, $E_2'$, $E_2'+\Delta_2$, $E_1'$) 의 특성을 정확히 정의할 수 있었다. 또한 As 조성비가 증가하면서 $E_2$, $E_2+\Delta_2$, $E_2'$, $E_2'+\Delta_2$ 전이점들이 서로 교차 되는 것을 발견하였고, 저온에서만 관측이 가능하였던 InSb 의 두 saddle-point (${\Delta_5}^{cu}-{\Delta_5}^{vu}$, ${\Delta_5}^{cl}-{\Delta_5}^{vu}$)를 상온에서 찾아내었다. 타원 편광 분석법을 이용한 전이점 연구 및 물성 분석은 InAsSb alloy 의 광학적 데이터베이스를 확보하는 성과와 더불어 새로운 디바이스기술 및 광통신 산업에도 유용한 정보가 될 것이다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.178-178
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• 2008

초소형 박막의 열전 발전모듈은 작은 부피와 한번 설치시 교체없이 지속적인 전원공급으로 소형의 센서 노드에 전원으로 각광 받고 있다. 이에 본 논문에서는 In Plane방식의 PIN Junction의 박막형 열전소자를 제작하여 보았다. 열전 박막인 P-type의 $BiSbTe_3$와 N-type의 $Bi_2Te_3$은 (001)GaAs 기판에 MOCVD(Metal Organic Chemical Vapour Deposition)방식으로 성장하였으며 전극으로는 E-Beam Evaporator를 이용하여 금(Au), 알루미늄(Al)을 사용하였다. 열전박막의 두께는 MOCVD의 성장시간과 온도 MO-x 가스의 압력으로 조절하여 주었다. 제작결과 1Pairs 당 약 $63{\mu}V$/K을 나타내었다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.142-142
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• 2007

Micro thermoelectric generator has been attractive for the alternative power source to operate the wireless sensor node. In this paper, we designed the column-type micro thermoelectric device and their device characteristics were measured. n-type Bi2Te3 and p-type BiSbTe3 thermoelectric thin films were grown on (001) GaAs substrates by metal organic chemical vapour deposition (MOCVD) and they were pattemed. The height of thermoelectric film were controlled by the deposition time, temperature and MO-x gas pressure. Seebeck coefficient was measured at room temperature and hole concentration and electrical resistivity of thermoelectric film were also characterized.

• Journal of the Korean earth science society
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• v.22 no.3
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• pp.208-222
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• 2001

Geochemical investigations on suspended amorphous iron oxide material from the Kwangyang gold mine and its surrounding area, Cheonnam, Korea have been carried out. The sediments samples were collected from 11 location along Kwangyang mine area and were air dried and sieved to -80 mesh. These samples consist mainly of iron, silicon and alumina. The Fe$_2$O$_3$ contents ranges from 17.9 wt.% to 72.3 wt.%. The content of Fe$_2$O$_3$ increase with decreasing Si, Al, Mg, Na, K, Mn, and Ti, whereas the contents of Te, Au, Ga, Bi, Cd, Hg, Sb, and Se increase in the amorphous stream sediments. Amorphous stream sediments have been severely enriched for As (up to 54.9 ppm), Bi (up to 3.77 ppm), Cd (up to 3.65 ppm), Hg (up to 64 ppm), Sb (up to 10.1 ppm), Cu (up to 37.1 ppm), Mo (up to 8.86 ppm), Pb (up to 9.45 ppm) and Zn (up to 29.7 ppm). At the upstream site, the Au content (up to 4.4 ppm) in the amorphous stream sediments are relatively high but those contents decrease with distance of mine location. The content of Ag (up to 0.24 ppm) were low in upstream site but those contents increase significantly in the downstream sites. The X-ray diffraction patterns of the samples have virtually no sharp and discrete peaks, indicating that some samples are amorphous or poorly-ordered. The quartz, goethite, kaolinite and illite were associated in amorphous stream sediments. The infrared spectra for amorphous stream sediments show major absorption bands due to OH stretching, adsorbed molecular water, sulfate and Fe-O stretching, respectively.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.67-74
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• 2018

Thermoelectric thin film modules were fabricated by electroplating p-type $Sb_2Te_3$and n-type $Bi_2Te_3$ thin film legs with the same thickness of $20{\mu}m$ and different diameters of $100{\mu}m$, $300{\mu}m$, and $500{\mu}m$, respectively. The output voltage and output power of thin film modules were measured and compared as a function of the leg diameter. The modules processed with thin film legs of $100{\mu}m$, $300{\mu}m$, and $500{\mu}m$-diameter exhibited open circuit voltages of 365 mV at ${\Delta}T=36.7K$, 142 mV at ${\Delta}T=37.5K$, and 53 mV at ${\Delta}T=36.1K$, respectively. Maximum output powers of $845{\mu}W$ at ${\Delta}T=36.7K$, $631{\mu}W$ at ${\Delta}T=37.5K$, and $276{\mu}W$ at ${\Delta}T=36.1K$ were obtained for the modules fabricated with the thin film legs of $100{\mu}m$, $300{\mu}m$, and $500{\mu}m$-diameter, respectively.

• Journal of the Korean Vacuum Society
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• v.19 no.2
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• pp.155-160
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• 2010

The effect of process temperature of a final annealing step in the fabrication of phase change memory (PCM) devices was investigated. Discrete PCM devices employing $Ge_2Sb_2Te_5$ (GST) films as an active element were made in a pore-style configuration, and they were annealed at various temperatures ranging from 160 to $300^{\circ}C$. The behaviors of cell resistance change from SET resistance to RESET resistance were totally different according to the annealing temperatures. There was a critical annealing temperature for the fabrication of normal PCM devices and abnormal operations were observed in some devices annealed at temperatures lower or higher than the critical temperature. Those influences of annealing temperature seem closely related to the thermal stability of a top electrode/GST/heating layer multilayer structure in the PCM devices.

• Proceedings of the Korean Vacuum Society Conference
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• 2015.08a
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• pp.170.1-170.1
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• 2015

안티모니 (Sb)를 기반으로 한 제2형 초격자 (Type II superlattice, T2SL)구조 적외선 검출기 연구는 2000년대 들어 Sb 계열의 화합물 반도체 성장 기술이 발전함에 따라 HgCdTe (MCT), InSb, 양자우물 적외선 검출기 (QWIP)를 대체할 수 있는 고성능의 양자형 적외선 검출 소재로 부상하였으며, 현재 전 세계적으로 활발한 연구가 진행되고 있다. 특히, 기존의 양자형 적외선 검출소자에 비해 전자의 유효질량이 상대적으로 커서 밴드 간의 투과전류가 줄어들 뿐만 아니라, 전자와 정공이 서로 다른 물질 영역에 분포하여 Auger 재결합률을 효과적으로 줄일 수 있어 상온 동작이 가능한 소재로 주목을 받고 있다. 또한, T2SL 구조는 초격자를 구성하는 물질의 두께나 조성 변화를 통한 밴드갭 변조가 용이하여 단파장에서 장파장 적외선에 이르는 광범위한 파장 대역에서 동작이 가능할 뿐만 아니라 구조적 변화를 통해 이중 대역을 동시에 검출 할 수 있는 차세대 적외선 열영상 소자로 알려져 있다. 본 연구에서는 분자선 에피택시(MBE)법을 이용하여 300 주기의 InAs/GaSb (10/10 ML) 제2형 초격자 구조를 성장하여 적외선 검출소자를 제작하였다. 제2형 초격자 구조를 구성하는 물질계에 p-type dopant인 Be을 이용하여 각각 도핑 농도가 다른 시료를 성장하였다. 이때 p-type 도핑 농도는 각각 $1/5/10{\times}10^{15}cm^{-3}$로 변화를 주었다. 성장된 시료의 구조적 특성 분석을 위해 고분해능 X선 회절 (High resolution X-ray diffraction, HRXRD)법을 이용하였으며, 초격자 한 주기의 두께가 6.2~6.4 nm 로 설계된 구조와 동일하게 성장됨을 확인 하였으며, 1차 위성피크의 반치폭은 30~80 arcsec로 우수한 결정성을 가짐을 확인하였다. 적외선 검출을 위한 $410{\times}410{\mu}m^2$ 크기의 단위 소자 공정을 진행하였으며 이때 적외선의 전면 입사를 위해 소자 위에 $300{\mu}m$의 윈도우 창을 제작하였다. 단위 소자의 측벽에는 표면 누설 전류가 흐르는데 이를 방지하기 위해서 표면보호막을 증착하였다. 적외선 검출 소자의 전기적 특성 평가를 위해 각각의 시료의 암전류 (dark current)와 파장별 반응 (spectral response)을 온도별로 측정하여 비교 및 분석하였다.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.18 no.3
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• pp.211-217
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• 2006

The three-dimensional numerical analysis has been carried out to figure out the effect of the thermoelectric element thickness on the thermal performance of the thermo-electric micro-cooler. The small-size and column-type thermoelectric cooler is considered. It is known that tellurium compounds currently have the highest cooling performance around the room temperature. Thus, in the present study, $Bi_{2}Te_{3}$ and $Sb_{2}Te_{3}$ are selected as the n- and p-type thermoelectric materials, respectively. The thermoelectric leg considered is less than $20{\mu}m$ thick. The thickness of the leg may affect the thermal and electrical transport through the interfaces between the leg and metal conductors. The effect of the thermoelectric element thickness on the thermal performance of the cooler has been investigated with parameters such as the temperature difference, the current, and the cooling power.