• Journal of the Semiconductor & Display Technology
• /
• v.22 no.3
• /
• pp.73-77
• /
• 2023

As the DeFi market continues to expand, fraudulent activities using smart contracts have also increased. HoneyPot and Ponzi schemes are well-known frauds that exploit smart contracts. While several studies have demonstrated the potential to detect smart contracts implementing these scams, there has been a lack of research focusing on simultaneously detecting both types of fraud. This paper addresses this gap by harnessing artificial intelligence to conduct experiments for the detection of both HoneyPot and Ponzi schemes. The study employs the CNN (Convolutional Neural Network) model, commonly used for malware detection. To effectively utilize CNN, the bytecode of smart contracts is transformed into visual representations. The experimental results showcase a recall rate of 0.89 and an F1 score of 0.85, indicating promising detection capabilities.

• Journal of the Semiconductor & Display Technology
• /
• v.23 no.1
• /
• pp.7-11
• /
• 2024

In the era of the 4th Industrial Revolution, new technologies such as artificial intelligence, big data, cloud, Internet of Things, and blockchain are being developed and applied to new industries. Blockchain has the characteristics of decentralization, security, and transparency, so it can serve as a core technology for developing new growth industries. Blockchain is provided as BaaS (Blockchain as a Service), but it is not easy for users who are introducing or building blockchain to choose BaaS. In this study, we identify evaluation factors and develop a decision-making model using fuzzy theory and AHP for BaaS selection. Eventually we aim to help companies choose the best BaaS and develop and commercialize blockchain-based services by developing a new decision-making model for BaaS selection.

• Electronics and Telecommunications Trends
• /
• v.35 no.3
• /
• pp.76-84
• /
• 2020

Neuromorphic hardware refers to brain-inspired computers or components that model an artificial neural network comprising densely connected parallel neurons and synapses. The major element in the widespread deployment of neural networks in embedded devices are efficient architecture for neuromorphic hardware with regard to performance, power consumption, and chip area. Spiking neural networks (SiNNs) are brain-inspired in which the communication among neurons is modeled in the form of spikes. Owing to brainlike operating modes, SNNs can be power efficient. However, issues still exist with research and actual application of SNNs. In this issue, we focus on the technology development cases and market trends of two typical tracks, which are listed above, from the point of view of artificial intelligence neuromorphic circuits and subsequently describe their future development prospects.

• Journal of the Semiconductor & Display Technology
• /
• v.22 no.1
• /
• pp.124-128
• /
• 2023

Semiconductor engineers have long sought to enhance the energy efficiency of mobile semiconductors by reducing their voltage. During the final stages of the semiconductor manufacturing process, the screening and evaluation of voltage is crucial. However, determining the optimal test start voltage presents a significant challenge as it can increase testing time. In the semiconductor manufacturing process, a wealth of test element group information is collected. If this information can be controlled to predict the test voltage, it could lead to a reduction in testing time and increase the probability of identifying the optimal voltage. To achieve this, this paper is exploring machine learning techniques, such as linear regression and ensemble models, that can leverage large amounts of information for voltage prediction. The outcomes of these machine learning methods not only demonstrate high consistency but can also be used for feature engineering to enhance accuracy in future processes.

• Journal of Advanced Navigation Technology
• /
• v.27 no.2
• /
• pp.235-246
• /
• 2023

In the rapid technological development of artificial intelligence (AI), electric vehicles, and robots based the fourth industrial revolution, semiconductors determine the core performance, and semiconductor competitiveness is directly related to national competitiveness. However, the Korean semiconductor industry has continuously weakened its competitiveness in the system semiconductor field, excluding memory semiconductors, so in this study, a new smart contract basedblockchain business model to engage the global market, which is the most urgent need for the growth of Korean fabless system semiconductor industry in recession. F-SBM (Fabless-Smart contract based Blockchain Model) proposed. In this study, through the new F-SBM, it was verified how to engage new customers for fabless firms through smart contract based consortium blockchain regarding technology, economy, and reliability items of fabless. This model has great significance in improving the high entry barriers to engaging new customers for the long-cherished desire of the Korean fabless system semiconductor industry and deriving new growth solutions.

• Electronics and Telecommunications Trends
• /
• v.36 no.3
• /
• pp.12-22
• /
• 2021

Since the technical realization of self-aligned planar complementary metal-oxide-semiconductor field-effect transistors in 1960s, semiconductor manufacturing has aggressively pursued scaling that fruitfully resulted in tremendous advancement in device performances and realization of features sizes smaller than 10 nm. Due to many intrinsic material and technical obstacles, continuing the scaling progress of semiconductor devices has become increasingly arduous. As an effort to circumvent the areal limit, stacking devices in a three-dimensional fashion has been suggested. This approach is commonly called monolithic three-dimensional (M3D) integration. In this work, we examined technical issues that need to be addressed and overcome to fully realize energy efficiency, short latency and cost competency. Full-fledged M3D technologies are expected to contribute to various new fields of artificial intelligence, autonomous gadgets and unknowns, which are to be discovered.

• Journal of the Korea Society for Simulation
• /
• v.26 no.4
• /
• pp.35-41
• /
• 2017

With the advances in Internet over Things, the demand in diverse electronic devices such as mobile phones and sensors has been rapidly increasing and boosting up the researches on those products. Semiconductor materials, devices, and fabrication processes are becoming more diverse and complicated, which accompanies finding parameters for an optimal fabrication process. In order to find the parameters, a process simulation before fabrication or a real-time process control system during fabrication can be used, but they lack incorporating the feedback from post-fabrication data and compatibility with older equipment. In this research, we have developed an artificial intelligence based simulator, which finds parameters for an optimal process and controls process equipment. In order to apply the control concept to all the equipment in a fabrication sequence, we have developed a prototype for a manipulator which can be installed over an existing buttons and knobs in the equipment and controls the equipment communicating with the AI over the Internet. The AI is based on the deep learning to find process parameters that will produce a device having target electrical characteristics. The proposed simulator can control existing equipment via the Internet to fabricate devices with desired performance and, therefore, it will help engineers to develop new devices efficiently and effectively.

• Journal of the Semiconductor & Display Technology
• /
• v.22 no.4
• /
• pp.124-130
• /
• 2023

Recently, fan out wafer level packaging, which enables high integration, miniaturization, and low cost, is being rapidly applied in the semiconductor industry. In particular, FOWLP is attracting attention in the mobile and Internet of Things fields, and is recognized as a core technology that will lead to technological advancements such as 5G, self-driving cars, and artificial intelligence in the future. However, as chip density and package size within the package increase, FOWLP warpage is emerging as a major problem. These problems have a direct impact on the reliability and electrical performance of semiconductor products, and in particular, cause defects such as vacuum leakage in the manufacturing process or lack of focus in the photolithography process, so technical demands for solving them are increasing. In this paper, warpage simulation according to the thickness of FOWLP material was performed using finite element analysis. The thickness range was based on the history of similar packages, and as a factor causing warpage, the curing temperature of the materials undergoing the curing process was applied and the difference in deformation due to the difference in thermal expansion coefficient between materials was used. At this time, the stacking order was reflected to reproduce warpage behavior similar to reality. After performing finite element analysis, the influence of each variable on causing warpage was defined, and based on this, it was confirmed that warpage was controlled as intended through design modifications.

• Proceedings of the KIEE Conference
• /
• 2007.04a
• /
• pp.86-88
• /
• 2007

In the semiconductor manufacturing industry, the heterodyne laser interferometer plays as an ultra-precise measurement system. However, the heterodyne laser interferometer has some unwanted nonlinearity error which is caused from frequency-mixing. This is an obstacle to improve the measurement accuracy in nanometer scale. In this paper we propose a compensation algorithm based on RLS(recursive least square) method and artificial intelligence method, which reduce the nonlinearity error in the heterodyne laser interferometer. With the capacitance displacement sensor we get a reference signal which can be transformed into the intensity domain. Using the back-propagation Neural Network method, we train the network to track the reference signal. Through some experiments, we demonstrate the effectiveness of the proposed algorithm in measurement accuracy.

• Proceedings of the Korean Society of Computer Information Conference
• /
• 2022.01a
• /
• pp.393-394
• /
• 2022

본 논문에서는 과학기술정보통신부와 통계청에서 주관하고 한국산업인력공단에서 시행(한국데이터산업진흥원 위탁)하는 「빅데이터분석기사」에 대한 필기 및 실기 시험의 내용을 설명하고 지금까지 2회에 걸쳐 시행된 시험에 대한 문제점과 이에 대한 해결방안을 제시하였다. 2021년 처음 시행된 국가기술자격으로써 기존 자격증과의 차별성, 난이도 조정, 수험생들의 각종 민원 발생 등의 문제를 해결하기 위한 체계적인 시스템 마련이 요구되며, 향후 데이터 과학자들에 대한 수요 급증에 대비하기 위해 빅데이터분석 실무 능력을 평가하기 위한 바람직한 제도와 정책이 병행되어야 한다.