• Title/Summary/Keyword: Array test

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Solar Array Deployment Analysis of a Satellite (인공위성 태양전지판 전개해석)

  • Kim, Kyung-Won;Kim, Sun-Won;Lim, Jae-Hyuk;Rhee, Ju-Hun;Hwang, Do-Soon;Jin, Ik-Min;Kim, Hak-Jung;Song, Woon-Hyung;Choi, Hang-Suk
    • Journal of Satellite, Information and Communications
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    • v.3 no.1
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    • pp.29-34
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    • 2008
  • After spacecraft is separated from the launch vehicle, first of all spacecraft deploy the solar array. Solar array deployment is one of the key factors deciding the success of the spacecraft mission. Therefore, It is necessary to predict the solar array deployment motion and check the safety through calculating the load on the tape hinges of solar array using the deployment analysis in the initial design phase. In this paper, solar array deployment analysis is performed by multi-body dynamics simulation program. From the analysis results, assessment on the safety also is carried out. In addition, hinge characteristic test is fulfilled to find out hinge characteristic, and is applied to the deployment analysis.

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GPS Array Antenna Installation On The Rear Missile Body (위성항법 배열안테나의 유도탄 동체 후방 배치)

  • Park, Bumsoo;Ahn, Woogeun;Lee, Jangyong;Ko, Duck kon
    • Journal of Advanced Navigation Technology
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    • v.26 no.1
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    • pp.9-14
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    • 2022
  • In this paper we investigate the advantages when the GPS Antenna is installed on the rear missile body. In conventional design the GPS antenna locates on the front part of missile. However it causes degraded GPS positioning performance since the missile body blocks the GPS signals. This paper proposes the GPS array antenna design which locates on the rear part of missile body and has the tilted antenna patches to achieve the maximum area of receiving GPS signals. We simulate LOS region of receiving signals and conducted anechoic chamber test to define the effective signal receiving region. And we conduct field test and flight test to check out the enhancement of signal receiving area.

DEVELOPMENT OF THE READOUT CONTROLLER FOR INFRARED ARRAY (적외선검출기 READOUT CONTROLLER 개발)

  • Cho, Seoung-Hyun;Jin, Ho;Nam, Uk-Won;Cha, Sang-Mok;Lee, Sung-Ho;Yuk, In-Soo;Park, Young-Sik;Pak, Soo-Jong;Han, Won-Yong;Kim, Sung-Soo
    • Publications of The Korean Astronomical Society
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    • v.21 no.2
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    • pp.67-74
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    • 2006
  • We have developed a control electronics system for an infrared detector array of KASINICS (KASI Near Infrared Camera System), which is a new ground-based instrument of the Korea Astronomy and Space science Institute (KASI). Equipped with a $512{\times}512$ InSb array (ALADDIN III Quadrant, manufactured by Raytheon) sensitive from 1 to $5{\mu}m$, KASINICS will be used at J, H, Ks, and L-bands. The controller consists of DSP(Digital Signal Processor), Bias, Clock, and Video boards which are installed on a single VME-bus backplane. TMS320C6713DSP, FPGA(Field Programmable Gate Array), and 384-MB SDRAM(Synchronous Dynamic Random Access Memory) are included in the DSP board. DSP board manages entire electronics system, generates digital clock patterns and communicates with a PC using USB 2.0 interface. The clock patterns are downloaded from a PC and stored on the FPGA. UART is used for the communication with peripherals. Video board has 4 channel ADC which converts video signal into 16-bit digital numbers. Two video boards are installed on the controller for ALADDIN array. The Bias board provides 16 dc bias voltages and the Clock board has 15 clock channels. We have also coded a DSP firmware and a test version of control software in C-language. The controller is flexible enough to operate a wide range of IR array and CCD. Operational tests of the controller have been successfully finished using a test ROIC (Read-Out Integrated Circuit).

The Effect of Reliability Test on Failure mode for Flip-Chip BGA C4 bump (FC-BGA C4 bump의 신뢰성 평가에 따른 파괴모드 연구)

  • Huh, Seok-Hwan;Kim, Kang-Dong;Jang, Jung-Soon
    • Journal of the Microelectronics and Packaging Society
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    • v.18 no.3
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    • pp.45-52
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    • 2011
  • It is known that test methods to evaluate solder joint reliability are die shock test, die shear test, 3points bending test, and thermal shock test. The present study investigated the effects of failure mode on 3 types (as-reflowed, $85^{\circ}C$/85%RH treatment, and $150^{\circ}C$/10hr aging) of solder joints for flip-chip BGA package by using various test methods. The test methods and configurations are reported in detail, i.e. die shock, die shear, 3points bending, and thermal shock test. We focus on the failure mode of solder joints under various tests. The test results indicate that die shock and die shear test method can reveal brittle fracture in flip-chip ball grid array (FCBGA) packages with higher sensitivity.

Sensitivity Analysis of Material and Process Variables Affecting on the Stamping Formability (재료변수와 공정변수가 스템핑 성형성에 미치는 영향 연구)

  • Kim, Youngsuk;Park, KeeChul
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.20 no.7
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    • pp.2246-2256
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    • 1996
  • To investigate the effect of material and precess variables on stamping formability of sheet materials, simulations for the cup drawing and the Yoshida buckling test were carried out using ABAQUS, commercial nonlinear finite element analysis code. The various factor effects on stamping formability of sheet materials were analyzed by the designed process according to Taguch's orthogonal array experiment. Cup drawing simulation showed that local neckling was very sensitive to plastic anisotropy parameter of sheet material and friction coefficient between sheet and tool interface. Simulations for the Yoshida buckling test have clarified that buckling behaviour of sheet material was mostly susceptible to yield stress and sheet thickness mostly. However, plastic anisotropy parameter and strain hardening coefficient affect moderately buckling behaviour of steel sheets after the buckling initiation.

The Study on Cutting Characteristic according to a Shape, Size and Array of Cutter for Paper Shredder (문서세단기의 커터날 형상, 크기, 배열과 절단특성에 관한 연구)

  • Lee, Wi-Ro;Lee, Dong-Gyu;Kim, Min-Ho
    • Journal of the Korean Society for Precision Engineering
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    • v.23 no.1 s.178
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    • pp.56-63
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    • 2006
  • The aim of this study is to find the best cutting conditions as analyzing cutting process of paper shredder and shape of cutter. The test has been done variation of torque and cutting velocity according to load. When shape of cutter and distance between cutter and shaft are changed, The variation of cutting force according to cutting angle and load is geometrically analyzed. The result of geometrical analysis is presented that the radius and array of cutter is the method to improve torque of paper shredder. In this paper it is presented as basic method of design to improve cutting performance of paper shredder.

Design of FFT processor with systolic architecture (시스토릭 아키텍쳐를 갖는 FFT 프로세서의 설계)

  • Kang, B.H.;Jeong, S.W.;Lee, J.K.;Choi, B.Y.;Shin, K.W.;Lee, M.K.
    • Proceedings of the KIEE Conference
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    • 1987.07b
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    • pp.1488-1491
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    • 1987
  • This paper describes 16-point FFT processor using systolic array and its implementation into VLSI. Designed FFT processor executes FFT/IFFT arithmetic under mode control and consists of cell array, array controller and input/output buffer memory. For design for testibility, we added built-in self test circuit into designed FFT processor. To verify designed 16-point FFT processor, logic simulation was performed by YSLOG on MICRO-VAXII. From the simulation results, it is estimated that the proposed FFT processor can perform 16-point FFT in about 4400[ns].

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Optimal Design of Robot-Arm using Design of Experiments (실험 계획법을 이용한 로봇 암부위 최적설계)

  • Chung W.J.;Kim J.H.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2006.05a
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    • pp.395-396
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    • 2006
  • This paper presents the optimal design of Robot-Arm part use Design of Experiment(DOE). The DOE(Design of Experiment)was conducted to find out main effect factors for design of Robot-Arm part. In this design of Robot-Arm, 5 control factors include numbers of 4 level are selected and we make out L16 orthogonal array. Using this orthogonal array, find out optimal value and main effect factors of object function for design of Robot-Arm part by 16 times of test. We evidence this optimal value by using CATIA V5 Analysis.

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Simulation of Ultrasonic Beam Focusing on a Defect in Anisotropic, Inhomogeneous Media

  • Jeong, Hyun-Jo;Cho, Sung-Jong;Erdenetuya, Sharaa;Jung, Duck-Yong
    • Journal of the Korean Society for Nondestructive Testing
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    • v.31 no.6
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    • pp.635-641
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    • 2011
  • In ultrasonic testing of dissimilar metal welds, application of phased array technique in terms of incident beam focusing is not easy because of complicated material structures formed during the multi-pass welding process. Time reversal(TR) techniques can overcome some limitations of phased array since they are self-focusing that does not depend on the geometrical and physical properties of testing components. In this paper, we test the possibility of TR focusing on a defect within anisotropic, heterogeneous austenitic welds. A commercial simulation software is employed for TR focusing and imaging of a side-drilled hole. The performance of time reversed adaptive focal law is compared with those of calculated focal laws for both anisotropic and isotropic welds.

An Array-Based Sensor for Seafood Freshness Assessment

  • Gonzalez-Martin, Anuncia;Lewis, Brian;Raducanu, Marius;Kim, Jin-Seong
    • Bulletin of the Korean Chemical Society
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    • v.31 no.11
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    • pp.3084-3092
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    • 2010
  • This paper describes the development of an automated, hand-held sensor for the fast assessment of seafood freshness. The sensor developed here combined: an array-based chemical sensor, composed of incrementally different conducting polymer elements deposited on a small chip; a highly sensitive, custom-made electronics for the detection of very small signal changes; precise temperature control of the sensor chamber; and an on-board microcontroller for data collection, storage, automation, and analysis. The instrument was used to successfully test seafood samples with different degree of freshness and spoilage. A linear relationship between microbiological count and e-Nose signal for three different fish fillet was developed. Once the linear relationship is included into the hand-held unit software, the e-Nose signal can be used for assessment of seafood freshness without performing the microbiological count technique.