• Journal of the Semiconductor & Display Technology
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• v.22 no.1
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• pp.23-27
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• 2023

Organic light-emitting diode(OLED) is very thin organic films which are hundreds of nanometers. Unlike bottom-emission OLED(BEOLED), top-emission OLED(TEOLED) emits light out the front, opaque moisture absorbents or metal foils can't be used to prevent moisture and oxygen. And it is difficult to have flexible characteristics with glass encapsulation, so thin film encapsulation which can compensate for those two disadvantages is mainly used. In this study, Al₂O₃ thin films by atomic layer deposition(ALD) were examined by changing the argon gas purge flow rate and we applied this Al₂O₃ thin films to the encapsulation of TEOLED. Ag / ITO / N,N'-Di-[(1-naphthyl)-N,N'-diphenyl]-1,1'-biphenyl-4,4'-diamine / tris-(8-hydroxyquinoline) aluminum/ LiF / Mg:Ag (1:9) were used to fabricate OLED device. The characteristics such as brightness, current density, and power efficiency are compared. And it was confirmed that with a thickness of 40 nm Al₂O₃ thin film encapsulation process did not affect OLED properties. And it was enough to maintain a proper OLED operation for about 9 hours.

• Nuclear Engineering and Technology
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• v.50 no.5
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• pp.724-730
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• 2018

Chromium and chromium nitride were selected as potential barriers to prevent fuel-clad chemical interaction (FCCI) between the cladding and the fuel material. In this study, ferritic/martensitic HT-9 steel and misch metal were used to simulate the reaction between the cladding and fuel fission product, respectively. Radio frequency magnetron sputtering was used to deposit Cr and CrN films onto the cladding, and the gas flow rates of argon and nitrogen were fixed at certain values for each sample to control the deposition rate and the crystal structure of the films. The samples were heated for 24 h at 933 K through the diffusion couple test, and considerable amount of interdiffusion (max. thickness: $550{\mu}m$) occurred at the interface between HT-9 and misch metal when the argon and nitrogen were used individually. The elemental contents of misch metal were detected at the HT-9 through energy dispersive X-ray spectroscopy due to the interdiffusion. However, the specimens that were sputtered by mixed gases (Ar and $N_2$) exhibited excellent resistance to FCCI. The thickness of these CrN films were only $4{\mu}m$, but these films effectively prevented the FCCI due to their high adhesion strength (frictional force ${\geq}1,200{\mu}m$) and dense columnar microstructures.

• Journal of Korean Society of Environmental Engineers
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• v.22 no.2
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• pp.211-216
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• 2000

In this paper, experimental investigations were carried out to remove NOx, SOx simultaneously from a simulated combustion flue gas [$NO(0.02%)-SO_2(0.08%)-CO_2-Air-N_2$] by using a pulse corona induced plasma chemical processing. Discharge domain of wire-cylindrical plasma reactor was separated from a gas flow duct to avoid unstable discharge by aerosol particle deposited on discharge electrode and grounded electrode. The NOx, SOx removal was experimentally investigated by a reaction induced to ammonium nitrate, ammonium sulfate using a low price of aqueous NaOH solution and a small quantity of ammonia. Volume percentage of aqueous NaOH solution used was 20% and $N_2$ flow rate was $2.5{\ell}/min$ for bubbling aqueous NaOH solution. Ammonia gas(l4.82%) balanced by argon was diluted by air and was introduced to a main simulated flue gas duct through $NH_3$ injection system which was in downstream of reactor. The $NH_3$ molecular ratio(MR) was determined based on [$NH_3$] and [$NO+SO_2$]. MR is 1.5. The NOx removal rates increased in the order of DC, AC and pulse, but SOx removal rates was not significantly effected by source of electricity. The NOx removal rate slightly decreased with increasing initial concentration. but SOx removal rate was not significantly affected by initial concentration. The NOx, SOx removal rates decreased with increasing gas flow rate.

• Journal of Adhesion and Interface
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• v.8 no.3
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• pp.1-8
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• 2007

An atmospheric plasma pre-treatment method was applied to polyurethane foam to improve its contact angle and adhesion. In order to investigate the optimum reaction condition of plasma treatment, type of reaction gas (nitrogen, argon, oxygen, air), rate of gas flow (30~150 mL/min), and reaction time (0~30 sec) were examined in a plate plasma reactor. Also, the effects were compared to those of a conventional vacuum plasma pre-treatment system. The result of the surface modification with respect to the treatment procedure was characterized by using SEM and ATR-FTIR. Due to a decrease of the contact angle of polyurethane foam, the greatest adhesion strength was achieved at a flow rate of 100 mL/min and at a reaction time of 10s for N2 gas. Consequently, the atmospheric plasma treatment reduced the contact angle of the polyurethane foam and also resulted in the improvement of the peel strength.

• Polymer(Korea)
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• v.32 no.5
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• pp.433-439
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• 2008

An atmospheric plasma pre-treatment method was applied to polyurethane foam (density: 0.27) and rubber (butadiene rubber) to improve its contact angle and adhesion using atmospheric plate type reactor. In order to investigate the optimum reaction condition of plasma treatment, type of treatment gas (nitrogen, argon, oxygen, air), rate of gas flow ($30{\sim}100\;mL/min$), and treated time ($0{\sim}30\;s$) were examined in a plate plasma reactor. The result of the surface modification with respect to the treatment procedure was characterized by using SEM and ATR-FTIR. Due to a decrease of the contact angle of various materials, the greatest adhesion strength was achieved at optimum condition such as flow rate of 100 mL/min, reaction time of polyurethane foam 10 s and rubber 3 s for an atmosphere nitrogen gas. Consequently, the atmospheric plasma treatment reduced the wettability of the polyurethane foam and rubber also resulted in the improvement of the adhesion.

• Journal of the Semiconductor & Display Technology
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• v.8 no.1
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• pp.33-38
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• 2009

We have investigated the effect of the ambient gases on the characteristics of AZO thin films for the OLED (organic light emitting diodes) devices. These AZO thin films are deposited by rf-magnetron sputtering under different ambient gases (Ar, Ar+$O_2$, and Ar+$H_2$) at 300. In order to investigate the influences of the oxygen and hydrogen, the flow rate of oxygen and hydrogen in argon mixing gas has been changed from 0.2sccm to 1sccm and from 0.5sccm to 5sccm, respectively. The AZO thin films were preferred oriented to (002) direction regardless of ambient gases. The electrical resistivity of AZO film increased with increasing flow rate of $O_2$ under Ar+$O_2$ while under Ar+$H_2$ atmosphere the electrical resistivity showed minimum value near 1sccm of $H_2$. All the films showed the average transmittance over 80% in the visible range. The OLED device was fabricated with different AZO substrates made by configuration of AZO/$\acute{a}$-NPD/DPVB/$Alq_3$/LiF/Al to elucidate the performance of AZO substrate.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.5
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• pp.451-457
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• 2000

Experimental investigations on the effect of two kinds of additives ; aqueous NaOH solution and ammonia(NH$_3$) for removal of NOx and SO$_2$ simultaneously by corona discharge were carried out. The simulated combustion flue gas was[NO(0.02[%])-SO$_2$(0.08[%])-$CO_2$-Air-$N_2$] Volume percentage of aqueous NaOH solution used was 20[%] and $N_2$flow rate was 2.5[$\ell$/min] for bubbling aqueous NaOH solution Ammonia gas(14.81[%]) balanced by argon was diluted by air. NH$_3$ molecular ratios(MR) based on [NH$_3$] and [NO+SO$_2$] were 1, 1.5 and 2.5 The vapour of aqueous NaOH solution and NH$_3$was introduced to the main simulated combustion flue gas duct through injection systems which were located at downstream of corona discharge reactor. NOx(NO+NO$_2$) removal rate by injecting the vapour of aqueous NaOH solution was much better than that by injecting NH$_3$however SO$_2$removal rate by injecting NH$_3$was much better than that by injecting the vapour of aqueous NaOH SO$_2$removal rate slightly increased with increasing applied voltage. When the vapour of aqueous NaOH solution and NH$_3$were simultaneously injection NOx and SO$_2$ removal rate were significantly increased.

• Bulletin of the Korean Chemical Society
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• v.25 no.1
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• pp.73-78
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• 2004

A highly sensitive detecting method has been developed for determining part per billion of sulfur in $H_2S$/Ar plasma. The method is based on the excitation of Ar/$H_2S\;or\;Ar/H_2S/O_2$ mixture in hollow cathode glow discharge sustained by radiofrequency (RF) or 60 Hz AC power and the spectroscopic measurement of the intensity of emission lines from electronically excited $S_2^*\;or\;SO_2^*$ species, respectively. The RF or AC power needed for the excitation did not exceed 30 W at a gas pressure maintained at several mbar. The emission intensity from the $SO_2^*$ species showed excellent linear response to the sulfur concentration ranging from 5 ppbv, which correspond to S/N = 5, to 500 ppbv. But the intensity from the $S_2^*$ species showed a linear response to the $H_2S$ only at low flow rate under 20 sccm (mL/min) of the sample gas. Separate experiments using $SO_2$ gas as the source of sulfur demonstrated that the presence of $O_2$ in the argon plasma is essential for obtaining prominent $SO_2^*$ emission lines.

• Journal of the Korean Institute of Gas
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• v.27 no.2
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• pp.1-6
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• 2023

PE piping, which has advantages in terms of construction convenience and economy, is widely used for underground burial in the domestic urban gas field. These PE pipes use squeeze-off in many sites to block gas flow during maintenance and repair work. Squeeze-off refers to a method of compressing a PE pipe to block fluid flow, and damage may occur due to the nature of construction in which the pipe is deformed by physical force. In order to prevent damage to PE pipes due to squeeze-off, the main points to be reflected in the squeeze-off operation procedures such as proper compression range, use pressure, and diameter were derived through damage assessment and confidential test according to the compression rate. The compression experiment for PE pipe damage assessment was conducted while changing the compression rate (20%~40%), the pressure of use (2.8 kPa, 25 kPa, 70 kPa), and the pipe diameters (63 mm, 90 mm, 110 mm). As a result of damage assessment according to the compression rate, damage occurred in pipes with compression rates of 45%(110mm) and 73%(63mm), which are for analyzing the effect of excessive compression. In addition, the leakage test was conducted using Ar(argon) during the squeeze-off, and as a result of the experiment, leakage occurred under the conditions of 70kPa and 110mm of pipe. As a result of this study, it was confirmed that squeeze-off for airtightness should be carried out in pipes within a range not exceeding 25 kPa and 90 mm pipes, and the appropriate compression rate to prevent damage to PE pipes is 30%.

• Proceedings of the IEEK Conference
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• 2000.06b
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• pp.282-285
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• 2000

Four helical resonators are distributed in a 2 ${\times}$ 2 array by modifying upper part of the conventional reactive ion etching(RIE) type LCD etcher in order to prepare a large area plasma source. Since the resonance condition of the RF signal to the helical antenna, one RF power supply is used for delivering the power efficiently to all four helical resonators without an impedance matching network Previous work of 2 ${\times}$ 2array inductively coupled plasma(ICP)requires one matching circuit to each ICP antenna for more efficient power deliverly Distributions of ion density and electron temperature are measured in terms of chamber pressure, gas flow rate and RF power . By adjusting the power distribution among the four helical resonator units, argon plasma density of higher than 10$\^$17/㎥ with the uniformity of better than 7％ can be obtained in the 620 ${\times}$ 620$\textrm{mm}^2$ chamber.