• Horticultural Science & Technology
• /
• v.18 no.5
• /
• pp.594-598
• /
• 2000

This study was carried out to investigate the tissue-specific expression of ${\beta}$-glucuronidase (gus) gene driven by endosperm-specific promoter (Z4 promoter) in the transgenic tobacco and to find out inheritance pattern of transgene to the next generation. Tobacco (Nicotiana tabaccum cv. Havana SR1) was transformed with Agrobacterium tumerfaciens LBA4404 harboring BV3 construct containing gus gene driven by Z4 promoter and a kanamycin resistant gene. Seven hundred bp PCR products, indicating the presence of npt II gene, were found in the all eight transformants by PCR analysis using nptII primers. To study the expression pattern of the two different kind of promoters, leaf disks of the Z4pro-gus-transformed plants and 35Spro-gus-transformed plants were analyzed histochemically for gus activity. As a result, leaf disks of Z4pro-gus-transformed plants showed very weak and partial positive gus activity. In contrast, leaf disks of 35Spro-gus-transformed plants showed relatively strong positive gus activity. To investigate the expressed position of Z4 promoter, seeds from Z4pro-gus-transformed plants and 35Spro-gus-transformed plants were analyzed histochemically for gus activity. Z4pro-gus-transformed seeds showed positive gus activity restricted to the endosperm. However, the blue-colored product in 35Spro-gus-transformed seeds was observed in all the area including endosperm. Kanamycin resistance assay showed that transgenes were stably inherited to next generation in all lines.

• Proceedings of the KSME Conference
• /
• 2007.05b
• /
• pp.2021-2025
• /
• 2007

Performance of single cell at solid oxide fuel cell (SOFC) system is largely affected by electrocatalytic and thermal properties of cathode. Samarium-based perovskite oxide material is recently recognized as promising cathode material for intermediate temperature-operating SOFC due to its high electrocatalytic property. Perovskite structured $Sm_{0.5}Sr_{0.5}CoO_{3-\delta}$ and its composite material, $Sm_{0.5}Sr_{0.5}CoO_{3-\delta}/Sm_{0.2}Ce_{0.8}O_{1.9}$ were investigated in terms of area specific resistance (ASR), thermal expansion coefficient (TEC), thermal cycling and long term performance. $Sm_{0.2}Ce_{0.8}O_{1.9}$ was used as electrolyte material. Electrochemical ac impedance spectroscopy (EIS) and dilatometer were used to measure the cathodic properties. Composite cathode ($Sm_{0.5}Sr_{0.5}CoO_{3-\delta}$: $Sm_{0.2}Ce_{0.8}O_{1.9}$ = 6:4) showed a good ASR of 0.13${\Omega}$ $cm^2$ at 650$^{\circ}C$ and its TEC value was 12.3${\times}$10-6/K at 600$^{\circ}C$ which is similar to the value of ceria-based electrolyte of 11.9${\times}$10-6/K. Performance of composite cathode was maintained with no degradation even after 13 times thermal cycle test.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2004.09a
• /
• pp.233-241
• /
• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2004.09a
• /
• pp.211-219
• /
• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Journal of the Korean Ceramic Society
• /
• v.53 no.1
• /
• pp.116-121
• /
• 2016

The amount of carbon dioxide ($CO_2$) released while producing building materials is substantial and has been targeted as a leading contributor to global climate change. One of the most typical methods of reducing $CO_2$ in building materials is the addition of slag and fly ash, like pozzolan material another method is to reduce $CO_2$ production by developing carbon negative cement. MgO-based cement from the low-temperature calcination of magnesite required less energy and emitted less $CO_2$ than the manufacturing of Portland cements. It is also believed that adding reactive MgO to Portland-pozzolan cements can improve their performance and also increase their capacity to absorb atmospheric $CO_2$. In this study, basic research on magnesia cement using $MgCO_3$ and magnesium silicate ore (serpentine) as the main starting materials, as well as blast furnace slag for the mineral admixture, was carried out for industrial waste material recycling. In order to increase the overall hydration activity, $MgCl_2$ was also added. In the case of the addition of $MgCl_2$as accelerating admixture, there was a promoting effect on the compressive strength. This was found to be due to the production of needle-like dense Mg-Cl hydrates. Mgnesia cement has a high viscosity due to its high specific surface area therefore, when the PC-based dispersing agent was added at a level of more than 1.0%, it had the effect of improving fluidity. In particular, the addition of $MgCl_2$ in magnesia cement using $MgCO_3$and magnesium silicate ore (serpentine) as main starting materials led to a lower expansion ratio and an increase in the freeze-thaw resistance finally, the addition of $MgCl_2$ as accelerating admixture led to good overall durability.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
• /
• v.29 no.10
• /
• pp.530-537
• /
• 2017

Scales generated inside pipes cause negative effects on heat transfer performance, pressure loss and flow rate due to increased thermal resistance and reduced flow cross-sectional area. If these scales are not prevented or eliminated, thermal-fluid performance of the facilities can be deteriorated, or in extreme cases, accidents such as explosion due to overheating can occur. There are two ways to remove the scales, physically and chemically. Removing the scales physically needs specific machines which are expensive, and removing them chemically may provoke corrosion or shorten the age of the facilities. In this study, an eco-friendly pipe scale cleaner using natural organic acid is developed by applying the concept of a limestone cave generation. The manufactured scale cleaner is applied to remove the scales in industrial, water heating and urinal pipes. The results show that this cleaner removes scales more effectively and safely compared to existing scale treatments. Scale removal efficiencies of this work is 1.2~10.7 times for industrial pipes and 1.8~15.5 times for boiler water heating pipes higher than those of conventional cleaners.

• Earthquakes and Structures
• /
• v.11 no.2
• /
• pp.327-346
• /
• 2016

The 2012 Emilia (Italy) earthquakes struck a highly industrialized area including several thousands of industrial prefabricated buildings. Due to the lack of specific design and detailing for earthquake resistance, precast reinforced concrete (RC) buildings suffered from severe damages and even partial or total collapses in many cases. The present study reports a data inventory of damages from field survey on prefabricated buildings. The damage database concerns more than 1400 buildings (about 30% of the total precast building stock in the struck region). Making use of the available shakemaps of the two mainshocks, damage distributions were related with distance from the nearest epicentre and corresponding Pseudo-Spectral Acceleration for a period of 1 second (PSA at 1 s) or Peak Ground Acceleration (PGA). It was found that about 90% of the severely damaged to collapsed buildings included into the database stay within 16 km from the epicentre and experienced a PSA larger than 0.12 g. Moreover, 90% of slightly to moderately damaged buildings are located at less than 25 km from the epicentre and were affected by a PSA larger than 0.06 g. Nevertheless, the undamaged buildings examined are almost uniformly distributed over the struck region and 10% of them suffered a PSA not lower than 0.19g. The damage distributions in terms of the maximum experienced PGA show a sudden increase for $PGA{\geq}0.28g$. In this PGA interval, 442 buildings were collected in the database; 55% of them suffered severe damages up to collapse, 32% reported slight to moderate damages, whereas the remaining 13% resulted undamaged.

• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.30 no.4
• /
• pp.123-130
• /
• 2020

Nano seed incorporated in micro-sized 4BS (Tetrabasic lead Sulfate) seed was applied to the positive electrode active material and compared with Nano 4BS seed (NS). The dispersion of NS decreased due to the aggregation phenomenon, while the nano seed incorporated in micro-sized 4BS seed (INS) could confirm excellent dispersion. As the content of INS increased, the particle size of the active material became small and constant, which was confirmed through SEM and particle size analysis. The specific surface area for the reaction was increased and the high-rate discharge and lifetime characteristics were improved. In order to confirm the variation in particle size distribution in the plate manufacturing process, internal resistance and voltage were measured for 200 AGM lead-acid batteries, and it was confirmed that batteries quality variation decreased.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2013.02a
• /
• pp.215-216
• /
• 2013

The silicide is a compound of Si with an electropositive component. Silicides are commonly used in silicon-based microelectronics to reduce resistivity of gate and local interconnect metallization. The popular silicide candidates, CoSi2 and TiSi2, have some limitations. TiSi2 showed line width dependent sheet resistance and has difficulty in transformation of the C49 phase to the low resistive C54. CoSi2 consumes more Si than TiSi2. Nickel silicide is a promising material to substitute for those silicide materials providing several advantages; low resistivity, lower Si consumption and lower formation temperature. Nickel silicide (NiSi) nanowire (NW) has features of a geometrically tiny size in terms of diameter and significantly long directional length, with an excellent electrical conductivity. According to these advantages, NiSi NWs have been applied to various nanoscale applications, such as interconnects [1,2], field emitters [3], and functional microscopy tips [4]. Beside its tiny geometric feature, NW can provide a large surface area at a fixed volume. This makes the material viable for photovoltaic architecture, allowing it to be used to enhance the light-active region [5]. Additionally, a recent report has suggested that an effective antireflection coating-layer can be made with by NiSi NW arrays [6]. A unique growth mechanism of nickel silicide (NiSi) nanowires (NWs) was thermodynamically investigated. The reaction between Ni and Si primarily determines NiSi phases according to the deposition condition. Optimum growth conditions were found at $375^{\circ}C$ leading long and high-density NiSi NWs. The ignition of NiSi NWs is determined by the grain size due to the nucleation limited silicide reaction. A successive Ni diffusion through a silicide layer was traced from a NW grown sample. Otherwise Ni-rich or Si-rich phase induces a film type growth. This work demonstrates specific existence of NiSi NW growth [7].

• Journal of Powder Materials
• /
• v.21 no.1
• /
• pp.55-61
• /
• 2014

Fe-Cr-Al powder porous metal was manufactured by using new electro-spray process. First, ultra-fine fecralloy powders were produced by using the submerged electric wire explosion process. Evenly distributed colloid (0.05~0.5% powders) was dispersed on Polyurethane foam through the electro-spray process. And then degreasing and sintering processes were conduced. In order to examine the effect of cell size ($200{\mu}m$, $450{\mu}m$, $500{\mu}m$) in process, pre-samples were sintered for two hours at temperature of $1450^{\circ}C$, in $H_2$ atmospheres. A 24-hour thermo gravimetric analysis test was conducted at $1000^{\circ}C$ in a 79% $N_2$ + 21% $O_2$ to investigate the high temperature oxidation behavior of powder porous metal. The results of the high temperature oxidation tests showed that oxidation resistance increased with increasing cell size. In the $200{\mu}m$ porous metal with a thinner strut and larger specific surface area, the depletion of the stabilizing elements such as Al and Cr occurred more quickly during the high-temperature oxidation compared with the 450, $500{\mu}m$ porous metals.