• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
• /
• v.16 no.1
• /
• pp.8-12
• /
• 2002

In this paper, we studied a flat fluorescent lamp with high luminance for LCD backlighting. The lamps have simple structures with ITO glass, insulator layer, phosphor layer, electrode layer and gas gap. The firing voltage was decreased with increasing the frequency. It was considered that this tendency was resulted from the space charge effect due to Xe and Ar positive ions trapped in gas gap. Decrease of uniform voltage at higher drive frequency is due to the remaining space charges which are produced by preceding period. As a result, luminance of 2700[cd/m$^2$] and maximum luminous efficiency of 51[m/W] were obtained with luminance uniformity of 96[%] in operation(700[V$\_$rms/], 80[kHz].

• KIEE International Transactions on Electrophysics and Applications
• /
• v.4C no.1
• /
• pp.5-9
• /
• 2004

In this paper, pulsed discharge is used to control the luminous color in gas discharge tubes. The luminous color of the positive column in gas discharge tubes filled with Hg-Ar-Ne (1: 9, 60［Torr］) and having no phosphor material, varies from red to blue emitted by the Ne and Hg from the pulsed discharge. With changing of pulse-width and frequency, the electron temperature in the transient period affects changes to the residual ion and metastable atom densities. The first metastable atoms containing energy levels of about 16.6 ［eV］have a very high probability that a collision will result in the ionization potential of Ar being 15.8 [eV]. The change of locus in the CIE chromaticity diagram with increasing pulse-width and frequency approves the variation of luminous color.

• Journal of the Korean Ceramic Society
• /
• v.40 no.2
• /
• pp.146-152
• /
• 2003

The waste ferrites from magnetic core manufacturing process were used to $CO_2$gas decomposition to avoid the greenhouse effects. The waste ferrites are the mixed powder of Ni-Zn and Mn-Zn ferrites core. In the reduction of ferrites by 5% $H_2/Ar$ mixed gas, the weight loss of ferrites was about 14~16wt%. After the$CO_2$gas decomposition reaction, the weight of the reduced ferrites was increased up to 11wt%.$CO_2$gas was decomposed by oxidation of Fe and FeO in reduced compound and the phase of the waste ferrite was changed to spinel structure. A new technique capable of$CO_2$decomposition as low cost process through utilizing waste ferrite was development.

• Journal of the Korean Vacuum Society
• /
• v.1 no.1
• /
• pp.162-167
• /
• 1992

Tic and TiN layers were deposited on the stainless steel substrate by the reactive RF sputtering. Ar was used for sputtering gas and CzHz and Nz were used for reaction gas. Deposition rate increased linearly to the applied RF power, and decreased as the partial pressure ratio of sputter gas to reactive gas increased. The thin layers were stoichiometric at the partial pressure ratio of 0.03 for Tic and at partial pressure ratio of 0.05 for TiN. The morphologies and structures of the thin layers were investigated by AES, SEM and TEM. In addition, N+ ion was implanted to Tic and the resulting influence on the film and annealing effects were also examined.

• Korean Journal of Materials Research
• /
• v.4 no.2
• /
• pp.152-158
• /
• 1994

Diamondlike carbon thin film have been fabricated using methane as a reactive gas by plasma enhanced chemical vapor deposition. Effects of hydrogen gas on the optical properties of the thin film has been investigated. When the hydrogen was used as a secondary gas, the role of hydrogen changed with deposition power unlike inert gases such as Ar and He. From the changes of optical band gap and FT-IR analysis, it was predicted that the chemical etching, sputtering of C-H bond by hydrogen and the implantation of hydrogen into the thin film could occur. The validity of the possibilities was confirmed by examining the effect of secondary gases such as Ar and He.

• Korean Journal of Materials Research
• /
• v.15 no.8
• /
• pp.548-553
• /
• 2005

Trivalent cerium$(Ce^{3+})$ activated YAG (yttrium aluminum garnet, $Y_3Al_5O_{12})$) thin films phosphor were deposited on quartz glass substrates by rf magnetron sputtering. The effects of sputtering parameters, annealing atmosphere, and substrates on growing behaviors and luminescent properties were investigated. The sputtering parameters were $O_2/(Ar+O_2)$ gas ratio, rf power, and deposition time. XRD (X-ray diffractometery) spectra exhibited that as-deposited films were amorphous, while they were transformed to the crystalline phases by post-annealing. The crystallinity and the atomic ratio strongly depended on the sputtering gas ratio $O_2/(Ar+O_2)$. High quality YAG:Ce thin films could be obtained at the gas ratio of $50\%$ oxygen. After annealing process, PL (Photoluminescence) spectra excited at 450nm showed a yellow single band at 550nm. The films deposited at the sputtering gas ratio of 50% oxygen exhibited the highest PL intensity.

• Korean Journal of Materials Research
• /
• v.12 no.1
• /
• pp.68-74
• /
• 2002

The lead has to be removed for the recycling of copper alloy. The lead cannot be removed from the copper alloy by oxidation. It can be removed by the evaporation because of its high vapor pressure. However, rare information is found on removal of lead from copper alloy. The purpose of present work is to provide a fundamental knowledges on the removal of lead from the copper alloy by evaporation. Gas injection was made in molten copper alloy, and the evaporation rate of lead was measured. The influence of Ar gas flow rata(2~4 L/min), initial contents of lead(2~4wt%Pb), temperature(1200~140$0^{\circ}C$) was investigated based on the thermodynamic and the kinetics. The rate constant is increased with increasing flow rate of Ar and temperature. Though amount of lead removed is increased with higher initial lead concentration, the rate constant is not changed significantly. The activation energy is estimated from the temperature dependence of the rate constant. Also removal of lead from the copper by adding chloride was made for the comparison.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2010.02a
• /
• pp.392-392
• /
• 2010

In this study, high-speed chemical dry thinning process of Si wafer and evolution of surface roughness were investigated. Direct injection of NO gas into the reactor during the supply of F radicals from $NF_3$ remote plasmas was very effective in increasing the Si thinning rate due to the NO-induced enhancement of surface reaction but thinned Si surface became roughened significantly. Addition of Ar gas, together with NO gas, decreased root mean square (RMS) surface roughness of thinned Si wafer significantly. The process regime for the thinning rate enhancement with reduced surface roughness was extended at higher Ar gas flow rate. Si wafer thinning rate as high as $22.8\;{\mu}m/min$ and root-mean-squared (RMS) surface roughness as small as 0.75 nm could be obtained. It is expected that high-speed chemical dry thinning process has possibility of application to ultra-thin Si wafer thinning with no mechanical damage.

• Applied Chemistry for Engineering
• /
• v.18 no.1
• /
• pp.24-28
• /
• 2007

The etching of zinc oxide (ZnO) thin films has been studied using a high density plasma in a $Cl_2/Ar$ gas. The etch characteristics of ZnO thin films were systematically investigated on varying $Cl_2$ concentration, coil rf power, dc-bias voltage, and gas pressure. With increasing $Cl_2$ concentration, the etch rate of ZnO thin film increased, the redeposition around the etched patterns decreased but the sidewall slope of the etched patterns slanted. As the coil rf power and dc-bias voltage increased, the etch rates of ZnO thin films increased and etch profiles of ZnO thin films were improved. With increasing gas pressure, the etch rate of ZnO thin films slightly increased but little change in etch profile was observed. Based on these results, the optimal etching conditions of ZnO thin film were selected. Finally, the etching of ZnO thin films with a high degree of anisotropy of approximately $75^{\circ}{\sim}80^{\circ}$ without the redepositions and residues was successfully achieved at the etching conditions of 20% $Cl_2$ concentration, coil rf power of 1000 W, dc-bias voltage of 400 V, and gas pressure of 5 mTorr.

• Proceedings of the KIEE Conference
• /
• 2001.07c
• /
• pp.1512-1514
• /
• 2001

In this work, PZT thin films were etched as a function of $Cl_2$/Ar and additive $CF_4$ into $Cl_2$(80%)/Ar(20%). The etch rates of PZT films were 1600 $\AA$/min at $Cl_2$(80%)/Ar(20%) gas mixing ratio and 1973 $\AA$/min at 30% additive $CF_4$ into $Cl_2$(80%)/Ar(20%). Therefore the etch rate of PZT in $CF_4/Cl_2/Ar$ plasma is faster than in $Cl_2$/Ar. From XPS and SIMS analysis, metal halides and C-O, FCI and $CClF_2$ were detected. The etching of PZT films in Cl-based plasma is primarily chemically assisted ion etching and the remove of nonvolatile etch byproducts is the dominant step. Consequently, we suggest that the increase of Cl radicals and the volatile oxy-compound such as $CO_y$ are made by adding $CF_4$ into $Cl_2$/Ar plasma. Therefore, the etch rate of PZT in $CF_4/Cl_2/Ar$ plasma is faster than in $Cl_2$/Ar. The etched profile of PZT films was obtained above 70$^{\circ}$ by the SEM micrograph.