• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 1996.05a
• /
• pp.84-89
• /
• 1996

The nucleation and growth of microporosities was observed during the course of annealing treatment of sputter-deposited AgInSbTe thin films. There was a close correlation between the density of microporosity and the sputtering gas pressure in annealed thin films. The void density for a given composition decreased with sputtering gas pressure. It was shown from the present study that the number of porosities decreased while the average porosity size increased as the annealing temperature and holding time increased. The mechanism of porosity formation in the sputter-deposited AgInSbTe thin flus containing Ar-impurity trapped from the Ar-plasma is discussed in the present article.

• Journal of the Korean institute of surface engineering
• /
• v.29 no.6
• /
• pp.857-861
• /
• 1996

The influence of rf-plasma operation on the thin film formation containing small particles for Al-Li alloys mainly have been studied as a function of Ar gas pressure and plasma power by means of a 200kV transmission electron microscope (TEM). Under the non-plasma operation, the transition from continuous thin films to clusters of grape-like small particles occurred at Ar gas pressures above 20Pa. Particles were single crystals with clear crystal habit planes. Under the plasma operation, the influence of gas pressures on the film formation at a plasma power of 5W was also examined. Thin films containing particles below 30Pa and the films containing mainly particles above 40Pa were formed. The prominent change of the average particle size was not recognized. The increase of the plasma powers at 20Pa, which formed particles under non-plasma, suppressed growth of particles, and homogeneous films containing very small particles were fabricated. The electric conductivity showed slight decrease with an increase of plasma power.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2012.02a
• /
• pp.504-504
• /
• 2012

Gas 종류에 따른 플라즈마 제트 장치의 방전 특성을 조사하였다. 고전압 전극으로 내경 0.26 mm, 외경 0.52 mm인 의료용 바늘을 사용하였으며 바늘을 유리관 내부에 삽입하여 4가지 gas를 주입시킨다. Gas의 종류는 Ar, He, Ne, 그리고 $N_2$이다. Ar과 He의 방전 개시 전압은 각 1.2 kV, 1.0 kV이고 보라색 플라즈마가 방출된다. Ne 방전은 방전 개시 전압 시작 시점인 0.3 kV부터 유리관 밖으로 길게 방출 되며 주황색 플라즈마가 방출된다. 특히, Ne gas는 전기적 쇼크가 전혀 없다. $N_2$ gas는 방전개시전압이 2.0 kV로 가장 어려우며 유리관 밖으로 플라즈마 방출되지 않는다. 각 gas 별 스펙트럼의 특성도 파악하여 어떤 gas가 인체 및 생체에 적합한지 파악한다.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2009.10a
• /
• pp.748-751
• /
• 2009

This paper provides a novel scheme to enhance luminous efficiency within Plasma Display Panels (PDPs). The He-Xe or Ne-Xe mixtures are mainly used in conventional PDP cells, where their discharge characteristics exemplify different behavior. Significantly, the excitation efficiency in He-Xe is lower than that of the Ne-Xe mixture. This paper demonstrates that by adding a small quantity of Ar or Kr gas in Ne-Xe mixture increases cell efficiency, while for the He-Xe mixtures their cell efficiency is reduced.

• Journal of the Korean Ceramic Society
• /
• v.40 no.9
• /
• pp.886-890
• /
• 2003

The etching characteristics of a LiNbO$_3$ single crystal have been investigated using helicon wave plasma source with bias power and the mixture of CF$_4$, HBr, SF$_{6}$ gas parameters. The etching rate of LiNbO$_3$ with etching parameters was evaluated by surface profiler. The etching surface was evaluated by Atomic Force Microscopy (AFM). The surface morphology of the etched LiNbO$_3$ changed with bias power and the mixture of CF$_4$/Ar/Cl$_2$, HBr/Ar/Cl$_2$, and SF$_{6}$/Ar/Cl$_2$ parameters. Optimum etching conditions, considering both the surface flatness and etch rate were determined.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.32 no.4
• /
• pp.320-326
• /
• 2019

Recently, the application of atmospheric plasma technology in air filtration is increasing. Sterilization by an atmospheric plasma device is very effective. However, ozone gas, which is generated during atmospheric plasma formation, poses a hazard to human health. To reduce the ozone gas during plasma discharge, we fabricated a one-plate hybrid plasma discharge device with a heating element, which can decompose ozone gas effectively by a simple heating action. In this study, we evaluated the plasma discharge characteristics and ozone concentrations with various Ar flow rates and temperatures. With increasing Ar gas flow rate, the ozone concentration and spectrum intensity increased till an Ar gas flow rate of 60 sccm, and decreased thereafter. When discharged in high temperature, the ozone concentration and spectrum intensity decreased. Further, to evaluate the state of the treated surface under various plasma discharge and heating conditions, we measured the variation in the contact angles on the surface. Regardless of the temperature, the contact angle increased with increasing discharge voltage. However, the contact angle increased when discharged at high temperature.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2011.08a
• /
• pp.232-232
• /
• 2011

투명전도산화물에 대한 연구가 많이 이루어지고 있으며, 최근 Ga이 도핑된 ZnO의 연구가 많이 되고 있다. 투명전도산화물은 태양전지, 평면디스플레이와 같은 다양한 분야에 응용이 가능하다. 본 연구에서는 RF magnetron sputtering을 이용하여 Ar gas 유량 변화에 따른 GZO 박막을 연구하였다. 기판으로는 유리기판을 사용하였으며, 전기적, 광학적, 구조적인 특성을 조사하였다. 박막의 증착시 초기 압력은 $2.0{\times}10^{-6}$Torr 이하로 하였으며, 증착온도는 상온으로 고정하여 증착하였다. 기판은 Corning 1737 유리 기판을 사용하였고, GZO 타겟은 ZnO : Ga 분말이 각각 97 : 3 wt.%로 소결된 타겟을 사용하였다. Ar 유량변수는 20, 40, 60, 80 sccm으로 변화를 주었다. 유리기판에 증착된 모든 GZO박막은 약 200 nm의 두께로 증착되었으며 모든 GZO 박막에서 85%이상의 투과율을 나타내었다. Ar 유량이 적을수록 투과율을 증가하였으며, 광학적 밴드갭 또한 증가하였다. 공정별로 제작된 모든 GZO박막에서 (002)면의 배향성이 관찰되었고, Ar 유량이 적을수록 박막의 결정성은 향상되었다. Hall 측정 결과 Ar 유량이 20 sccm일 때 전기비저항 $3.46{\times}10^{-3}{\Omega}cm$, 전하의 농도 $3.832{\times}10^{-20}\;cm^{-3}$, 이동도 $4.7cm^2V^{-1}s^{-1}$로 전극으로서의 특성을 나타내었다. GZO 박막의 경우 Ar 유량이 적었을 때 결정성이 높아지고, 전극 특성이 더 우수한 것을 확인할 수 있었다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.13 no.3
• /
• pp.183-187
• /
• 2000

In this study the SrBi$_2$Ta$_2$$O_{9}$ (SBT) thin films were etched by using magnetically enhanced inductively coupled Ar/CHF$_3$plasma as function of CHF$_3$/(Ar+CHF$_3$)gas mixing ratio. Maximum etch rate of SBT thin films was 1650 $\AA$/min and the selectivities of SBT to Pt and photoresist(PR) were 1.35 and 0.94 respectively under CHF$_3$/(Ar+CHF$_3$) of 0.1 For study on etching mechanism of SBT thin film X-ray photoelectron spectroscopy (XPS) surface analyses and secondary ion mass spectrometry (SIMS) mass analysis of etched SBT surfaces were performed. Among the elements of SBT thin film. M(Sr, Bi, Ta)-O bonds are broken by Ar ion bombardment and form SrF and TaF$_2$by chemical reaction with F. SrF and TaF$_2$are removed more easily by Ar ion bombardment. Scanning electron microscopy(SEM) was used for the profile examination of etched SBT film and the cross-sectional SEM profile of etched SBT film under CHF$_3$(Ar+CHF$_3$) of 0.1 was about 85$^{\circ}$X>.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2000.11a
• /
• pp.363-366
• /
• 2000

In this study, SrBi$_2$Ta$_2$$O_{9}$ (SBT) thin films were etched at different Cl$_2$gas mixing ratio in Cl$_2$/Ar. The maximum etch rate of SBT was 883 $\AA$/min in Cl$_2$(20%)/Ar(80%). The result indicates that physical sputtering of charged particles is dominant to chemical reaction in etching SBT thin films. To evaluate the changes of morphology and crystallinity on the near surface of etched SBT, atomic force microscopy (AFM) and x-ray diffraction (XRD) were used. The rms values of etched samples in Ar only or Cl$_2$ only plasma were higher than that of as-deposited, Cl$_2$/Ar Plasma. The SBT (105) crystalinity of the etched samples decreased in Af only or Cla only plasma, but maintain constant in ClyAr plasma. This can be illustrated by a decrease of Bi content or nonvolatile etching products (Sr-Cl and Ta-Cl), resulting in the changes of stoichiometry on the etched surface of the SBT thin films. The decrease of Bi content and nonvolatile etch products were revealed by x-ray photoelectron spectroscopy (XPS) and secondary ion mass spectrometry (SIMS).).

• Journal of the Korean Vacuum Society
• /
• v.10 no.2
• /
• pp.189-193
• /
• 2001

We have characterized physical and electrical properties of W-TiN stacked gate electrode structure with TiN as a diffusion barrier of fluorine. As the $N_2/Ar$ gas ratio increased during sputter deposition, TiN thin films became N-rich, and the resistivity of the films increased. However, the resistivity of W-TiN stacked gate reduced as a result of the crystallization of tungsten with the increase of $N_2/Ar$ gas ratio. On the other hand, tungsten in W-TiN stacked gate structure have the (100)-oriented crystalline structure although TiN films were subjected to annealing at high temperature (600~$800^{\circ}C$). Leakage currents of W-TiN gate MOS capacitors were less than $10^{-7}\textrm{/Acm}^2$ and also were lowered by the order of 2 compared with those of pure W gate electrode.